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2022-07-28thermal/drivers/k3_j72xx_bandgap: Fix ref_table memory leak during probeBryan Brattlof
If an error occurs in the k3_j72xx_bandgap_probe() function the memory allocated to the 'ref_table' will not be released. Add a err_free_ref_table step to the error path to free 'ref_table' Fixes: 72b3fc61c752 ("thermal: k3_j72xx_bandgap: Add the bandgap driver support") Reported-by: kernel test robot <lkp@intel.com> Reported-by: Dan Carpenter <dan.carpenter@oracle.com> Signed-off-by: Bryan Brattlof <bb@ti.com> Reviewed-by: Keerthy <j-keerthy@ti.com> Link: https://lore.kernel.org/r/20220525213617.30002-1-bb@ti.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28thermal/core: Remove DROP_FULL and RAISE_FULLDaniel Lezcano
The trends DROP_FULL and RAISE_FULL are not used and were never used in the past AFAICT. Remove these conditions as they seems to not be handled anywhere. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20220629151012.3115773-2-daniel.lezcano@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28thermal/core: Use clamp() helper in the stepwise governorDaniel Lezcano
The code is actually clampling the next cooling device state using the lowest and highest states of the thermal instance. That code can be replaced by the clamp() macro which does exactly the same. It results in a simpler routine to read. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20220629151012.3115773-1-daniel.lezcano@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28thermal/drivers/u8500: Remove the get_trend functionDaniel Lezcano
The get_trend function relies on the interrupt to set the raising or dropping trend. However the interpolated temperature is already giving the temperature information to the thermal framework which is able to deduce the trend. Remove the trend code. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Linus Walleij <linus.walleij@linaro.org> Link: https://lore.kernel.org/r/20220616202537.303655-3-daniel.lezcano@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28thermal/drivers/tegra: Remove get_trend functionDaniel Lezcano
The get_trend function does already what the generic framework does. Remove it. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Tested-by: Dmitry Osipenko <dmitry.osipenko@collabora.com> Link: https://lore.kernel.org/r/20220616202537.303655-2-daniel.lezcano@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28thermal/drivers/qcom: Remove get_trend functionDaniel Lezcano
There is a get_trend function which is a wrapper to call a private get_trend function. However, this private get_trend function is not assigned anywhere. Remove this dead code. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Amit Kucheria <amitk@kernel.org> Link: https://lore.kernel.org/r/20220616202537.303655-1-daniel.lezcano@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28drivers/thermal/rcar_gen3_thermal: Improve logging during probeWolfram Sang
When setting up a new board, a plain "Can't register thermal zone" didn't help me much because the thermal zones in DT were all fine. I just had a sensor entry too much in the parent TSC node. Reword the failure/success messages to contain the sensor number to make it easier to understand which sensor is affected. Example output now: rcar_gen3_thermal e6198000.thermal: Sensor 0: Loaded 1 trip points rcar_gen3_thermal e6198000.thermal: Sensor 1: Loaded 1 trip points rcar_gen3_thermal e6198000.thermal: Sensor 2: Loaded 1 trip points rcar_gen3_thermal e6198000.thermal: Sensor 3: Can't register thermal zone Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Link: https://lore.kernel.org/r/20220610200500.6727-1-wsa+renesas@sang-engineering.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28drivers/thermal/devfreq_cooling: Extend the devfreq_cooling_device with opsLukasz Luba
Remove unneeded global variable devfreq_cooling_ops which is used only as a copy pattern. Instead, extend the struct devfreq_cooling_device with the needed ops structure. This also simplifies the allocation/free code during the setup/cleanup. Signed-off-by: Lukasz Luba <lukasz.luba@arm.com> Link: https://lore.kernel.org/r/20220613124327.30766-5-lukasz.luba@arm.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28drivers/thermal/cpufreq_cooling: Update outdated commentsLukasz Luba
The code has moved and left some comments stale. Update them where there is a need. Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Lukasz Luba <lukasz.luba@arm.com> Link: https://lore.kernel.org/r/20220613124327.30766-4-lukasz.luba@arm.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28drivers/thermal/cpufreq_cooling : Refactor thermal_power_cpu_get_power tracingLukasz Luba
Simplify the thermal_power_cpu_get_power trace event by removing complicated cpumask and variable length array. Now the tools parsing trace output don't have to hassle to get this power data. The simplified format version uses 'policy->cpu'. Remove also the 'load' information completely since there is very little value of it in this trace event. To get the CPUs' load (or utilization) there are other dedicated trace hooks in the kernel. This patch also simplifies and speeds-up the main cooling code when that trace event is enabled. Rename the trace event to avoid confusion of tools which parse the trace file. Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Lukasz Luba <lukasz.luba@arm.com> Link: https://lore.kernel.org/r/20220613124327.30766-3-lukasz.luba@arm.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28drivers/thermal/cpufreq_cooling: Use private callback ops for each cooling ↵Lukasz Luba
device It is very unlikely that one CPU cluster would have the EM and some other won't have it (because EM registration failed or DT lacks needed entry). Although, we should avoid modifying global variable with callbacks anyway. Redesign this and add safety for such situation. Signed-off-by: Lukasz Luba <lukasz.luba@arm.com> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Link: https://lore.kernel.org/r/20220613124327.30766-2-lukasz.luba@arm.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-28Merge tag 'timers-v5.20-rc1' of ↵Thomas Gleixner
https://git.linaro.org/people/daniel.lezcano/linux into timers/core Pull clockevent/source updates from Daniel Lezcano: - Add the missing DT bindings for the MTU nomadik timer (Linus Walleij) - Fix grammar typo in the ARM global timer Kconfig option (Randy Dunlap) - Add the tegra186 timer and use it on the tegra234 board (Thierry Reding) - Add the 'CPUXGPT' CPU timer for Mediatek MT6795 and implement a workaround to overcome an ATF bug where the timer is not correctly initialized (AngeloGioacchino Del Regno) - Rework the suspend/resume approach to enable the feature on the timer even it is not an active clock and fix a compilation warning (Claudiu Beznea) - Add the Add R-Car Gen4 timer support along with the DT bindings (Wolfram Sang) - Add compatible for ti,am654-timer to support AM6 SoC (Tony Lindgren) - Fix Kconfig option to put it back to 'bool' instead of 'tristate' for the tegra186 (Daniel Lezcano) - Sort 'family,type' DT bindings for the Renesas timers (Geert Uytterhoeven) - Add compatible 'allwinner,sun20i-d1-timer' for Allwinner D1 (Samuel Holland) - Remove unnecessary (void*) conversions for sun4i (XU pengfei) - Remove unnecessary (void*) conversions for sun5i (Li zeming) Link: https://lore.kernel.org/all/7472984e-f502-5f27-82bf-070127dd85a5@linaro.org
2022-07-22intel: thermal: PCH: Drop ACPI_FADT_LOW_POWER_S0 checkRafael J. Wysocki
If ACPI_FADT_LOW_POWER_S0 is not set, this doesn't mean that low-power S0 idle is not usable. It merely means that using S3 on the given system is more beneficial from the energy saving perspective than using low-power S0 idle, as long as S3 is supported. Suspend-to-idle is still a valid suspend mode if ACPI_FADT_LOW_POWER_S0 is not set and the pm_suspend_via_firmware() check in pch_wpt_suspend() is sufficient to distinguish suspend-to-idle from S3, so drop the confusing ACPI_FADT_LOW_POWER_S0 check. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Acked-by: Zhang Rui <rui.zhang@intel.com>
2022-07-16thermal/drivers/rcar_gen3_thermal: Add r8a779f0 supportWolfram Sang
Add support for R-Car S4. Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by: Niklas Söderlund <niklas.soderlund@ragnatech.se> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Link: https://lore.kernel.org/r/20220705195520.2581-1-wsa+renesas@sang-engineering.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-07-15PM: EM: convert power field to micro-Watts precision and align driversLukasz Luba
The milli-Watts precision causes rounding errors while calculating efficiency cost for each OPP. This is especially visible in the 'simple' Energy Model (EM), where the power for each OPP is provided from OPP framework. This can cause some OPPs to be marked inefficient, while using micro-Watts precision that might not happen. Update all EM users which access 'power' field and assume the value is in milli-Watts. Solve also an issue with potential overflow in calculation of energy estimation on 32bit machine. It's needed now since the power value (thus the 'cost' as well) are higher. Example calculation which shows the rounding error and impact: power = 'dyn-power-coeff' * volt_mV * volt_mV * freq_MHz power_a_uW = (100 * 600mW * 600mW * 500MHz) / 10^6 = 18000 power_a_mW = (100 * 600mW * 600mW * 500MHz) / 10^9 = 18 power_b_uW = (100 * 605mW * 605mW * 600MHz) / 10^6 = 21961 power_b_mW = (100 * 605mW * 605mW * 600MHz) / 10^9 = 21 max_freq = 2000MHz cost_a_mW = 18 * 2000MHz/500MHz = 72 cost_a_uW = 18000 * 2000MHz/500MHz = 72000 cost_b_mW = 21 * 2000MHz/600MHz = 70 // <- artificially better cost_b_uW = 21961 * 2000MHz/600MHz = 73203 The 'cost_b_mW' (which is based on old milli-Watts) is misleadingly better that the 'cost_b_uW' (this patch uses micro-Watts) and such would have impact on the 'inefficient OPPs' information in the Cpufreq framework. This patch set removes the rounding issue. Signed-off-by: Lukasz Luba <lukasz.luba@arm.com> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-07-12thermal: intel: x86_pkg_temp_thermal: Drop duplicate 'is' from commentJiang Jian
There is an unexpected word 'is' in a comments that need to be dropped file: ./drivers/thermal/intel/x86_pkg_temp_thermal.c line: 108 * tj-max is is interesting because threshold is set relative to this changed to: * tj-max is interesting because threshold is set relative to this Signed-off-by: Jiang Jian <jiangjian@cdjrlc.com> [ rjw: Subject and changelog edits ] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-07-01Merge tag 'thermal-5.19-rc5' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm Pull thermal control fix from Rafael Wysocki: "Add a new CPU ID to the list of supported processors in the intel_tcc_cooling driver (Sumeet Pawnikar)" * tag 'thermal-5.19-rc5' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: thermal: intel_tcc_cooling: Add TCC cooling support for RaptorLake
2022-06-30thermal: intel_tcc_cooling: Add TCC cooling support for RaptorLakeSumeet Pawnikar
Add RaptorLake to the list of processor models supported by the Intel TCC cooling driver. Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com> [ rjw: Subject edits, new changelog ] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-06-28sched, drivers: Remove max param from effective_cpu_util()/sched_cpu_util()Dietmar Eggemann
effective_cpu_util() already has a `int cpu' parameter which allows to retrieve the CPU capacity scale factor (or maximum CPU capacity) inside this function via an arch_scale_cpu_capacity(cpu). A lot of code calling effective_cpu_util() (or the shim sched_cpu_util()) needs the maximum CPU capacity, i.e. it will call arch_scale_cpu_capacity() already. But not having to pass it into effective_cpu_util() will make the EAS wake-up code easier, especially when the maximum CPU capacity reduced by the thermal pressure is passed through the EAS wake-up functions. Due to the asymmetric CPU capacity support of arm/arm64 architectures, arch_scale_cpu_capacity(int cpu) is a per-CPU variable read access via per_cpu(cpu_scale, cpu) on such a system. On all other architectures it is a a compile-time constant (SCHED_CAPACITY_SCALE). Signed-off-by: Dietmar Eggemann <dietmar.eggemann@arm.com> Signed-off-by: Peter Zijlstra (Intel) <peterz@infradead.org> Acked-by: Vincent Guittot <vincent.guittot@linaro.org> Tested-by: Lukasz Luba <lukasz.luba@arm.com> Link: https://lkml.kernel.org/r/20220621090414.433602-4-vdonnefort@google.com
2022-06-14thermal: Directly use ida_alloc()/free()keliu
Use ida_alloc()/ida_free() instead of deprecated ida_simple_get()/ida_simple_remove() as recommended. Signed-off-by: keliu <liuke94@huawei.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-06-10treewide: Replace GPLv2 boilerplate/reference with SPDX - gpl-2.0_320.RULEThomas Gleixner
Based on the normalized pattern: this program is free software you can redistribute it and/or modify it under the terms of the gnu general public license version 2 as published by the free software foundation this program is distributed as is without any warranty of any kind whether express or implied without even the implied warranty of merchantability or fitness for a particular purpose see the gnu general public license for more details extracted by the scancode license scanner the SPDX license identifier GPL-2.0-only has been chosen to replace the boilerplate/reference. Reviewed-by: Allison Randal <allison@lohutok.net> Signed-off-by: Thomas Gleixner <tglx@linutronix.de> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2022-05-30Merge tag 'thermal-5.19-rc1-2' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm Pull additional thermal control update from Rafael Wysocki: "Add Meteor Lake PCI device ID to the int340x thermal control driver (Sumeet Pawnikar)" * tag 'thermal-5.19-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: thermal: int340x: Add Meteor Lake PCI device ID
2022-05-25thermal: int340x: Add Meteor Lake PCI device IDSumeet Pawnikar
Add Meteor Lake PCI ID for processor thermal device. Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com> Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-05-25ACPI: DPTF: Support Meteor LakeSumeet Pawnikar
Add Meteor Lake ACPI IDs for DPTF devices. Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com> Reviewed-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-05-24Merge tag 'thermal-5.19-rc1' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm Pull thermal control updates from Rafael Wysocki: "These add a thermal library and thermal tools to wrap the netlink interface into event-based callbacks, improve overheat condition handling during suspend-to-idle on Intel SoCs, add some new hardware support, fix bugs and clean up code. Specifics: - Add thermal library and thermal tools to encapsulate the netlink into event based callbacks (Daniel Lezcano, Jiapeng Chong). - Improve overheat condition handling during suspend-to-idle in the Intel PCH thermal driver (Zhang Rui). - Use local ops instead of global ops in devfreq_cooling (Kant Fan). - Clean up _OSC handling in int340x (Davidlohr Bueso). - Switch hisi_termal from CONFIG_PM_SLEEP guards to pm_sleep_ptr() (Hesham Almatary). - Add new k3 j72xx bangdap driver and the corresponding bindings (Keerthy). - Fix missing of_node_put() in the SC iMX driver at probe time (Miaoqian Lin). - Fix memory leak in __thermal_cooling_device_register() when device_register() fails by calling thermal_cooling_device_destroy_sysfs() (Yang Yingliang). - Add sc8180x and sc8280xp compatible string in the DT bindings and lMH support for QCom tsens driver (Bjorn Andersson). - Fix OTP Calibration Register values conforming to the documentation on RZ/G2L and bindings documentation for RZ/G2UL (Biju Das). - Fix type in kerneldoc description for __thermal_bind_params (Corentin Labbe). - Fix potential NULL dereference in sr_thermal_probe() on Broadcom platform (Zheng Yongjun). - Add change mode ops to the thermal-of sensor (Manaf Meethalavalappu Pallikunhi). - Fix non-negative value support by preventing the value to be clamp to zero (Stefan Wahren). - Add compatible string and DT bindings for MSM8960 tsens driver (Dmitry Baryshkov). - Add hwmon support for K3 driver (Massimiliano Minella). - Refactor and add multiple generations support for QCom ADC driver (Jishnu Prakash). - Use platform_get_irq_optional() to get the interrupt on RCar driver and document Document RZ/V2L bindings (Lad Prabhakar). - Remove NULL check after container_of() call from the Intel HFI thermal driver (Haowen Bai)" * tag 'thermal-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (38 commits) thermal: intel: pch: improve the cooling delay log thermal: intel: pch: enhance overheat handling thermal: intel: pch: move cooling delay to suspend_noirq phase PM: wakeup: expose pm_wakeup_pending to modules thermal: k3_j72xx_bandgap: Add the bandgap driver support dt-bindings: thermal: k3-j72xx: Add VTM bindings documentation thermal/drivers/imx_sc_thermal: Fix refcount leak in imx_sc_thermal_probe thermal/core: Fix memory leak in __thermal_cooling_device_register() dt-bindings: thermal: tsens: Add sc8280xp compatible dt-bindings: thermal: lmh: Add Qualcomm sc8180x compatible thermal/drivers/qcom/lmh: Add sc8180x compatible thermal/drivers/rz2gl: Fix OTP Calibration Register values dt-bindings: thermal: rzg2l-thermal: Document RZ/G2UL bindings thermal: thermal_of: fix typo on __thermal_bind_params tools/thermal: remove unneeded semicolon tools/lib/thermal: remove unneeded semicolon thermal/drivers/broadcom: Fix potential NULL dereference in sr_thermal_probe tools/thermal: Add thermal daemon skeleton tools/thermal: Add a temperature capture tool tools/thermal: Add util library ...
2022-05-24Merge tag 'pm-5.19-rc1' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm Pull power management updates from Rafael Wysocki: "These add support for 'artificial' Energy Models in which power numbers for different entities may be in different scales, add support for some new hardware, fix bugs and clean up code in multiple places. Specifics: - Update the Energy Model support code to allow the Energy Model to be artificial, which means that the power values may not be on a uniform scale with other devices providing power information, and update the cpufreq_cooling and devfreq_cooling thermal drivers to support artificial Energy Models (Lukasz Luba). - Make DTPM check the Energy Model type (Lukasz Luba). - Fix policy counter decrementation in cpufreq if Energy Model is in use (Pierre Gondois). - Add CPU-based scaling support to passive devfreq governor (Saravana Kannan, Chanwoo Choi). - Update the rk3399_dmc devfreq driver (Brian Norris). - Export dev_pm_ops instead of suspend() and resume() in the IIO chemical scd30 driver (Jonathan Cameron). - Add namespace variants of EXPORT[_GPL]_SIMPLE_DEV_PM_OPS and PM-runtime counterparts (Jonathan Cameron). - Move symbol exports in the IIO chemical scd30 driver into the IIO_SCD30 namespace (Jonathan Cameron). - Avoid device PM-runtime usage count underflows (Rafael Wysocki). - Allow dynamic debug to control printing of PM messages (David Cohen). - Fix some kernel-doc comments in hibernation code (Yang Li, Haowen Bai). - Preserve ACPI-table override during hibernation (Amadeusz Sławiński). - Improve support for suspend-to-RAM for PSCI OSI mode (Ulf Hansson). - Make Intel RAPL power capping driver support the RaptorLake and AlderLake N processors (Zhang Rui, Sumeet Pawnikar). - Remove redundant store to value after multiply in the RAPL power capping driver (Colin Ian King). - Add AlderLake processor support to the intel_idle driver (Zhang Rui). - Fix regression leading to no genpd governor in the PSCI cpuidle driver and fix the riscv-sbi cpuidle driver to allow a genpd governor to be used (Ulf Hansson). - Fix cpufreq governor clean up code to avoid using kfree() directly to free kobject-based items (Kevin Hao). - Prepare cpufreq for powerpc's asm/prom.h cleanup (Christophe Leroy). - Make intel_pstate notify frequency invariance code when no_turbo is turned on and off (Chen Yu). - Add Sapphire Rapids OOB mode support to intel_pstate (Srinivas Pandruvada). - Make cpufreq avoid unnecessary frequency updates due to mismatch between hardware and the frequency table (Viresh Kumar). - Make remove_cpu_dev_symlink() clear the real_cpus mask to simplify code (Viresh Kumar). - Rearrange cpufreq_offline() and cpufreq_remove_dev() to make the calling convention for some driver callbacks consistent (Rafael Wysocki). - Avoid accessing half-initialized cpufreq policies from the show() and store() sysfs functions (Schspa Shi). - Rearrange cpufreq_offline() to make the calling convention for some driver callbacks consistent (Schspa Shi). - Update CPPC handling in cpufreq (Pierre Gondois). - Extend dev_pm_domain_detach() doc (Krzysztof Kozlowski). - Move genpd's time-accounting to ktime_get_mono_fast_ns() (Ulf Hansson). - Improve the way genpd deals with its governors (Ulf Hansson). - Update the turbostat utility to version 2022.04.16 (Len Brown, Dan Merillat, Sumeet Pawnikar, Zephaniah E. Loss-Cutler-Hull, Chen Yu)" * tag 'pm-5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (94 commits) PM: domains: Trust domain-idle-states from DT to be correct by genpd PM: domains: Measure power-on/off latencies in genpd based on a governor PM: domains: Allocate governor data dynamically based on a genpd governor PM: domains: Clean up some code in pm_genpd_init() and genpd_remove() PM: domains: Fix initialization of genpd's next_wakeup PM: domains: Fixup QoS latency measurements for IRQ safe devices in genpd PM: domains: Measure suspend/resume latencies in genpd based on governor PM: domains: Move the next_wakeup variable into the struct gpd_timing_data PM: domains: Allocate gpd_timing_data dynamically based on governor PM: domains: Skip another warning in irq_safe_dev_in_sleep_domain() PM: domains: Rename irq_safe_dev_in_no_sleep_domain() in genpd PM: domains: Don't check PM_QOS_FLAG_NO_POWER_OFF in genpd PM: domains: Drop redundant code for genpd always-on governor PM: domains: Add GENPD_FLAG_RPM_ALWAYS_ON for the always-on governor powercap: intel_rapl: remove redundant store to value after multiply cpufreq: CPPC: Enable dvfs_possible_from_any_cpu cpufreq: CPPC: Enable fast_switch ACPI: CPPC: Assume no transition latency if no PCCT ACPI: bus: Set CPPC _OSC bits for all and when CPPC_LIB is supported ACPI: CPPC: Check _OSC for flexible address space ...
2022-05-24Merge tag 'hwmon-for-v5.19-rc1' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/groeck/linux-staging Pull hwmon updates from Guenter Roeck: "New drivers: - Driver for the Microchip LAN966x SoC - PMBus driver for Infineon Digital Multi-phase xdp152 family controllers Chip support added to existing drivers: - asus-ec-sensors: - Support for ROG STRIX X570-E GAMING WIFI II, PRIME X470-PRO, and ProArt X570 Creator WIFI - External temperature sensor support for ASUS WS X570-ACE - nct6775: - Support for I2C driver - Support for ASUS PRO H410T / PRIME H410M-R / ROG X570-E GAMING WIFI II - lm75: - Support for - Atmel AT30TS74 - pmbus/max16601: - Support for MAX16602 - aquacomputer_d5next: - Support for Aquacomputer Farbwerk - Support for Aquacomputer Octo - jc42: - Support for S-34TS04A Kernel API changes / clarifications: - The chip parameter of with_info API is now mandatory - New hwmon_device_register_for_thermal API call for use by the thermal subsystem Improvements: - PMBus and JC42 drivers now register with thermal subsystem - PMBus drivers now support get_voltage/set_voltage power operations - The adt7475 driver now supports pin configuration - The lm90 driver now supports setting extended range temperatures configuration with a devicetree property - The dell-smm driver now registers as cooling device - The OCC driver delays hwmon registration until requested by userspace ... and various other minor fixes and improvements" * tag 'hwmon-for-v5.19-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/groeck/linux-staging: (71 commits) hwmon: (aquacomputer_d5next) Fix an error handling path in aqc_probe() hwmon: (sl28cpld) Fix typo in comment hwmon: (pmbus) Check PEC support before reading other registers hwmon: (dimmtemp) Fix bitmap handling hwmon: (lm90) enable extended range according to DTS node dt-bindings: hwmon: lm90: add ti,extended-range-enable property dt-bindings: hwmon: lm90: add missing ti,tmp461 hwmon: (ibmaem) Directly use ida_alloc()/free() hwmon: Directly use ida_alloc()/free() hwmon: (asus-ec-sensors) fix Formula VIII definition dt-bindings: trivial-devices: Add xdp152 hwmon: (sl28cpld-hwmon) Use HWMON_CHANNEL_INFO macro hwmon: (pwm-fan) Use HWMON_CHANNEL_INFO macro hwmon: (peci/dimmtemp) Use HWMON_CHANNEL_INFO macro hwmon: (peci/cputemp) Use HWMON_CHANNEL_INFO macro hwmon: (mr75203) Use HWMON_CHANNEL_INFO macro hwmon: (ltc2992) Use HWMON_CHANNEL_INFO macro hwmon: (as370-hwmon) Use HWMON_CHANNEL_INFO macro hwmon: Make chip parameter for with_info API mandatory thermal/drivers/thermal_hwmon: Use hwmon_device_register_for_thermal() ...
2022-05-23Merge branches 'thermal-int340x', 'thermal-pch' and 'thermal-misc'Rafael J. Wysocki
Merge int340x thermal driver updates, PCH thermal driver updates and miscellaneous thermal control updates for 5.19-rc1: - Clean up _OSC handling in int340x (Davidlohr Bueso). - Improve overheat condition handling during suspend-to-idle in the Intel PCH thermal driver (Zhang Rui). - Use local ops instead of global ops in devfreq_cooling (Kant Fan). - Switch hisi_termal from CONFIG_PM_SLEEP guards to pm_sleep_ptr() (Hesham Almatary) * thermal-int340x: thermal: int340x: Clean up _OSC context init thermal: int340x: Consolidate freeing of acpi_buffer pointer thermal: int340x: Clean up unnecessary acpi_buffer pointer freeing * thermal-pch: thermal: intel: pch: improve the cooling delay log thermal: intel: pch: enhance overheat handling thermal: intel: pch: move cooling delay to suspend_noirq phase PM: wakeup: expose pm_wakeup_pending to modules * thermal-misc: thermal: devfreq_cooling: use local ops instead of global ops thermal: hisi_termal: Switch from CONFIG_PM_SLEEP guards to pm_sleep_ptr()
2022-05-23Merge back earlier thermal control updates for 5.19-rc1.Rafael J. Wysocki
2022-05-23Merge branches 'pm-em' and 'pm-cpuidle'Rafael J. Wysocki
Marge Energy Model support updates and cpuidle updates for 5.19-rc1: - Update the Energy Model support code to allow the Energy Model to be artificial, which means that the power values may not be on a uniform scale with other devices providing power information, and update the cpufreq_cooling and devfreq_cooling thermal drivers to support artificial Energy Models (Lukasz Luba). - Make DTPM check the Energy Model type (Lukasz Luba). - Fix policy counter decrementation in cpufreq if Energy Model is in use (Pierre Gondois). - Add AlderLake processor support to the intel_idle driver (Zhang Rui). - Fix regression leading to no genpd governor in the PSCI cpuidle driver and fix the riscv-sbi cpuidle driver to allow a genpd governor to be used (Ulf Hansson). * pm-em: PM: EM: Decrement policy counter powercap: DTPM: Check for Energy Model type thermal: cooling: Check Energy Model type in cpufreq_cooling and devfreq_cooling Documentation: EM: Add artificial EM registration description PM: EM: Remove old debugfs files and print all 'flags' PM: EM: Change the order of arguments in the .active_power() callback PM: EM: Use the new .get_cost() callback while registering EM PM: EM: Add artificial EM flag PM: EM: Add .get_cost() callback * pm-cpuidle: cpuidle: riscv-sbi: Fix code to allow a genpd governor to be used cpuidle: psci: Fix regression leading to no genpd governor intel_idle: Add AlderLake support
2022-05-22thermal/drivers/thermal_hwmon: Use hwmon_device_register_for_thermal()Guenter Roeck
The thermal subsystem registers a hwmon device without providing chip information or sysfs attribute groups. While undesirable, it would be difficult to change. On the other side, it abuses the hwmon_device_register_with_info API by not providing that information. Use new API specifically created for the thermal subsystem instead to let us enforce the 'chip' parameter for other callers of hwmon_device_register_with_info(). Acked-by: Rafael J . Wysocki <rafael@kernel.org> Signed-off-by: Guenter Roeck <linux@roeck-us.net>
2022-05-19thermal: intel: pch: improve the cooling delay logZhang Rui
Previously, during suspend, intel_pch_thermal driver logs for every cooling iteration, about the current PCH temperature and number of cooling iterations that have been tried, like below [ 100.955526] intel_pch_thermal 0000:00:14.2: CPU-PCH current temp [53C] higher than the threshold temp [50C], sleep 1 times for 100 ms duration [ 101.064156] intel_pch_thermal 0000:00:14.2: CPU-PCH current temp [53C] higher than the threshold temp [50C], sleep 2 times for 100 ms duration After changing the default delay_cnt to 600, in practice, it is common to see tens of the above messages if the system is suspended when PCH overheats. Thus, change this log message from dev_warn to dev_dbg because it is only useful when we want to check the temperature trend. At the same time, there is always a one-line message given by the driver with the patch applied, with below four possibilities. 1. PCH is cool, no cooling delay needed [ 1791.902853] intel_pch_thermal 0000:00:12.0: CPU-PCH is cool [48C] 2. PCH overheats and becomes cool after the cooling delays [ 1475.511617] intel_pch_thermal 0000:00:12.0: CPU-PCH is cool [49C] after 30700 ms delay 3. PCH still overheats after the overall cooling timeout [ 2250.157487] intel_pch_thermal 0000:00:12.0: CPU-PCH is hot [60C] after 60000 ms delay. S0ix might fail 4. PCH aborts cooling because of wakeup event detected during the delay [ 1933.639509] intel_pch_thermal 0000:00:12.0: Wakeup event detected, abort cooling Signed-off-by: Zhang Rui <rui.zhang@intel.com> Tested-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-05-19thermal: intel: pch: enhance overheat handlingZhang Rui
Commit ef63b043ac86 ("thermal: intel: pch: fix S0ix failure due to PCH temperature above threshold") introduces delay loop mechanism that allows PCH temperature to go down below threshold during suspend so it won't block S0ix. And the default overall delay timeout is 1 second. However, in practice, we found that the time it takes to cool the PCH down below threshold highly depends on the initial PCH temperature when the delay starts, as well as the ambient temperature. And in some cases, the 1 second delay is not sufficient. As a result, the system stays in a shallower power state like PCx instead of S0ix, and drains the battery power, without user' notice. To make sure S0ix is not blocked by the PCH overheating, we 1. expand the default overall timeout to 60 seconds. 2. make sure the temperature is below threshold rather than equal to it. At the same time, as the cooling delay can be much longer and many wakeup events (ACPI Power Button press, USB mouse move, etc) becomes valid in the suspend_noirq phase, add detection of wakeup event so that the driver does not delay blindly when the system suspend is likely to abort soon. This patch may introduce longer suspend time, but only in the cases when the system overheats and Linux used to enter a shallower S2idle state, say, PCx instead of S0ix. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Tested-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-05-19thermal: intel: pch: move cooling delay to suspend_noirq phaseZhang Rui
Move the PCH Thermal driver suspend callback to suspend_noirq to do cooling while the system is more quiescent. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Tested-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-05-19thermal: k3_j72xx_bandgap: Add the bandgap driver supportKeerthy
Add VTM thermal support. In the Voltage Thermal Management Module(VTM), K3 J72XX supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. Currently reading temperatures only is supported. There are no active/passive cooling agent supported. J721e SoCs have errata i2128: https://www.ti.com/lit/pdf/sprz455 The VTM Temperature Monitors (TEMPSENSORs) are trimmed during production, with the resulting values stored in software-readable registers. Software should use these register values when translating the Temperature Monitor output codes to temperature values. It has an involved workaround. Software needs to read the error codes for -40C, 30C, 125C from the efuse for each device & derive a new look up table for adc to temperature conversion. Involved calculating slopes & constants using 3 different straight line equations with adc refernce codes as the y-axis & error codes in the x-axis. -40C to 30C 30C to 125C 125C to 150C With the above 2 line equations we derive the full look-up table to workaround the errata i2128 for j721e SoC. Tested temperature reading on J721e SoC & J7200 SoC. [daniel.lezcano@linaro.org: Generate look-up tables run-time] Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Keerthy <j-keerthy@ti.com> Link: https://lore.kernel.org/r/20220517172920.10857-3-j-keerthy@ti.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19thermal/drivers/imx_sc_thermal: Fix refcount leak in imx_sc_thermal_probeMiaoqian Lin
of_find_node_by_name() returns a node pointer with refcount incremented, we should use of_node_put() on it when done. Add missing of_node_put() to avoid refcount leak. Fixes: e20db70dba1c ("thermal: imx_sc: add i.MX system controller thermal support") Signed-off-by: Miaoqian Lin <linmq006@gmail.com> Link: https://lore.kernel.org/r/20220517055121.18092-1-linmq006@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19thermal/core: Fix memory leak in __thermal_cooling_device_register()Yang Yingliang
I got memory leak as follows when doing fault injection test: unreferenced object 0xffff888010080000 (size 264312): comm "182", pid 102533, jiffies 4296434960 (age 10.100s) hex dump (first 32 bytes): 00 00 00 00 ad 4e ad de ff ff ff ff 00 00 00 00 .....N.......... ff ff ff ff ff ff ff ff 40 7f 1f b9 ff ff ff ff ........@....... backtrace: [<0000000038b2f4fc>] kmalloc_order_trace+0x1d/0x110 mm/slab_common.c:969 [<00000000ebcb8da5>] __kmalloc+0x373/0x420 include/linux/slab.h:510 [<0000000084137f13>] thermal_cooling_device_setup_sysfs+0x15d/0x2d0 include/linux/slab.h:586 [<00000000352b8755>] __thermal_cooling_device_register+0x332/0xa60 drivers/thermal/thermal_core.c:927 [<00000000fb9f331b>] devm_thermal_of_cooling_device_register+0x6b/0xf0 drivers/thermal/thermal_core.c:1041 [<000000009b8012d2>] max6650_probe.cold+0x557/0x6aa drivers/hwmon/max6650.c:211 [<00000000da0b7e04>] i2c_device_probe+0x472/0xac0 drivers/i2c/i2c-core-base.c:561 If device_register() fails, thermal_cooling_device_destroy_sysfs() need be called to free the memory allocated in thermal_cooling_device_setup_sysfs(). Fixes: 8ea229511e06 ("thermal: Add cooling device's statistics in sysfs") Reported-by: Hulk Robot <hulkci@huawei.com> Signed-off-by: Yang Yingliang <yangyingliang@huawei.com> Link: https://lore.kernel.org/r/20220511020605.3096734-1-yangyingliang@huawei.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19thermal/drivers/qcom/lmh: Add sc8180x compatibleBjorn Andersson
The LMh instances in the Qualcomm SC8180X platform looks to behave similar to those in SM8150, add additional compatibles to allow platform specific behavior to be added if needed. Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220502164504.3972938-1-bjorn.andersson@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19thermal/drivers/rz2gl: Fix OTP Calibration Register valuesBiju Das
As per the latest RZ/G2L Hardware User's Manual (Rev.1.10 Apr, 2022), the bit 31 of TSU OTP Calibration Register(OTPTSUTRIM) indicates whether bit [11:0] of OTPTSUTRIM is valid or invalid. This patch updates the code to reflect this change. Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Link: https://lore.kernel.org/r/20220428093346.7552-1-biju.das.jz@bp.renesas.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19thermal: thermal_of: fix typo on __thermal_bind_paramsCorentin Labbe
Add a missing s to __thermal_bind_param kernel doc comment. This fixes the following sparse warnings: drivers/thermal/thermal_of.c:50: warning: expecting prototype for struct __thermal_bind_param. Prototype was for struct __thermal_bind_params instead Signed-off-by: Corentin Labbe <clabbe@baylibre.com> Link: https://lore.kernel.org/r/20220426064113.3787826-1-clabbe@baylibre.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19thermal/drivers/broadcom: Fix potential NULL dereference in sr_thermal_probeZheng Yongjun
platform_get_resource() may return NULL, add proper check to avoid potential NULL dereferencing. Fixes: 250e211057c72 ("thermal: broadcom: Add Stingray thermal driver") Signed-off-by: Zheng Yongjun <zhengyongjun3@huawei.com> Link: https://lore.kernel.org/r/20220425092929.90412-1-zhengyongjun3@huawei.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19thermal/drivers/thermal_of: Add change_mode ops support for thermal_of sensorManaf Meethalavalappu Pallikunhi
The sensor driver which register through thermal_of interface doesn't have an option to get thermal zone mode change notification from thermal core. Add support for change_mode ops in thermal_of interface so that sensor driver can use this ops for mode change notification. Signed-off-by: Manaf Meethalavalappu Pallikunhi <quic_manafm@quicinc.com> Link: https://lore.kernel.org/r/1646767586-31908-1-git-send-email-quic_manafm@quicinc.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19thermal/drivers/bcm2711: Don't clamp temperature at zeroStefan Wahren
The thermal sensor on BCM2711 is capable of negative temperatures, so don't clamp the measurements at zero. Since this was the only use for variable t, drop it. This change based on a patch by Dom Cobley, who also tested the fix. Fixes: 59b781352dc4 ("thermal: Add BCM2711 thermal driver") Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com> Acked-by: Florian Fainelli <f.fainelli@gmail.com> Link: https://lore.kernel.org/r/20220412195423.104511-1-stefan.wahren@i2se.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19thermal/drivers/tsens: Add compat string for the qcom,msm8960Dmitry Baryshkov
On apq8064 (msm8960) platforms the tsens device is created manually by the gcc driver. Prepare the tsens driver for the qcom,msm8960-tsens device instantiated from the device tree. Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20220406002648.393486-3-dmitry.baryshkov@linaro.org Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19thermal/drivers/k3: Add hwmon supportMassimiliano Minella
Expose the thermal sensors on K3 AM654 as hwmon devices, so that temperatures could be read using lm-sensors. Signed-off-by: Massimiliano Minella <massimiliano.minella@gmail.com> Link: https://lore.kernel.org/r/20220401151656.913166-1-massimiliano.minella@se.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19thermal/drivers/qcom: Add support for PMIC5 Gen2 ADCTMJishnu Prakash
Add support for PMIC5 Gen2 ADC_TM, used on PMIC7 chips. It is a close counterpart of PMIC7 ADC and has the same functionality as PMIC5 ADC_TM, for threshold monitoring and interrupt generation. It is present on PMK8350 alone, like PMIC7 ADC and can be used to monitor up to 8 ADC channels, from any of the PMIC7 PMICs having ADC on a target, through PBS(Programmable Boot Sequence). Signed-off-by: Jishnu Prakash <quic_jprakash@quicinc.com> Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Link: https://lore.kernel.org/r/1648991869-20899-5-git-send-email-quic_jprakash@quicinc.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19thermal/drivers/qcom: Add support for multiple generations of devicesJishnu Prakash
Refactor code to support multiple generations of ADC_TM devices by defining gen number, irq name and disable, configure, isr and init APIs in the individual data structs. Signed-off-by: Jishnu Prakash <quic_jprakash@quicinc.com> Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/1648991869-20899-4-git-send-email-quic_jprakash@quicinc.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-19thermal/drivers/rcar_thermal: Use platform_get_irq_optional() to get the ↵Lad Prabhakar
interrupt platform_get_resource(pdev, IORESOURCE_IRQ, ..) relies on static allocation of IRQ resources in DT core code, this causes an issue when using hierarchical interrupt domains using "interrupts" property in the node as this bypasses the hierarchical setup and messes up the irq chaining. In preparation for removal of static setup of IRQ resource from DT core code use platform_get_irq_optional(). Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com> Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be> Link: https://lore.kernel.org/r/20220110144039.5810-1-prabhakar.mahadev-lad.rj@bp.renesas.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2022-05-18thermal: intel: hfi: remove NULL check after container_of() callHaowen Bai
container_of() will never return NULL, so remove useless code. Signed-off-by: Haowen Bai <baihaowen@meizu.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2022-05-18Merge back earlier int340x driver changes for 5.19.Rafael J. Wysocki
generated by cgit (git 2.34.1) at 2025-09-13 18:01:39 +0000