diff options
| author | Jean-Francois Dagenais <jeff.dagenais@gmail.com> | 2019-04-18 20:57:22 -0400 |
|---|---|---|
| committer | Guenter Roeck <linux@roeck-us.net> | 2019-04-20 07:08:15 -0700 |
| commit | 4f8d374b770a2e26088186d6c18acf582227129d (patch) | |
| tree | 4be6838793c8bf4b86e964828321731a3446475d /drivers/hwmon/Kconfig | |
| parent | 023912dbb80f5faf7a028aad6562774472d82a5a (diff) | |
hwmon: (max6650) add thermal cooling device capability
This allows max6650 devices to be referenced in dts as a cooling device.
The pwm value seems duplicated in cooling_dev_state but since pwm goes
through rounding logic into data->dac, it is modified and messes with
the thermal zone state algorithms. It's also better to serve a cache
value, thus avoiding periodic actual i2c traffic.
Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Diffstat (limited to 'drivers/hwmon/Kconfig')
| -rw-r--r-- | drivers/hwmon/Kconfig | 1 |
1 files changed, 1 insertions, 0 deletions
diff --git a/drivers/hwmon/Kconfig b/drivers/hwmon/Kconfig index 470ba66b18b0..1915a18b537b 100644 --- a/drivers/hwmon/Kconfig +++ b/drivers/hwmon/Kconfig @@ -908,6 +908,7 @@ config SENSORS_MAX6642 config SENSORS_MAX6650 tristate "Maxim MAX6650 sensor chip" depends on I2C + depends on THERMAL || THERMAL=n help If you say yes here you get support for the MAX6650 / MAX6651 sensor chips. |