Thermal: Add ST-Ericsson DB8500 thermal driver.

This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and other cooling devices can be added and bound
to the trip points dynamically.  The platform specific PRCMU interrupts are
used to active thermal update when trip points are reached.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>

1 files changed, 38 insertions, 0 deletions

diff --git a/include/linux/platform_data/db8500_thermal.h b/include/linux/platform_data/db8500_thermal.h
new file mode 100644
index 000000000000..3bf60902e902
--- /dev/null
+++ b/include/linux/platform_data/db8500_thermal.h
@@ -0,0 +1,38 @@
+/*
+ * db8500_thermal.h - DB8500 Thermal Management Implementation
+ *
+ * Copyright (C) 2012 ST-Ericsson
+ * Copyright (C) 2012 Linaro Ltd.
+ *
+ * Author: Hongbo Zhang <hongbo.zhang@linaro.com>
+ *
+ * This program is free software; you can redistribute it and/or modify
+ * it under the terms of the GNU General Public License as published by
+ * the Free Software Foundation; either version 2 of the License, or
+ * (at your option) any later version.
+ *
+ * This program is distributed in the hope that it will be useful,
+ * but WITHOUT ANY WARRANTY; without even the implied warranty of
+ * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the
+ * GNU General Public License for more details.
+ */
+
+#ifndef _DB8500_THERMAL_H_
+#define _DB8500_THERMAL_H_
+
+#include <linux/thermal.h>
+
+#define COOLING_DEV_MAX 8
+
+struct db8500_trip_point {
+	unsigned long temp;
+	enum thermal_trip_type type;
+	char cdev_name[COOLING_DEV_MAX][THERMAL_NAME_LENGTH];
+};
+
+struct db8500_thsens_platform_data {
+	struct db8500_trip_point trip_points[THERMAL_MAX_TRIPS];
+	int num_trips;
+};
+
+#endif /* _DB8500_THERMAL_H_ */