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| author | Linus Torvalds <torvalds@linux-foundation.org> | 2023-05-03 11:46:01 -0700 |
|---|---|---|
| committer | Linus Torvalds <torvalds@linux-foundation.org> | 2023-05-03 11:46:01 -0700 |
| commit | 667de5c68440732373f571f7eac4ff44b1b93ee7 (patch) | |
| tree | 54c03ddf31003128cc955ad2651d336ef416b798 /include | |
| parent | 89b7fd5d7f3ceda236cc1d0026986a5f57ecaf4a (diff) | |
| parent | 53389edd4020514b876b01d05e851fb7d46eb51f (diff) | |
Merge tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These are mostly cleanups on top of the previously merged thermal
control changes plus some driver fixes and the removal of the Intel
Menlow thermal driver.
Specifics:
- Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs
check warning (Stefan Wahren)
- Update the example in the DT bindings to reflect changes with the
ADC node name for QCom TM and TM5 (Marijn Suijten)
- Fix comments for the cpuidle_cooling_register() function to match
the function prototype (Chenggang Wang)
- Fix inconsistent temperature read and some Mediatek variant board
reboot by reverting a change and handling the temperature
differently (AngeloGioacchino Del Regno)
- Fix a memory leak in the initialization error path for the Mediatek
driver (Kang Chen)
- Use of_address_to_resource() in the Mediatek driver (Rob Herring)
- Fix unit address in the QCom tsens driver DT bindings (Krzysztof
Kozlowski)
- Clean up the step-wise thermal governor (Zhang Rui)
- Introduce thermal_zone_device() for accessing the device field of
struct thermal_zone_device and two drivers use it (Daniel Lezcano)
- Clean up the ACPI thermal driver a bit (Daniel Lezcano)
- Delete the thermal driver for Intel Menlow platforms that is not
expected to have any users (Rafael Wysocki)"
* tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal: intel: menlow: Get rid of this driver
ACPI: thermal: Move to dedicated function sysfs extra attr creation
ACPI: thermal: Use thermal_zone_device()
thermal: intel: pch_thermal: Use thermal driver device to write a trace
thermal: core: Encapsulate tz->device field
thermal: gov_step_wise: Adjust code logic to match comment
thermal: gov_step_wise: Delete obsolete comment
dt-bindings: thermal: qcom-tsens: Correct unit address
thermal/drivers/mediatek: Use of_address_to_resource()
thermal/drivers/mediatek: Change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe
thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe
thermal/drivers/mediatek: Add temperature constraints to validate read
Revert "thermal/drivers/mediatek: Add delay after thermal banks initialization"
thermal/drivers/cpuidle_cooling: Delete unmatched comments
dt-bindings: thermal: Use generic ADC node name in examples
dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible
Diffstat (limited to 'include')
| -rw-r--r-- | include/linux/thermal.h | 1 |
1 files changed, 1 insertions, 0 deletions
diff --git a/include/linux/thermal.h b/include/linux/thermal.h index 82ddb32f9876..87837094d549 100644 --- a/include/linux/thermal.h +++ b/include/linux/thermal.h @@ -313,6 +313,7 @@ thermal_zone_device_register_with_trips(const char *, struct thermal_trip *, int void *thermal_zone_device_priv(struct thermal_zone_device *tzd); const char *thermal_zone_device_type(struct thermal_zone_device *tzd); int thermal_zone_device_id(struct thermal_zone_device *tzd); +struct device *thermal_zone_device(struct thermal_zone_device *tzd); int thermal_zone_bind_cooling_device(struct thermal_zone_device *, int, struct thermal_cooling_device *, |