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authorPeter Griffin <peter.griffin@linaro.org>2014-09-05 16:36:30 +0100
committerFelipe Balbi <balbi@ti.com>2014-09-05 10:49:00 -0500
commitf83fca0707c66e36f14efef7f68702cb12de70b7 (patch)
treecf77fb9bb2d9239ae49af8f7b456e048242b239d /Documentation/devicetree/bindings/usb/dwc3-st.txt
parent2c4cbe6e5a9c71408b496e00a78ea9284e98af16 (diff)
usb: dwc3: add ST dwc3 glue layer to manage dwc3 HC
This patch adds the ST glue logic to manage the DWC3 HC on STiH407 SoC family. It manages the powerdown signal, and configures the internal glue logic and syscfg registers. [ balbi@ti.com : actually switch over to of_platform_depopulate() ] Signed-off-by: Giuseppe Cavallaro <peppe.cavallaro@st.com> Signed-off-by: Peter Griffin <peter.griffin@linaro.org> Acked-by: Lee Jones <lee.jones@linaro.org> Signed-off-by: Felipe Balbi <balbi@ti.com>
Diffstat (limited to 'Documentation/devicetree/bindings/usb/dwc3-st.txt')
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