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Two carveout reserved memory nodes each have been added for each of the
C71x DSP for the TI K3 AM69 SK boards. These nodes are assigned to the
respective rproc device nodes as well. The first region will be used as
the DMA pool for the rproc device, and the second region will furnish
the static carveout regions for the firmware memory.
The current carveout addresses and sizes are defined statically for each
device. The C71x DSP processor supports a MMU called CMMU, but is not
currently supported and as such requires the exact memory used by the
firmware to be set-aside.
Signed-off-by: Sinthu Raja <sinthu.raja@ti.com>
Signed-off-by: Apurva Nandan <a-nandan@ti.com>
Reviewed-by: Udit Kumar <u-kumar1@ti.com>
Link: https://lore.kernel.org/r/20231001181417.743306-10-a-nandan@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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Two carveout reserved memory nodes each have been added for each of the
R5F remote processor device within both the MCU and MAIN domains for the
TI K3 AM69 SK boards. These nodes are assigned to the respective rproc
device nodes as well. The first region will be used as the DMA pool for
the rproc device, and the second region will furnish the static carveout
regions for the firmware memory.
The current carveout addresses and sizes are defined statically for each
device. The R5F processors do not have an MMU, and as such require the
exact memory used by the firmwares to be set-aside. The firmware images
do not require any RSC_CARVEOUT entries in their resource tables either
to allocate the memory for firmware memory segments.
Note that the R5F1 carveouts are needed only if the R5F cluster is
running in Split (non-LockStep) mode. The reserved memory nodes can be
disabled later on if there is no use-case defined to use the corresponding
remote processor.
Signed-off-by: Sinthu Raja <sinthu.raja@ti.com>
Signed-off-by: Apurva Nandan <a-nandan@ti.com>
Reviewed-by: Udit Kumar <u-kumar1@ti.com>
Link: https://lore.kernel.org/r/20231001181417.743306-9-a-nandan@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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Two carveout reserved memory nodes each have been added for each of the
C71x DSP for the TI K3 AM68 SK boards. These nodes are assigned to the
respective rproc device nodes as well. The first region will be used as
the DMA pool for the rproc device, and the second region will furnish
the static carveout regions for the firmware memory.
The current carveout addresses and sizes are defined statically for each
device. The C71x DSP processor supports a MMU called CMMU, but is not
currently supported and as such requires the exact memory used by the
firmware to be set-aside.
Signed-off-by: Sinthu Raja <sinthu.raja@ti.com>
Signed-off-by: Apurva Nandan <a-nandan@ti.com>
Reviewed-by: Udit Kumar <u-kumar1@ti.com>
Link: https://lore.kernel.org/r/20231001181417.743306-8-a-nandan@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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Two carveout reserved memory nodes each have been added for each of the
R5F remote processor device within both the MCU and MAIN domains for the
TI K3 AM68 SK boards. These nodes are assigned to the respective rproc
device nodes as well. The first region will be used as the DMA pool for
the rproc device, and the second region will furnish the static carveout
regions for the firmware memory.
The current carveout addresses and sizes are defined statically for each
device. The R5F processors do not have an MMU, and as such require the
exact memory used by the firmwares to be set-aside. The firmware images
do not require any RSC_CARVEOUT entries in their resource tables either
to allocate the memory for firmware memory segments.
Note that the R5F1 carveouts are needed only if the R5F cluster is
running in Split (non-LockStep) mode. The reserved memory nodes can be
disabled later on if there is no use-case defined to use the
corresponding
remote processor.
Signed-off-by: Sinthu Raja <sinthu.raja@ti.com>
Signed-off-by: Apurva Nandan <a-nandan@ti.com>
Reviewed-by: Udit Kumar <u-kumar1@ti.com>
Link: https://lore.kernel.org/r/20231001181417.743306-7-a-nandan@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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Two carveout reserved memory nodes each have been added for each of the
C71x DSP for the TI J721S2 EVM boards. These nodes are assigned to the
respective rproc device nodes as well. The first region will be used as
the DMA pool for the rproc device, and the second region will furnish the
static carveout regions for the firmware memory.
The current carveout addresses and sizes are defined statically for each
device. The C71x DSP processor supports a MMU called CMMU, but is not
currently supported and as such requires the exact memory used by the
firmware to be set-aside.
Signed-off-by: Hari Nagalla <hnagalla@ti.com>
Signed-off-by: Apurva Nandan <a-nandan@ti.com>
Reviewed-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20231001181417.743306-6-a-nandan@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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Two carveout reserved memory nodes each have been added for each of the
R5F remote processor device within both the MCU and MAIN domains for the
TI J721S2 EVM boards. These nodes are assigned to the respective rproc
device nodes as well. The first region will be used as the DMA pool for
the rproc device, and the second region will furnish the static carveout
regions for the firmware memory.
The current carveout addresses and sizes are defined statically for each
device. The R5F processors do not have an MMU, and as such require the
exact memory used by the firmwares to be set-aside. The firmware images
do not require any RSC_CARVEOUT entries in their resource tables either
to allocate the memory for firmware memory segments.
Note that the R5F1 carveouts are needed only if the R5F cluster is running
in Split (non-LockStep) mode. The reserved memory nodes can be disabled
later on if there is no use-case defined to use the corresponding
remote processor.
Signed-off-by: Hari Nagalla <hnagalla@ti.com>
Signed-off-by: Apurva Nandan <a-nandan@ti.com>
Reviewed-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20231001181417.743306-5-a-nandan@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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The K3 J721S2 SoCs have two C71x DSP subsystems in MAIN voltage domain. The
C71x DSPs are 64 bit machine with fixed and floating point DSP operations.
Similar to the R5F remote cores, the inter-processor communication
between the main A72 cores and these DSP cores is achieved through
shared memory and Mailboxes.
The following firmware names are used by default for these DSP cores,
and can be overridden in a board dts file if desired:
MAIN C71_0 : j721s2-c71_0-fw
MAIN C71_1 : j721s2-c71_1-fw
Signed-off-by: Hari Nagalla <hnagalla@ti.com>
Signed-off-by: Apurva Nandan <a-nandan@ti.com>
Reviewed-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20231001181417.743306-4-a-nandan@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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The J721S2 SoCs have 2 dual-core Arm Cortex-R5F processor (R5FSS)
subsystems/clusters in MAIN voltage domain. Each of these can be
configured at boot time to be either run in a LockStep mode or in an
Asymmetric Multi Processing (AMP) fashion in Split-mode. These
subsystems have 64 KB each Tightly-Coupled Memory (TCM) internal
memories for each core split between two banks - ATCM and BTCM
(further interleaved into two banks). The TCMs of both Cores are
combined in LockStep-mode to provide a larger 128 KB of memory, but
otherwise are functionally similar to those on J721E SoCs.
Add the DT nodes for the MAIN domain R5F cluster/subsystems, the two
R5F cores are added as child nodes to each of the R5F cluster nodes.
The clusters are configured to run in LockStep mode by default, with
the ATCMs enabled to allow the R5 cores to execute code from DDR
with boot-strapping code from ATCM. The inter-processor communication
between the main A72 cores and these processors is achieved through
shared memory and Mailboxes.
The following firmware names are used by default for these cores, and
can be overridden in a board dts file if desired:
MAIN R5FSS0 Core0: j721s2-main-r5f0_0-fw (both in LockStep & Split mode)
MAIN R5FSS0 Core1: j721s2-main-r5f0_1-fw (needed only in Split mode)
MAIN R5FSS1 Core0: j721s2-main-r5f1_0-fw (both in LockStep & Split mode)
MAIN R5FSS1 Core1: j721s2-main-r5f1_1-fw (needed only in Split mode)
Signed-off-by: Hari Nagalla <hnagalla@ti.com>
Signed-off-by: Apurva Nandan <a-nandan@ti.com>
Reviewed-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20231001181417.743306-3-a-nandan@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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The J721S2 SoCs have a dual-core Arm Cortex-R5F processor (R5FSS)
subsystems/cluster in MCU voltage domain. It can be configured at boot
time to be either run in a LockStep mode or in an Asymmetric Multi
Processing (AMP) fashion in Split-mode. These subsystems have 64 KB
each Tightly-Coupled Memory (TCM) internal memories for each core
split between two banks - ATCM and BTCM (further interleaved into
two banks). The TCMs of both Cores are combined in LockStep-mode to
provide a larger 128 KB of memory, but otherwise are functionally
similar to those on J721E SoCs.
Add the DT nodes for the MCU domain R5F cluster/subsystem, the two R5F
cores are added as child nodes to each of the R5F cluster nodes. The
clusters are configured to run in LockStep mode by default, with the
ATCMs enabled to allow the R5 cores to execute code from DDR with
boot-strapping code from ATCM. The inter-processor communication between
the main A72 cores and these processors is achieved through shared memory
and Mailboxes.
The following firmware names are used by default for these cores, and
can be overridden in a board dts file if desired:
MCU R5FSS0 Core0: j721s2-mcu-r5f0_0-fw (both in LockStep and Split mode)
MCU R5FSS0 Core1: j721s2-mcu-r5f0_1-fw (needed only in Split mode)
Signed-off-by: Hari Nagalla <hnagalla@ti.com>
Signed-off-by: Apurva Nandan <a-nandan@ti.com>
Reviewed-by: Andrew Davis <afd@ti.com>
Link: https://lore.kernel.org/r/20231001181417.743306-2-a-nandan@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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Currently J721E defines only the main_esm in DTS. Add node for mcu_esm
as well.
According to J721E TRM (12.11.2.2 ESM Environment) [1], we see that the
interrupt line from ESMi (main_esm) is routed to MCU_ESM (mcu_esm). This
is MCU_ESM0_LVL_IN_95 with interrupt ID 95. Configure mcu_esm
accordingly so that errors from main_esm are routed to mcu_esm and
handled.
[1] https://www.ti.com/lit/zip/spruil1
Signed-off-by: Neha Malcom Francis <n-francis@ti.com>
Reviewed-by: Udit Kumar <u-kumar1@ti.com>
Link: https://lore.kernel.org/r/20230926142810.602384-1-n-francis@ti.com
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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Seems like the address value of the reg property was mistyped.
Update reg to 0x9ca00000 to match node's definition.
Fixes: f5a731f0787f ("arm64: dts: ti: Add k3-am625-beagleplay")
Signed-off-by: Wadim Egorov <w.egorov@phytec.de>
Reviewed-by: Nishanth Menon <nm@ti.com>
Link: https://lore.kernel.org/r/20230925151444.1856852-1-w.egorov@phytec.de
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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A TCA9554 GPIO expander is present on I2C0. Add it.
Signed-off-by: Roger Quadros <rogerq@kernel.org>
Link: https://lore.kernel.org/r/20230923080046.5373-3-rogerq@kernel.org
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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Document properly that Ebisu-support includes the Ebisu-4D variant, so
there won't be confusion what happened with support for this board.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20231004152751.3917-1-wsa+renesas@sang-engineering.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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Add initial support for the R-Car S4 Starter Kit with R8A779F4
SoC support. Based on a patch in the BSP.
Signed-off-by: Michael Dege <michael.dege@renesas.com>
Signed-off-by: Yusuke Goda <yusuke.goda.sx@renesas.com>
Signed-off-by: Tam Nguyen <tam.nguyen.xa@renesas.com>
Signed-off-by: Hai Pham <hai.pham.ud@renesas.com>
Co-developed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/87pm1wfn8z.wl-kuninori.morimoto.gx@renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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The R8A779F4 (R-Car S4-8) SoC is an updated version of R8A779F0.
Add support for it, using the r8a779f0 .dtsi internally.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/87r0mcfn95.wl-kuninori.morimoto.gx@renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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Add the initial device tree for the Renesas RZ/G3S SMARC EVK board.
Signed-off-by: Claudiu Beznea <claudiu.beznea.uj@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20230929053915.1530607-28-claudiu.beznea@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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Add the initial device tree for the RZ SMARC Carrier-II. At the moment
it contains only the serial interface.
Signed-off-by: Claudiu Beznea <claudiu.beznea.uj@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20230929053915.1530607-26-claudiu.beznea@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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Add initial support for the RZ/G3S SMARC SoM. The following devices
available on the SoM are added to this initial device tree:
- RZ/G3S SoC: Renesas R9A08G045S33GBG
- Clock Generator (only 24MHz output): Renesas 5L35023B
- 1GiB LPDDR4 SDRAM: Micron MT53D512M16D1DS-046
- 64GB eMMC Flash (though SD ch0): Micron MTFC64GBCAQTC
SD channel 0 of RZ/G3S is connected to an uSD card interface and an
eMMC. The selection b/w them is done through a hardware switch. The DT
will select b/w uSD and eMMC through the SW_SD0_DEV_SEL build flag.
Signed-off-by: Claudiu Beznea <claudiu.beznea.uj@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20230929053915.1530607-25-claudiu.beznea@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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Add the initial DTSI for the RZ/G3S SoC.
The files in this commit have the following meaning:
- r9a08g045.dtsi: RZ/G3S family SoC common parts
- r9a08g045s33.dtsi: RZ/G3S R0A08G045S33 SoC specific parts
Signed-off-by: Claudiu Beznea <claudiu.beznea.uj@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20230929053915.1530607-23-claudiu.beznea@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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Renesas RZ/G3S DT Binding Definitions
Clock definitions for the Renesas RZ/G3S (R9A08G045) SoC, shared by
driver and DT source files.
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disabled
Now that noncoherent dma support for the RZ/Five SoC has been added, enable
the IP blocks which were disabled on the RZ/Five SMARC. This adds
support for the below peripherals:
* Ethernet
* DMAC
* SDHI
* USB
* RSPI
* SSI
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20230929000704.53217-4-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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RZ/Five is a noncoherent SoC so to indicate this add dma-noncoherent
property to RZ/Five SoC DTSI.
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20230929000704.53217-3-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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Add L2 cache node for RZ/Five SoC.
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20230929000704.53217-2-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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Add a device node for the Spansion S29GL512P NOR FLASH on the Bock-W
development board. This FLASH resides in the external address space of
the Local Bus State Controller.
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/45e6343ae07ef1add8bba5e8281ef9e6a977c573.1694768311.git.geert+renesas@glider.be
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Currently audio mclk uses a fixed clk of 11.2896MHz (multiple of 44.1kHz).
Replace this fixed clk with the programmable versa3 clk that can provide
the clocking to support both 44.1kHz (with a clock of 11.2896MHz) and
48kHz (with a clock of 12.2880MHz), based on audio sampling rate for
playback and record.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20230825090518.87394-1-biju.das.jz@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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https://git.kernel.org/pub/scm/linux/kernel/git/clk/linux into renesas-dts-for-v6.7
Adding versa3 clock generator nodes to DTS depends on the fixed clock
index handling:
- Fix the binding for versaclock3 that was introduced this merge window
so we know what the values are for clk consumers
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Add "renesas,s4sk" which targets the Renesas R-Car S4 Starter Kit board.
Signed-off-by: Yusuke Goda <yusuke.goda.sx@renesas.com>
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/87sf6sfn9i.wl-kuninori.morimoto.gx@renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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Document the Renesas SMARC Carrier-II EVK board which is based on the
Renesas RZ/G3S SMARC SoM. The SMARC Carrier-II EVK consists of an
RZ/G3S SoM module and a SMARC Carrier-II carrier board; the SoM module
sits on top of the carrier board.
Signed-off-by: Claudiu Beznea <claudiu.beznea.uj@bp.renesas.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20230929053915.1530607-27-claudiu.beznea@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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Document the Renesas RZ/G3S SMARC SoM board which is based on the
Renesas RZ/G3S (R9A08G045S33) SoC.
Suggested-by: Geert Uytterhoeven <geert@linux-m68k.org>
Signed-off-by: Claudiu Beznea <claudiu.beznea.uj@bp.renesas.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20230929053915.1530607-24-claudiu.beznea@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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Add documentation for the RZ/G3S CPG. The RZ/G3S CPG module is almost
identical to the one available in RZ/G2{L,UL}, the exception being some
core clocks as follows:
- The SD clock is composed of a mux and a divider, and the divider
has some limitations (div = 1 cannot be set if mux rate is 800MHz),
- There are 3 SD clocks,
- The OCTA and TSU clocks are specific to RZ/G3S,
- PLL1/4/6 are specific to RZ/G3S with its own computation formula.
Even with this RZ/G3S could use the same bindings as RZ/G2L.
Along with documentation bindings for the RZ/G3S (R9A08G045) Clock Pulse
Generator (CPG) core clocks, module clocks and resets were added.
Signed-off-by: Claudiu Beznea <claudiu.beznea.uj@bp.renesas.com>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20230929053915.1530607-13-claudiu.beznea@bp.renesas.com
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
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This will allow frequency-scaling for the cpu-cores.
Operating frequencies and voltages have been taken from Rockchip's
downstream kernel.
Signed-off-by: Alex Bee <knaerzche@gmail.com>
Link: https://lore.kernel.org/r/20230829214004.314932-10-knaerzche@gmail.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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For bring-up of the non-boot cpu cores the enable-method for RK3036 can be
re-used.
This adds a (small) chunk of SRAM for execution of the SMP trampoline code
and the respective enable-method property to the cpus.
Signed-off-by: Alex Bee <knaerzche@gmail.com>
Link: https://lore.kernel.org/r/20230829214004.314932-8-knaerzche@gmail.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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In order to support bring-up of the non-boot cores, this patch adds the
reset controls for the cpu cores.
They are required/will be used by the Rockchip platsmp driver.
Signed-off-by: Alex Bee <knaerzche@gmail.com>
Link: https://lore.kernel.org/r/20230829214004.314932-6-knaerzche@gmail.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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RK3128 SoCs have 8KB of SRAM.
Add the respective device tree node for it.
Signed-off-by: Alex Bee <knaerzche@gmail.com>
Link: https://lore.kernel.org/r/20230829214004.314932-4-knaerzche@gmail.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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Edgeble Neu2 IO board Fan connected to PWM11.
Enable the pwm fan for it.
Signed-off-by: Jagan Teki <jagan@edgeble.ai>
Link: https://lore.kernel.org/r/20230731103518.2906147-10-jagan@edgeble.ai
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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Add pwm11 node for Rockchip RV1126.
Signed-off-by: Jagan Teki <jagan@edgeble.ai>
Link: https://lore.kernel.org/r/20230731103518.2906147-6-jagan@edgeble.ai
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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Add pwm11m0 pins for Rockchip RV1126 PWM11.
Signed-off-by: Jagan Teki <jagan@edgeble.ai>
Link: https://lore.kernel.org/r/20230731103518.2906147-5-jagan@edgeble.ai
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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Add PWM2 node for Rockchip RV1126.
Signed-off-by: Jagan Teki <jagan@edgeble.ai>
Link: https://lore.kernel.org/r/20230731103518.2906147-4-jagan@edgeble.ai
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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Add pwm2m0 pins for Rockchip RV1126 PWM2.
Signed-off-by: Jagan Teki <jagan@edgeble.ai>
Link: https://lore.kernel.org/r/20230731103518.2906147-3-jagan@edgeble.ai
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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before
~~~~
0000:00:00.0 PCI bridge: Rockchip Electronics Co., Ltd RK3588 (rev 01)
0002:20:00.0 PCI bridge: Rockchip Electronics Co., Ltd RK3588 (rev 01)
0002:21:00.0 Ethernet controller: Realtek Semiconductor Co., Ltd. RTL8125 2.5GbE Controller (rev 05)
0004:40:00.0 PCI bridge: Rockchip Electronics Co., Ltd RK3588 (rev 01)
0004:41:00.0 Ethernet controller: Realtek Semiconductor Co., Ltd. RTL8125 2.5GbE Controller (rev 05)
after
~~~
0000:00:00.0 PCI bridge: Rockchip Electronics Co., Ltd RK3588 (rev 01)
0002:20:00.0 PCI bridge: Rockchip Electronics Co., Ltd RK3588 (rev 01)
0002:21:00.0 Ethernet controller: Realtek Semiconductor Co., Ltd. RTL8125 2.5GbE Controller (rev 05)
0003:30:00.0 PCI bridge: Rockchip Electronics Co., Ltd RK3588 (rev 01)
0003:31:00.0 Network controller: Realtek Semiconductor Co., Ltd. RTL8822CE 802.11ac PCIe Wireless Network Adapter
0004:40:00.0 PCI bridge: Rockchip Electronics Co., Ltd RK3588 (rev 01)
0004:41:00.0 Ethernet controller: Realtek Semiconductor Co., Ltd. RTL8125 2.5GbE Controller (rev 05)
Signed-off-by: John Clark <inindev@gmail.com>
Link: https://lore.kernel.org/r/20230906012305.7113-1-inindev@gmail.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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Enable SDIO on Radxa ROCK 5 Model B M.2 Key E. Add sdio node and alias as mmc2.
Add regulator for the 3.3 V rail bringing it up during boot. Make sure EKEY_EN
is muxed as GPIO.
Signed-off-by: Tamás Szűcs <tszucs@protonmail.ch>
Reviewed-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Link: https://lore.kernel.org/r/20230924203740.65744-1-tszucs@protonmail.ch
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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Enable PCIe3 support, which is exposed via a PCIe3 connector.
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Link: https://lore.kernel.org/r/20230918141327.131108-3-sebastian.reichel@collabora.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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The RK3588 EVB1 has a second network card, which is connected
via PCIe2. This adds support for that.
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Link: https://lore.kernel.org/r/20230918141327.131108-2-sebastian.reichel@collabora.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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Enable PCIe2_0 controller and its voltage supply, which is routed
to the M.2 E-Key on the upper side of the Radxa Rock 5B.
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Link: https://lore.kernel.org/r/20230918141451.131247-4-sebastian.reichel@collabora.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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The Radxa Rock 5B has PCIe 3x4 routed to its M.2 M-key connector
on the board's back.
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Link: https://lore.kernel.org/r/20230918141451.131247-3-sebastian.reichel@collabora.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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Enable the RTL8125 network controller, which is connected via
PCIe.
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Link: https://lore.kernel.org/r/20230918141451.131247-2-sebastian.reichel@collabora.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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Add ADC support for the Indiedroid Nova, as well as the two ADC buttons
found on the device. The buttons are documented as "boot" and
"recovery". The boot button is used by the bootloader to boot into USB
recovery mode. The recovery button use is currently unknown.
Signed-off-by: Chris Morgan <macromorgan@hotmail.com>
Link: https://lore.kernel.org/r/20230918173255.1325-4-macroalpha82@gmail.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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Enable USB2 (EHCI and OCHI mode) support for the Indiedroid Nova. This
adds support for USB for the 4 full size USB-A ports. Note that USB 3
(the two blue full-size USB-A ports) is still outstanding, as is
support for USB on the USB-C ports. The controller is not yet supported
for these ports.
Signed-off-by: Chris Morgan <macromorgan@hotmail.com>
Link: https://lore.kernel.org/r/20230918173255.1325-3-macroalpha82@gmail.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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Add the necessary nodes to the Indiedroid Nova to activate the PCI
express port that is used by the RTL8111 ethernet controller.
Signed-off-by: Chris Morgan <macromorgan@hotmail.com>
Link: https://lore.kernel.org/r/20230918173255.1325-2-macroalpha82@gmail.com
Signed-off-by: Heiko Stuebner <heiko@sntech.de>
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Keep the DPI to MIPI-DSI bridge disabled in the SoM dtsi file.
The display chain is not wholly described in the device tree file, on
Verdin product family the displays are additional accessories that are
configured/enabled using DT overlays.
With this enabled we have issues when a display is enabled on
TIDSS port1 (LVDS) and port0 (DSI) is not used.
Fixes: 9e77200356ba ("arm64: dts: ti: verdin-am62: Add DSI display support")
Signed-off-by: Francesco Dolcini <francesco.dolcini@toradex.com>
Link: https://lore.kernel.org/r/20230922123003.25002-1-francesco@dolcini.it
Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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