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path: root/drivers/thermal
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2013-04-25thermal: cpu_cooling: update kernel-doc comment for cpufreq_cooling_unregisterEduardo Valentin
Update comments for this exported function. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25thermal: cpu_cooling: update kernel-doc for cpufreq_cooling_registerEduardo Valentin
Add proper documentation for exported function cpufreq_cooling_register. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25thermal: cpu_cooling: update documentation for cpufreq_set_cur_stateEduardo Valentin
Update documentation for cpufreq_set_cur_state callback. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25thermal: cpu_cooling: update documentation for cpufreq_get_cur_stateEduardo Valentin
Update documentation for cpufreq_get_cur_state callback. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25thermal: cpu_cooling: update documentation for cpufreq_get_max_stateEduardo Valentin
Update documentation for cpufreq_get_max_state callback. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25thermal: cpu_cooling: update Kconfig entryEduardo Valentin
There is no support for hotplug or any other means of reducing temperature. So, this patch removes these references from Kconfig. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25thermal: cpu_cooling: update documentation for cpufreq_thermal_notifierEduardo Valentin
Update kernel-doc comment and documentation for cpufreq_thermal_notifier. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25thermal: cpu_cooling: update documentation for cpufreq_apply_coolingEduardo Valentin
Update kernel-doc comments for cpufreq_apply_cooling function. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25thermal: cpu_cooling: improve documentation for get_cpu_frequencyEduardo Valentin
Fix kernel-doc warning on get_cpu_frequency and improve documentation comments. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25thermal: cpu_cooling: document cpufreq_get_cooling_levelEduardo Valentin
Add documentation for cpufreq_get_cooling_level. As this is an exported function, it has to be documented. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25thermal: cpu_cooling: add documentation for get_propertyEduardo Valentin
As this is one of the central functions of this file, it deserves a proper documentation. This patch improves the existing comment to format it as a kernel-doc style. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25thermal: cpu_cooling: fix kernel doc for is_cpufreq_validEduardo Valentin
Update documentation for is_cpufreq_valid function so that kernel-doc does not complain about return value. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25thermal: cpu_cooling: remove compiler warningEduardo Valentin
level will be used only if GET_FREQ mode is requested. There is no potential harm with current code. But for cleaning the compilation log, this patch initializes level to zero. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25thermal: cpu_cooling: use EXPORT_SYMBOL_GPLEduardo Valentin
Restrict the usage to GPL modules. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25thermal: cpu_cooling: fix kernel_doc for cpufreq_cooling_deviceEduardo Valentin
Simple fixes for making kernel_doc happy about struct cpufreq_cooling_device. Includes also a minor spelling fix. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25thermal: cpu_cooling: remove unused headersEduardo Valentin
Remove some unused header files. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25Merge branch 'exynos-fix' of .git into nextZhang Rui
2013-04-24Thermal: exynos: Add compatible string for exynos4412Sachin Kamat
Added compatible string for Exynos4412 SoC. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Cc: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24Thermal: exynos: Add clk_{un}prepare APIsSachin Kamat
clk_{un}prepare APIs are required to migrate to common clock framework. While at it convert to use devm_clk_get as it removes some cleanup code. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Cc: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24Merge branch 'eduardo-1' of .git into nextZhang Rui
2013-04-17Thermal: cpufreq cooling: endian bug in cpufreq_get_max_state()Dan Carpenter
This code doesn't work on big endian systems because we're storing low values in the high bits of the unsigned long. It makes it a very high value instead. Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-15thermal: expose thermal_zone_get_temp APIEduardo Valentin
This patch exports the thermal_zone_get_temp API so that driver writers can fetch temperature of thermal zones managed by other drivers. Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-15thermal: introduce thermal_zone_get_zone_by_name helper functionEduardo Valentin
This patch adds a helper function to get a reference of a thermal zone, based on the zone type name. It will perform a zone name lookup and return a reference to a thermal zone device that matches the name requested. In case the zone is not found or when several zones match same name or if the required parameters are invalid, it will return the corresponding error code (ERR_PTR). Cc: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-15Merge branch 'thermal' of ↵Zhang Rui
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into next Conflicts: drivers/thermal/cpu_cooling.c
2013-04-14Thermal: build cpu_cooling code into thermal_sys moduleZhang Rui
Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14Thermal: build thermal governors into thermal_sys moduleZhang Rui
The thermal governors are part of the thermal framework, rather than a seperate feature/module. Because the generic thermal layer can not work without thermal governors, and it must load the thermal governors during its initialization. Build them into one module in this patch. This also fix a problem that the generic thermal layer does not work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14Thermal: rename thermal_sys.c to thermal_core.cZhang Rui
this is the preparation work to build all the thermal core framework source file, like governors, cpu cooling, etc, into one module. No functional change in this patch. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-12Thermal: exynos: remove unnecessary header inclusionsArnd Bergmann
In multiplatform configurations, we cannot include headers provided by only the exynos platform. Fortunately a number of drivers that include those headers do not actually need them, so we can just remove the inclusions. Signed-off-by: Arnd Bergmann <arnd@arndb.de> Cc: linux-pm@vger.kernel.org Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-12thermal: step_wise: set throttle target within thermal instance limitsAndrew Bresticker
When selecting a target cooling state in get_target_state(), make sure that the state is at least as high as the minimum when the temperature is rising and at least as low as the maximum when the temperature is falling. This is necessary because, in the THREAML_TREND_RAISING and THERMAL_TREND_DROPPING cases, the current state may only be incremented or decremented by one even if it is outside the bounds of the thermal instance. This might occur, for example, if the CPU is heating up and hits a thermal trip point for the first time when it's frequency is much higher than the range specified by the thermal instance corresponding to the trip point. Signed-off-by: Andrew Bresticker <abrestic@chromium.org> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02thermal: add a warning for temperature emulation featureEduardo Valentin
Because this feature is for debuging purposes, it is highly recommended to do not enable this on production systems. This patch adds warnings for system integrators, so that people are aware of this potential security issue. Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02thermal: exynos: Adapt to temperature emulation core thermal frameworkAmit Daniel Kachhap
This removes the driver specific sysfs support of the temperature emulation and uses the newly added core thermal framework for thermal emulation. An exynos platform specific handler is added to support this. In this patch, the exynos senor(tmu) related code and exynos framework related (thermal zone, cooling devices) code are intentionally kept separate. So an emulated function pointer is passed from sensor to framework. This is beneficial in adding more sensor support using the same framework code which is an ongoing work. The goal is to finally split them totally. Even the existing read_temperature also follows the same execution method. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02thermal: rcar: add pm_runtime_xxx() supportKuninori Morimoto
Current rcar_thermal() didn't care about own power. Without this patch, rcar_thermal doesn't work on APE6 board Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02thermal: rcar: tidyup registration failure caseKuninori Morimoto
Current rcar_thermal driver didn't care about rcar_theraml_irq_disable() when registration failure case on _probe(), and _remove(). And, it returns without unregistering thermal zone when registration failure case on _probe(). This patch fixes these issue. Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02thermal: Add driver for Armada 370/XP SoC thermal managementEzequiel Garcia
This driver supports both Armada 370 and Armada XP SoC thermal management controllers. Armada 370 has a register to check a valid temperature, whereas Armada XP does not. Each has a different initialization (i.e. calibration) function. The temperature conversion formula is the same for both. The controller present in each SoC have a very similar feature set, so it corresponds to have one driver to support both of them. Although this driver may present similarities to Dove and Kirkwood thermal driver, the exact differences and coincidences are not fully known. For this reason, support is given through a separate driver. Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26thermal: dove: Fix thermal sensor formulaEzequiel Garcia
The currently formula has been taken from the 88AP510 SoC datasheet, which is not exactly correct. The correct value for the temperature in Celcius of the sensor present in this SoC is: Celsius = (322-reg)/1.3625 Signed-off-by: Lior Amsalem <alior@marvell.com> Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Acked-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26thermal: kirkwood: Fix thermal sensor formulaEzequiel Garcia
The currently formula has been taken from the 88AP510 SoC datasheet, which is not exactly correct. The correct value for the temperature in Celcius of the sensor present in this SoC is: Celsius = (322-reg)/1.3625 Signed-off-by: Lior Amsalem <alior@marvell.com> Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Acked-by: Andrew Lunn <andrew@lunn.ch> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26thermal: kirkwood: Fix valid check for thermal registerEzequiel Garcia
The correct value is obtain by first shifting the register by the offset, later applying the valid mask and finally invert the result. This check was lacking an extra parenthesis to be strictly correct. Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26thermal: db8500: Fix missing mutex_unlock() in probe error pathsAxel Lin
Signed-off-by: Axel Lin <axel.lin@ingics.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26thermal: db8500: Fix checking return value of thermal_zone_device_registerAxel Lin
thermal_zone_device_register() returns ERR_PTR on error, thus use IS_ERR rather than IS_ERR_OR_NULL to check return value. Signed-off-by: Axel Lin <axel.lin@ingics.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26drivers: thermal: cpu_cooling: fix checkpatch warningLaurent Navet [Mali]
- WARNING: Avoid CamelCase: <maskPtr> Signed-off-by: Laurent Navet <laurent.navet@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26Thermal: exynos: fix cooling state translationZhang Rui
Signed-off-by: Zhang Rui <rui.zhang@intel.com> Tested-by: Amit Daniel kachhap <amit.daniel@samsung.com>
2013-03-26Thermal: cpufreq cooling: fix parsing per_cpu cpufreq_frequency_tableZhang Rui
cpufreq cooling uses different frequencies as different cooling states. But the per_cpu cpufreq_frequency_table may contain duplicate, invalid entries, and it may be in either ascending or descending order. And currently, code for parsing the per_cpu cpufreq_frequency_table is used in several places and inconsistent. Now introduce new code to 1. get the maximum cooling states 2. translate cooling state to cpu frequency 3. translate cpu frequency to cooling state in one place, with the correct logic of handling per_cpu cpufreq_frequency_table. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Tested-by: Amit Daniel kachhap <amit.daniel@samsung.com>
2013-03-11thermal: exynos_thermal: return a proper error code while ↵Devendra Naga
thermal_zone_device_register fail. we are returning EINVAL while the thermal_zone_device_register function fail. instead we can use the return value from the thermal_zone_device_register by using PTR_ERR. Signed-off-by: Devendra Naga <devendra.aaru@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-11thermal: rcar_thermal: propagate return value of thermal_zone_device_registerDevendra Naga
thermal_zone_device_register returns a value contained in the pointer itself use PTR_ERR to obtain the address and return it at the end. Signed-off-by: Devendra Naga <devendra.aaru@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-11Thermal: kirkwood: Convert to devm_ioremap_resource()Sachin Kamat
Use the newly introduced devm_ioremap_resource() instead of devm_request_and_ioremap() which provides more consistent error handling. devm_ioremap_resource() provides its own error messages; so all explicit error messages can be removed from the failure code paths. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Cc: Nobuhiro Iwamatsu <iwamatsu@nigauri.org> Reviewed-by: Thierry Reding <thierry.reding@avionic-design.de> Acked-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-11Thermal: rcar: Convert to devm_ioremap_resource()Sachin Kamat
Use the newly introduced devm_ioremap_resource() instead of devm_request_and_ioremap() which provides more consistent error handling. devm_ioremap_resource() provides its own error messages; so all explicit error messages can be removed from the failure code paths. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Cc: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Reviewed-by: Thierry Reding <thierry.reding@avionic-design.de> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-11Thermal: dove: Convert to devm_ioremap_resource()Sachin Kamat
Use the newly introduced devm_ioremap_resource() instead of devm_request_and_ioremap() which provides more consistent error handling. devm_ioremap_resource() provides its own error messages; so all explicit error messages can be removed from the failure code paths. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Cc: Andrew Lunn <andrew@lunn.ch> Reviewed-by: Thierry Reding <thierry.reding@avionic-design.de> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-11thermal: rcar: fix missing unlock on error in rcar_thermal_update_temp()Wei Yongjun
Add the missing unlock before return from function rcar_thermal_update_temp() in the error handling case. Signed-off-by: Wei Yongjun <yongjun_wei@trendmicro.com.cn> Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-28Fix mis-merge of intel_powerclamp.c resulting in compile errorLinus Torvalds
The new intel_powerclamp thermal cooling device driver was merged in commit 2af78448fff6 (Pull thermal management updates from Zhang Rui) without any data conflicts. But there was a more subtle conflict I missed: the driver uses MAX_USER_RT_PRIO, but commit 8bd75c77b7c6 ("sched/rt: Move rt specific bits into new header file") had moved that define from <linux/sched.h> to <linux/sched/rt.h>. Which caused this build failure: drivers/thermal/intel_powerclamp.c: In function ‘clamp_thread’: drivers/thermal/intel_powerclamp.c:360:21: error: ‘MAX_USER_RT_PRIO’ undeclared (first use in this function) drivers/thermal/intel_powerclamp.c:360:21: note: each undeclared identifier is reported only once for each function it appears in And because I don't do a full "make allmodconfig" build after each pull, I didn't notice until too late. So now the fix is here, separately from the merge commit. Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2013-02-28Merge branch 'release' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: "Highlights: - introduction of Dove thermal sensor driver. - introduction of Kirkwood thermal sensor driver. - introduction of intel_powerclamp thermal cooling device driver. - add interrupt and DT support for rcar thermal driver. - add thermal emulation support which allows platform thermal driver to do software/hardware emulation for thermal issues." * 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits) thermal: rcar: remove __devinitconst thermal: return an error on failure to register thermal class Thermal: rename thermal governor Kconfig option to avoid generic naming thermal: exynos: Use the new thermal trend type for quick cooling action. Thermal: exynos: Add support for temperature falling interrupt. Thermal: Dove: Add Themal sensor support for Dove. thermal: Add support for the thermal sensor on Kirkwood SoCs thermal: rcar: add Device Tree support thermal: rcar: remove machine_power_off() from rcar_thermal_notify() thermal: rcar: add interrupt support thermal: rcar: add read/write functions for common/priv data thermal: rcar: multi channel support thermal: rcar: use mutex lock instead of spin lock thermal: rcar: enable CPCTL to use hardware TSC deciding thermal: rcar: use parenthesis on macro Thermal: fix a build warning when CONFIG_THERMAL_EMULATION cleared Thermal: fix a wrong comment thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation PM: intel_powerclamp: off by one in start_power_clamp() thermal: exynos: Miscellaneous fixes to support falling threshold interrupt ...