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2022-12-14dt-bindings: thermal: k3-j72xx: elaborate on binding descriptionBryan Brattlof
Elaborate on the function of this device node as well as some of the properties this node uses. Signed-off-by: Bryan Brattlof <bb@ti.com> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221031232702.10339-6-bb@ti.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/k3_j72xx_bandgap: Map fuse_base only for erratum workaroundBryan Brattlof
Some of TI's J721E SoCs require a software trimming procedure for the temperature monitors to function properly. To determine if a particular J721E is not affected by this erratum, both bits in the WKUP_SPARE_FUSE0 region must be set. Other SoCs, not affected by this erratum, will not need this region. Map the 'fuse_base' region only when the erratum fix is needed. Signed-off-by: Bryan Brattlof <bb@ti.com> Link: https://lore.kernel.org/r/20221031232702.10339-5-bb@ti.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/k3_j72xx_bandgap: Remove fuse_base from structureBryan Brattlof
'fuse_base' is only needed during the initial probe function to provide data for a software trimming method for some of TI's devices affected by the i2128 erratum. The devices not affected will not use this region Remove fuse_base from the main k3_j72xx_bandgap structure Signed-off-by: Bryan Brattlof <bb@ti.com> Link: https://lore.kernel.org/r/20221031232702.10339-4-bb@ti.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/k3_j72xx_bandgap: Use bool for i2128 erratum flagBryan Brattlof
Some of TI's J721E SoCs require a software trimming method to report temperatures accurately. Currently we are using a few different data types to indicate when we should apply the erratum. Change the 'workaround_needed' variable's data type to a bool to align with how we are using this variable currently. Signed-off-by: Bryan Brattlof <bb@ti.com> Link: https://lore.kernel.org/r/20221031232702.10339-3-bb@ti.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/k3_j72xx_bandgap: Simplify k3_thermal_get_temp() functionBryan Brattlof
The k3_thermal_get_temp() function can be simplified to return only the result of k3_bgp_read_temp() without needing the 'ret' variable Signed-off-by: Bryan Brattlof <bb@ti.com> Link: https://lore.kernel.org/r/20221031232702.10339-2-bb@ti.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/qcom: Demote error log of thermal zone register to debugManivannan Sadhasivam
devm_thermal_of_zone_register() can fail with -ENODEV if thermal zone for the channel is not represented in DT. This is perfectly fine since not all sensors needs to be used for thermal zones but only a few in real world. So demote the error log to debug to avoid spamming users. Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org> Link: https://lore.kernel.org/r/20221029052933.32421-1-manivannan.sadhasivam@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/qcom/temp-alarm: Fix inaccurate warning for gen2Luca Weiss
On gen2 chips the stage2 threshold is not 140 degC but 125 degC. Make the warning message clearer by using this variable and also by including the temperature that was checked for. Fixes: aa92b3310c55 ("thermal/drivers/qcom-spmi-temp-alarm: Add support for GEN2 rev 1 PMIC peripherals") Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Reviewed-by: Amit Kucheria <amitk@kernel.org> Link: https://lore.kernel.org/r/20221020145237.942146-1-luca.weiss@fairphone.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14dt-bindings: thermal: qcom-tsens: narrow interrupts for SC8280XP, SM6350 and ↵Krzysztof Kozlowski
SM8450 Narrow number of interrupts per variants: SC8280XP, SM6350 and SM8450. The compatibles are already used and described. They only missed the constraints of number of interrupts. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221116113140.69587-1-krzysztof.kozlowski@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/core/power allocator: Remove a useless includeChristophe JAILLET
This file does not use rcu, so there is no point in including <linux/rculist.h>. Remove it. Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr> Reviewed-by: Lukasz Luba <lukasz.luba@arm.com> Link: https://lore.kernel.org/r/9adeec47cb5a8193016272d5c8bf936235c1711d.1669459337.git.christophe.jaillet@wanadoo.fr Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/imx8mm: Add hwmon supportAlexander Stein
Expose thermal sensors as HWMON devices. Signed-off-by: Alexander Stein <alexander.stein@ew.tq-group.com> Link: https://lore.kernel.org/r/20220726122331.323093-1-alexander.stein@ew.tq-group.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal: qcom-spmi-adc-tm5: suppress probe-deferral error messageJohan Hovold
Drivers should not be logging errors on probe deferral. Switch to using dev_err_probe() to log failures when parsing the devicetree to avoid errors like: qcom-spmi-adc-tm5 c440000.spmi:pmic@0:adc-tm@3400: get dt data failed: -517 when a channel is not yet available. Signed-off-by: Johan Hovold <johan+linaro@kernel.org> Reviewed-by: Manivannan Sadhasivam <mani@kernel.org> Reviewed-by: Andrew Halaney <ahalaney@redhat.com> Link: https://lore.kernel.org/r/20221102152630.696-1-johan+linaro@kernel.org Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14dt-bindings: thermal: mediatek: add compatible string for MT7986 and MT7981 SoCDaniel Golle
Document compatible string 'mediatek,mt7986-thermal' for V3 thermal unit found in MT7986 SoCs. 'mediatek,mt7981-thermal' is also added as it is identical with the thermal unit of MT7986. Signed-off-by: Daniel Golle <daniel@makrotopia.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal: ti-soc-thermal: Drop comma after SoC match table sentinelGeert Uytterhoeven
It does not make sense to have a comma after a sentinel, as any new elements must be added before the sentinel. Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be> Acked-by: Keerthy <j-keerthy@ti.com> Link: https://lore.kernel.org/r/1d6de2a80b919cb11199e56ac06ad21c273ebe57.1669045586.git.geert+renesas@glider.be Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/imx: Add support for loading calibration data from OCOTPMarek Vasut
The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with calibration values in OCOTP. Add support for reading the OCOTP calibration data and programming those into the TMU hardware. The MX8MM/MX8MN TMUv1 uses only one OCOTP cell, while MX8MP TMUv2 uses 4, the programming differs in each case. Based on U-Boot commits: 70487ff386c ("imx8mm: Load fuse for TMU TCALIV and TASR") ebb9aab318b ("imx: load calibration parameters from fuse for i.MX8MP") Reviewed-by: Peng Fan <peng.fan@nxp.com> Signed-off-by: Marek Vasut <marex@denx.de> Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14dt-bindings: thermal: imx8mm-thermal: Document optional nvmem-cellsMarek Vasut
The TMU TASR, TCALIVn, TRIM registers must be explicitly programmed with calibration values from OCOTP. Document optional phandle to OCOTP nvmem provider. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Marek Vasut <marex@denx.de> Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/qcom/tsens: Rework debugfs file structureChristian Marangi
The current tsens debugfs structure is composed by: - a tsens dir in debugfs with a version file - a directory for each tsens istance with sensors file to dump all the sensors value. This works on the assumption that we have the same version for each istance but this assumption seems fragile and with more than one tsens istance results in the version file not tracking each of them. A better approach is to just create a subdirectory for each tsens istance and put there version and sensors debugfs file. Using this new implementation results in less code since debugfs entry are created only on successful tsens probe. Signed-off-by: Christian Marangi <ansuelsmth@gmail.com> Link: https://lore.kernel.org/r/20221022125657.22530-4-ansuelsmth@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/qcom/tsens: Fix wrong version id dbg_version_showChristian Marangi
For VER_0 the version was incorrectly reported as 0.1.0. Fix that and correctly report the major version for this old tsens revision. Signed-off-by: Christian Marangi <ansuelsmth@gmail.com> Link: https://lore.kernel.org/r/20221022125657.22530-3-ansuelsmth@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/qcom/tsens: Init debugfs only with successful probeChristian Marangi
Calibrate and tsens_register can fail or PROBE_DEFER. This will cause a double or a wrong init of the debugfs information. Init debugfs only with successful probe fixing warning about directory already present. Signed-off-by: Christian Marangi <ansuelsmth@gmail.com> Acked-by: Thara Gopinath <thara.gopinath@linaro.org> Link: https://lore.kernel.org/r/20221022125657.22530-2-ansuelsmth@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
2022-12-14thermal/drivers/tsens: Add IPQ8074 supportRobert Marko
Qualcomm IPQ8074 uses tsens v2.3 IP, however unlike other tsens v2 IP it only has one IRQ, that is used for up/low as well as critical. It also does not support negative trip temperatures. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220818220245.338396-4-robimarko@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14thermal/drivers/tsens: Allow configuring min and max tripsRobert Marko
IPQ8074 and IPQ6018 dont support negative trip temperatures and support up to 204 degrees C as the max trip temperature. So, instead of always setting the -40 as min and 120 degrees C as max allow it to be configured as part of the features. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220818220245.338396-3-robimarko@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14thermal/drivers/tsens: Add support for combined interruptRobert Marko
Despite using tsens v2.3 IP, IPQ8074 and IPQ6018 only have one IRQ for signaling both up/low and critical trips. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Bjorn Andersson <andersson@kernel.org> Link: https://lore.kernel.org/r/20220818220245.338396-2-robimarko@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14dt-bindings: thermal: tsens: Add ipq8074 compatibleRobert Marko
Qualcomm IPQ8074 has tsens v2.3.0 block, though unlike existing v2 IP it only uses one IRQ, so tsens v2 compatible cannot be used as the fallback. We also have to make sure that correct interrupts are set according to compatibles, so populate interrupt information per compatibles. Signed-off-by: Robert Marko <robimarko@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20220818220245.338396-1-robimarko@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14thermal/of: Fix memory leak on thermal_of_zone_register() failureIdo Schimmel
The function does not free 'of_ops' upon failure, leading to a memory leak [1]. Fix by freeing 'of_ops' in the error path. [1] unreferenced object 0xffff8ee846198c80 (size 128): comm "swapper/0", pid 1, jiffies 4294699704 (age 70.076s) hex dump (first 32 bytes): 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 ................ d0 3f 6e 8c ff ff ff ff 00 00 00 00 00 00 00 00 .?n............. backtrace: [<00000000d136f562>] __kmalloc_node_track_caller+0x42/0x120 [<0000000063f31678>] kmemdup+0x1d/0x40 [<00000000e6d24096>] thermal_of_zone_register+0x49/0x520 [<000000005e78c755>] devm_thermal_of_zone_register+0x54/0x90 [<00000000ee6b209e>] pmbus_add_sensor+0x1b4/0x1d0 [<00000000896105e3>] pmbus_add_sensor_attrs_one+0x123/0x440 [<0000000049e990a6>] pmbus_add_sensor_attrs+0xfe/0x1d0 [<00000000466b5440>] pmbus_do_probe+0x66b/0x14e0 [<0000000084d42285>] i2c_device_probe+0x13b/0x2f0 [<0000000029e2ae74>] really_probe+0xce/0x2c0 [<00000000692df15c>] driver_probe_device+0x19/0xd0 [<00000000547d9cce>] __device_attach_driver+0x6f/0x100 [<0000000020abd24b>] bus_for_each_drv+0x76/0xc0 [<00000000665d9563>] __device_attach+0xfc/0x180 [<000000008ddd4d6a>] bus_probe_device+0x82/0xa0 [<000000009e61132b>] device_add+0x3fe/0x920 Fixes: 3fd6d6e2b4e8 ("thermal/of: Rework the thermal device tree initialization") Signed-off-by: Ido Schimmel <idosch@nvidia.com> Reviewed-by: Vadim Pasternak <vadimp@nvidia.com> Link: https://lore.kernel.org/r/20221020103658.802457-1-idosch@nvidia.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14thermal/drivers/k3_j72xx_bandgap: Fix the debug print messageKeerthy
The debug print message to check the workaround applicability is inverted. Fix the same. Fixes: ffcb2fc86eb7 ("thermal: k3_j72xx_bandgap: Add the bandgap driver support") Reported-by: Bryan Brattlof <bb@ti.com> Signed-off-by: Keerthy <j-keerthy@ti.com> Link: https://lore.kernel.org/r/20221010034126.3550-1-j-keerthy@ti.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14dt-bindings: thermal: Convert generic-adc-thermal to DT schemaRob Herring
Convert the 'generic-adc-thermal' binding to DT schema format. The binding said '#thermal-sensor-cells' should be 1, but all in tree users are 0 and 1 doesn't make sense for a single channel. Drop the example's related providers and consumers of the 'generic-adc-thermal' node as the convention is to not have those in the examples. Signed-off-by: Rob Herring <robh@kernel.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221011175235.3191509-1-robh@kernel.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14thermal/drivers/imx8mm_thermal: Validate temperature rangeMarcus Folkesson
Check against the upper temperature limit (125 degrees C) before consider the temperature valid. Fixes: 5eed800a6811 ("thermal: imx8mm: Add support for i.MX8MM thermal monitoring unit") Signed-off-by: Marcus Folkesson <marcus.folkesson@gmail.com> Reviewed-by: Jacky Bai <ping.bai@nxp.com> Link: https://lore.kernel.org/r/20221014073507.1594844-1-marcus.folkesson@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14thermal/drivers/imx8mm_thermal: Use GENMASK() when appropriateMarcus Folkesson
GENMASK() is preferred to use for bitmasks. Signed-off-by: Marcus Folkesson <marcus.folkesson@gmail.com> Link: https://lore.kernel.org/r/20221014081620.1599511-1-marcus.folkesson@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-14dt-bindings: thermal: tsens: Add sm8450 compatibleLuca Weiss
Document the tsens-v2 compatible for sm8450 SoC. Signed-off-by: Luca Weiss <luca@z3ntu.xyz> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221016090035.565350-5-luca@z3ntu.xyz Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-12-02Merge Intel thermal control drivers changes for v6.2Rafael J. Wysocki
- Add Raptor Lake-S support to the intel_tcc_cooling driver (Zhang Rui). - Make the intel_tcc_cooling driver detect TCC locking (Zhang Rui). - Address Coverity warning in intel_hfi_process_event() (Ricardo Neri). - Prevent accidental clearing of HFI in the package thermal interrupt status (Srinivas Pandruvada). - Protect the clearing of status bits in MSR_IA32_PACKAGE_THERM_STATUS and MSR_IA32_THERM_STATUS (Srinivas Pandruvada). - Allow the HFI interrupt handler to ACK an event for the same timestamp (Srinivas Pandruvada). * thermal-intel: thermal: intel: hfi: ACK HFI for the same timestamp thermal: intel: Protect clearing of thermal status bits thermal: intel: Prevent accidental clearing of HFI status thermal: intel: intel_tcc_cooling: Add TCC cooling support for RaptorLake-S thermal: intel: intel_tcc_cooling: Detect TCC lock bit thermal: intel: hfi: Improve the type of hfi_features::nr_table_pages
2022-11-25thermal: core: fix some possible name leaks in error pathsYang Yingliang
In some error paths before device_register(), the names allocated by dev_set_name() are not freed. Move dev_set_name() front to device_register(), so the name can be freed while calling put_device(). Fixes: 1dd7128b839f ("thermal/core: Fix null pointer dereference in thermal_release()") Signed-off-by: Yang Yingliang <yangyingliang@huawei.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-23thermal: intel: hfi: ACK HFI for the same timestampSrinivas Pandruvada
Some processors issue more than one HFI interrupt with the same timestamp. Each interrupt must be acknowledged to let the hardware issue new HFI interrupts. But this can't be done without some additional flow modification in the existing interrupt handling. For background, the HFI interrupt is a package level thermal interrupt delivered via a LVT. This LVT is common for both the CPU and package level interrupts. Hence, all CPUs receive the HFI interrupts. But only one CPU should process interrupt and others simply exit by issuing EOI to LAPIC. The current HFI interrupt processing flow: 1. Receive Thermal interrupt 2. Check if there is an active HFI status in MSR_IA32_THERM_STATUS 3. Try and get spinlock, one CPU will enter spinlock and others will simply return from here to issue EOI. (Let's assume CPU 4 is processing interrupt) 4. Check the stored time-stamp from the HFI memory time-stamp 5. if same 6. ignore interrupt, unlock and return 7. Copy the HFI message to local buffer 8. unlock spinlock 9. ACK HFI interrupt 10. Queue the message for processing in a work-queue It is tempting to simply acknowledge all the interrupts even if they have the same timestamp. This may cause some interrupts to not be processed. Let's say CPU5 is slightly late and reaches step 4 while CPU4 is between steps 8 and 9. Currently we simply ignore interrupts with the same timestamp. No issue here for CPU5. When CPU4 acknowledges the interrupt, the next HFI interrupt can be delivered. If we acknowledge interrupts with the same timestamp (at step 6), there is a race condition. Under the same scenario, CPU 5 will acknowledge the HFI interrupt. This lets hardware generate another HFI interrupt, before CPU 4 start executing step 9. Once CPU 4 complete step 9, it will acknowledge the newly arrived HFI interrupt, without actually processing it. Acknowledge the interrupt when holding the spinlock. This avoids contention of the interrupt acknowledgment. Updated flow: 1. Receive HFI Thermal interrupt 2. Check if there is an active HFI status in MSR_IA32_THERM_STATUS 3. Try and get spin-lock Let's assume CPU 4 is processing interrupt 4.1 Read MSR_IA32_PACKAGE_THERM_STATUS and check HFI status bit 4.2 If hfi status is 0 4.3 unlock spinlock 4.4 return 4.5 Check the stored time-stamp from the HFI memory time-stamp 5. if same 6.1 ACK HFI Interrupt, 6.2 unlock spinlock 6.3 return 7. Copy the HFI message to local buffer 8. ACK HFI interrupt 9. unlock spinlock 10. Queue the message for processing in a work-queue To avoid taking the lock unnecessarily, intel_hfi_process_event() checks the status of the HFI interrupt before taking the lock. If CPU5 is late, when it starts processing the interrupt there are two scenarios: a) CPU4 acknowledged the HFI interrupt before CPU5 read MSR_IA32_THERM_STATUS. CPU5 exits. b) CPU5 reads MSR_IA32_THERM_STATUS before CPU4 has acknowledged the interrupt. CPU5 will take the lock if CPU4 has released it. It then re-reads MSR_IA32_THERM_STATUS. If there is not a new interrupt, the HFI status bit is clear and CPU5 exits. If a new HFI interrupt was generated it will find that the status bit is set and it will continue to process the interrupt. In this case even if timestamp is not changed, the ACK can be issued as this is a new interrupt. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Reviewed-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com> Tested-by: Arshad, Adeel<adeel.arshad@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-23thermal: intel: Protect clearing of thermal status bitsSrinivas Pandruvada
The clearing of the package thermal status is done by Read-Modify-Write operation. This may result in clearing of some new status bits which are being or about to be processed. For example, while clearing of HFI status, after read of thermal status register, a new thermal status bit is set by the hardware. But during write back, the newly generated status bit will be set to 0 or cleared. So, it is not safe to do read-modify-write. Since thermal status Read-Write bits can be set to only 0 not 1, it is safe to set all other bits to 1 which are not getting cleared. Create a common interface for clearing package thermal status bits. Use this interface to replace existing code to clear thermal package status bits. It is safe to call from different CPUs without protection as there is no read-modify-write. Also wrmsrl results in just single instruction. For example while CPU 0 and CPU 3 are clearing bit 1 and 3 respectively. If CPU 3 wins the race, it will write 0x4000aa2, then CPU 1 will write 0x4000aa8. The bits which are not part of clear are set to 1. The default mask for bits, which can be written here is 0x4000aaa. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Reviewed-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-23thermal: intel: Prevent accidental clearing of HFI statusSrinivas Pandruvada
When there is a package thermal interrupt with PROCHOT log, it will be processed and cleared. It is possible that there is an active HFI event status, which is about to get processed or getting processed. While clearing PROCHOT log bit, it will also clear HFI status bit. This means that hardware is free to update HFI memory. When clearing a package thermal interrupt, some processors will generate a "general protection fault" when any of the read only bit is set to 1. The driver maintains a mask of all read-write bits which can be set. This mask doesn't include HFI status bit. This bit will also be cleared, as it will be assumed read-only bit. So, add HFI status bit 26 to the mask. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Reviewed-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14thermal/core: Protect thermal device operations against thermal device removalGuenter Roeck
Thermal device operations may be called after thermal zone device removal. After thermal zone device removal, thermal zone device operations must no longer be called. To prevent such calls from happening, ensure that the thermal device is registered before executing any thermal device operations. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14thermal/core: Remove thermal_zone_set_trips()Guenter Roeck
Since no callers of thermal_zone_set_trips() are left, remove the function. Document __thermal_zone_set_trips() instead. Explicitly state that the thermal zone lock must be held when calling the function, and that the pointer to the thermal zone must be valid. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14thermal/core: Protect sysfs accesses to thermal operations with thermal zone ↵Guenter Roeck
mutex Protect access to thermal operations against thermal zone removal by acquiring the thermal zone device mutex. After acquiring the mutex, check if the thermal zone device is registered and abort the operation if not. With this change, we can call __thermal_zone_device_update() instead of thermal_zone_device_update() from trip_point_temp_store() and from emul_temp_store(). Similar, we can call __thermal_zone_set_trips() instead of thermal_zone_set_trips() from trip_point_hyst_store(). Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14thermal/core: Protect hwmon accesses to thermal operations with thermal zone ↵Guenter Roeck
mutex In preparation to protecting access to thermal operations against thermal zone device removal, protect hwmon accesses to thermal zone operations with the thermal zone mutex. After acquiring the mutex, ensure that the thermal zone device is registered before proceeding. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14thermal/core: Introduce locked version of thermal_zone_device_updateGuenter Roeck
In thermal_zone_device_set_mode(), the thermal zone mutex is released only to be reacquired in the subsequent call to thermal_zone_device_update(). Introduce __thermal_zone_device_update(), which is similar to thermal_zone_device_update() but has to be called with the thermal device mutex held. Call the new function from thermal_zone_device_set_mode() to avoid the extra thermal device mutex release/acquire sequence in that function. With the new function in place, re-implement thermal_zone_device_update() as wrapper around __thermal_zone_device_update() to acquire and release the thermal device mutex. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14thermal/core: Move parameter validation from __thermal_zone_get_temp to ↵Guenter Roeck
thermal_zone_get_temp All callers of __thermal_zone_get_temp() already validated the thermal zone parameters. Move validation to thermal_zone_get_temp() where it is actually needed. Also add kernel documentation for __thermal_zone_get_temp(), listing the requirement that the function must be called with validated parameters and with thermal device mutex held. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14thermal/core: Ensure that thermal device is registered in thermal_zone_get_tempGuenter Roeck
Calls to thermal_zone_get_temp() are not protected against thermal zone device removal. As result, it is possible that the thermal zone operations callbacks are no longer valid when thermal_zone_get_temp() is called. This may result in crashes such as BUG: unable to handle page fault for address: ffffffffc04ef420 #PF: supervisor read access in kernel mode #PF: error_code(0x0000) - not-present page PGD 5d60e067 P4D 5d60e067 PUD 5d610067 PMD 110197067 PTE 0 Oops: 0000 [#1] PREEMPT SMP NOPTI CPU: 1 PID: 3209 Comm: cat Tainted: G W 5.10.136-19389-g615abc6eb807 #1 02df41ac0b12f3a64f4b34245188d8875bb3bce1 Hardware name: Google Coral/Coral, BIOS Google_Coral.10068.92.0 11/27/2018 RIP: 0010:thermal_zone_get_temp+0x26/0x73 Code: 89 c3 eb d3 0f 1f 44 00 00 55 48 89 e5 41 57 41 56 53 48 85 ff 74 50 48 89 fb 48 81 ff 00 f0 ff ff 77 44 48 8b 83 98 03 00 00 <48> 83 78 10 00 74 36 49 89 f6 4c 8d bb d8 03 00 00 4c 89 ff e8 9f RSP: 0018:ffffb3758138fd38 EFLAGS: 00010287 RAX: ffffffffc04ef410 RBX: ffff98f14d7fb000 RCX: 0000000000000000 RDX: ffff98f17cf90000 RSI: ffffb3758138fd64 RDI: ffff98f14d7fb000 RBP: ffffb3758138fd50 R08: 0000000000001000 R09: ffff98f17cf90000 R10: 0000000000000000 R11: ffffffff8dacad28 R12: 0000000000001000 R13: ffff98f1793a7d80 R14: ffff98f143231708 R15: ffff98f14d7fb018 FS: 00007ec166097800(0000) GS:ffff98f1bbd00000(0000) knlGS:0000000000000000 CS: 0010 DS: 0000 ES: 0000 CR0: 0000000080050033 CR2: ffffffffc04ef420 CR3: 000000010ee9a000 CR4: 00000000003506e0 Call Trace: temp_show+0x31/0x68 dev_attr_show+0x1d/0x4f sysfs_kf_seq_show+0x92/0x107 seq_read_iter+0xf5/0x3f2 vfs_read+0x205/0x379 __x64_sys_read+0x7c/0xe2 do_syscall_64+0x43/0x55 entry_SYSCALL_64_after_hwframe+0x61/0xc6 if a thermal device is removed while accesses to its device attributes are ongoing. The problem is exposed by code in iwl_op_mode_mvm_start(), which registers a thermal zone device only to unregister it shortly afterwards if an unrelated failure is encountered while accessing the hardware. Check if the thermal zone device is registered after acquiring the thermal zone device mutex to ensure this does not happen. The code was tested by triggering the failure in iwl_op_mode_mvm_start() on purpose. Without this patch, the kernel crashes reliably. The crash is no longer observed after applying this and the preceding patches. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14thermal/core: Delete device under thermal device zone lockGuenter Roeck
Thermal device attributes may still be opened after unregistering the thermal zone and deleting the thermal device. Currently there is no protection against accessing thermal device operations after unregistering a thermal zone. To enable adding such protection, protect the device delete operation with the thermal zone device mutex. This requires splitting the call to device_unregister() into its components, device_del() and put_device(). Only the first call can be executed under mutex protection, since put_device() may result in releasing the thermal zone device memory. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-14thermal/core: Destroy thermal zone device mutex in release functionGuenter Roeck
Accesses to thermal zones, and with it the thermal zone device mutex, are still possible after the thermal zone device has been unregistered. For example, thermal_zone_get_temp() can be called from temp_show() in thermal_sysfs.c if the sysfs attribute was opened before the thermal device was unregistered. Move the call to mutex_destroy from thermal_zone_device_unregister() to thermal_release() to ensure that it is only destroyed after it is guaranteed to be no longer accessed. Signed-off-by: Guenter Roeck <linux@roeck-us.net> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-09thermal: intel: intel_tcc_cooling: Add TCC cooling support for RaptorLake-SZhang Rui
Add RaptorLake to the list of processor models supported by the Intel TCC cooling driver. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-11-09thermal: intel: intel_tcc_cooling: Detect TCC lock bitZhang Rui
When MSR_IA32_TEMPERATURE_TARGET is locked, TCC Offset can not be updated even if the PROGRAMMABE Bit is set. Yield the driver on platforms with MSR_IA32_TEMPERATURE_TARGET locked. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-10-28thermal: intel: hfi: Improve the type of hfi_features::nr_table_pagesRicardo Neri
A Coverity static code scan raised a potential overflow_before_widen warning when hfi_features::nr_table_pages is used as an argument to memcpy in intel_hfi_process_event(). Even though the overflow can never happen (the maximum number of pages of the HFI table is 0x10 and 0x10 << PAGE_SHIFT = 0x10000), using size_t as the data type of hfi_features::nr_table_pages makes Coverity happy and matches the data type of the argument 'size' of memcpy(). Signed-off-by: Ricardo Neri <ricardo.neri-calderon@linux.intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-10-28thermal/core: fix error code in __thermal_cooling_device_register()Dan Carpenter
Return an error pointer if ->get_max_state() fails. The current code returns NULL which will cause an oops in the callers. Fixes: c408b3d1d9bb ("thermal: Validate new state in cur_state_store()") Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-10-25thermal: sysfs: Reuse cdev->max_stateViresh Kumar
Now that the cooling device structure stores the max_state value, reuse it and drop max_states from struct cooling_dev_stats. Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-10-25thermal: Validate new state in cur_state_store()Viresh Kumar
In cur_state_store(), the new state of the cooling device is received from user-space and is not validated by the thermal core but the same is left for the individual drivers to take care of. Apart from duplicating the code it leaves possibility for introducing bugs where a driver may not do it right. Lets make the thermal core check the new state itself and store the max value in the cooling device structure. Link: https://lore.kernel.org/all/Y0ltRJRjO7AkawvE@kili/ Reported-by: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-10-23Linux 6.1-rc2v6.1-rc2Linus Torvalds
2022-10-23Merge tag 'for-linus' of git://git.kernel.org/pub/scm/virt/kvm/kvmLinus Torvalds
Pull kvm fixes from Paolo Bonzini: "RISC-V: - Fix compilation without RISCV_ISA_ZICBOM - Fix kvm_riscv_vcpu_timer_pending() for Sstc ARM: - Fix a bug preventing restoring an ITS containing mappings for very large and very sparse device topology - Work around a relocation handling error when compiling the nVHE object with profile optimisation - Fix for stage-2 invalidation holding the VM MMU lock for too long by limiting the walk to the largest block mapping size - Enable stack protection and branch profiling for VHE - Two selftest fixes x86: - add compat implementation for KVM_X86_SET_MSR_FILTER ioctl selftests: - synchronize includes between include/uapi and tools/include/uapi" * tag 'for-linus' of git://git.kernel.org/pub/scm/virt/kvm/kvm: tools: include: sync include/api/linux/kvm.h KVM: x86: Add compat handler for KVM_X86_SET_MSR_FILTER KVM: x86: Copy filter arg outside kvm_vm_ioctl_set_msr_filter() kvm: Add support for arch compat vm ioctls RISC-V: KVM: Fix kvm_riscv_vcpu_timer_pending() for Sstc RISC-V: Fix compilation without RISCV_ISA_ZICBOM KVM: arm64: vgic: Fix exit condition in scan_its_table() KVM: arm64: nvhe: Fix build with profile optimization KVM: selftests: Fix number of pages for memory slot in memslot_modification_stress_test KVM: arm64: selftests: Fix multiple versions of GIC creation KVM: arm64: Enable stack protection and branch profiling for VHE KVM: arm64: Limit stage2_apply_range() batch size to largest block KVM: arm64: Work out supported block level at compile time
generated by cgit (git 2.34.1) at 2025-09-07 17:48:50 +0000