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authorDaniel Lezcano <daniel.lezcano@linaro.org>2019-12-19 23:53:17 +0100
committerDaniel Lezcano <daniel.lezcano@linaro.org>2020-01-27 10:24:32 +0100
commit23affa2e29c5faa8cb59778f71e3bce2c8b3aa5c (patch)
tree494162b9032bc19ab827019f667d05d2cee29be1 /drivers
parenta4c428e523490bf53e9c4ba2d809130c58c06ac7 (diff)
thermal/drivers/cpu_cooling: Rename to cpufreq_cooling
As we introduced the idle injection cooling device called cpuidle_cooling, let's be consistent and rename the cpu_cooling to cpufreq_cooling as this one mitigates with OPPs changes. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Acked-by: Viresh Kumar <viresh.kumar@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> Link: https://lore.kernel.org/r/20191219225317.17158-3-daniel.lezcano@linaro.org
Diffstat (limited to 'drivers')
-rw-r--r--drivers/thermal/Makefile2
-rw-r--r--drivers/thermal/clock_cooling.c2
-rw-r--r--drivers/thermal/cpufreq_cooling.c (renamed from drivers/thermal/cpu_cooling.c)6
3 files changed, 5 insertions, 5 deletions
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
index 6929e6fad1ac..d502a597a717 100644
--- a/drivers/thermal/Makefile
+++ b/drivers/thermal/Makefile
@@ -19,7 +19,7 @@ thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE) += user_space.o
thermal_sys-$(CONFIG_THERMAL_GOV_POWER_ALLOCATOR) += power_allocator.o
# cpufreq cooling
-thermal_sys-$(CONFIG_CPU_FREQ_THERMAL) += cpu_cooling.o
+thermal_sys-$(CONFIG_CPU_FREQ_THERMAL) += cpufreq_cooling.o
thermal_sys-$(CONFIG_CPU_IDLE_THERMAL) += cpuidle_cooling.o
# clock cooling
diff --git a/drivers/thermal/clock_cooling.c b/drivers/thermal/clock_cooling.c
index 3ad3256c48fd..7cb3ae4b44ee 100644
--- a/drivers/thermal/clock_cooling.c
+++ b/drivers/thermal/clock_cooling.c
@@ -7,7 +7,7 @@
* Copyright (C) 2013 Texas Instruments Inc.
* Contact: Eduardo Valentin <eduardo.valentin@ti.com>
*
- * Highly based on cpu_cooling.c.
+ * Highly based on cpufreq_cooling.c.
* Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
* Copyright (C) 2012 Amit Daniel <amit.kachhap@linaro.org>
*/
diff --git a/drivers/thermal/cpu_cooling.c b/drivers/thermal/cpufreq_cooling.c
index 53dd08f238d5..fe83d7a210d4 100644
--- a/drivers/thermal/cpu_cooling.c
+++ b/drivers/thermal/cpufreq_cooling.c
@@ -1,6 +1,6 @@
// SPDX-License-Identifier: GPL-2.0
/*
- * linux/drivers/thermal/cpu_cooling.c
+ * linux/drivers/thermal/cpufreq_cooling.c
*
* Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
*
@@ -621,7 +621,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy)
struct thermal_cooling_device *cdev = NULL;
if (!np) {
- pr_err("cpu_cooling: OF node not available for cpu%d\n",
+ pr_err("cpufreq_cooling: OF node not available for cpu%d\n",
policy->cpu);
return NULL;
}
@@ -631,7 +631,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy)
cdev = __cpufreq_cooling_register(np, policy, em);
if (IS_ERR(cdev)) {
- pr_err("cpu_cooling: cpu%d failed to register as cooling device: %ld\n",
+ pr_err("cpufreq_cooling: cpu%d failed to register as cooling device: %ld\n",
policy->cpu, PTR_ERR(cdev));
cdev = NULL;
}