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-rw-r--r--Documentation/ABI/testing/sysfs-bus-event_source-devices-hv_24x77
-rw-r--r--Documentation/ABI/testing/sysfs-bus-papr-pmem27
-rw-r--r--Documentation/ABI/testing/sysfs-class-ocxl11
-rw-r--r--Documentation/ABI/testing/sysfs-driver-ufs136
-rw-r--r--Documentation/admin-guide/kernel-parameters.txt4
-rw-r--r--Documentation/core-api/cpu_hotplug.rst7
-rw-r--r--Documentation/devicetree/bindings/arm/arm,scmi.txt2
-rw-r--r--Documentation/devicetree/bindings/arm/arm,scpi.txt2
-rw-r--r--Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt2
-rw-r--r--Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt2
-rw-r--r--Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt2
-rw-r--r--Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt3
-rw-r--r--Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt4
-rw-r--r--Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt2
-rw-r--r--Documentation/devicetree/bindings/hwmon/gpio-fan.txt3
-rw-r--r--Documentation/devicetree/bindings/hwmon/lm90.txt4
-rw-r--r--Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml2
-rw-r--r--Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt2
-rw-r--r--Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml2
-rw-r--r--Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt2
-rw-r--r--Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt2
-rw-r--r--Documentation/devicetree/bindings/thermal/max77620_thermal.txt6
-rw-r--r--Documentation/devicetree/bindings/thermal/mediatek-thermal.txt2
-rw-r--r--Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt10
-rw-r--r--Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt2
-rw-r--r--Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt2
-rw-r--r--Documentation/devicetree/bindings/thermal/qcom-tsens.yaml1
-rw-r--r--Documentation/devicetree/bindings/thermal/rockchip-thermal.txt2
-rw-r--r--Documentation/devicetree/bindings/thermal/tango-thermal.txt2
-rw-r--r--Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt2
-rw-r--r--Documentation/devicetree/bindings/thermal/thermal.txt586
-rw-r--r--Documentation/features/core/jump-labels/arch-support.txt2
-rw-r--r--Documentation/features/debug/debug-vm-pgtable/arch-support.txt2
-rw-r--r--Documentation/features/sched/membarrier-sync-core/arch-support.txt4
-rw-r--r--Documentation/filesystems/quota.rst12
-rw-r--r--Documentation/filesystems/udf.rst2
-rw-r--r--Documentation/memory-barriers.txt14
-rw-r--r--Documentation/powerpc/cpu_families.rst10
-rw-r--r--Documentation/powerpc/mpc52xx.rst2
-rw-r--r--Documentation/powerpc/syscall64-abi.rst42
-rw-r--r--Documentation/scsi/advansys.rst2
-rw-r--r--Documentation/scsi/scsi-parameters.rst2
-rw-r--r--Documentation/virt/kvm/api.rst3
43 files changed, 287 insertions, 653 deletions
diff --git a/Documentation/ABI/testing/sysfs-bus-event_source-devices-hv_24x7 b/Documentation/ABI/testing/sysfs-bus-event_source-devices-hv_24x7
index e8698afcd952..f7e32f218f73 100644
--- a/Documentation/ABI/testing/sysfs-bus-event_source-devices-hv_24x7
+++ b/Documentation/ABI/testing/sysfs-bus-event_source-devices-hv_24x7
@@ -43,6 +43,13 @@ Description: read only
This sysfs interface exposes the number of cores per chip
present in the system.
+What: /sys/devices/hv_24x7/interface/cpumask
+Date: July 2020
+Contact: Linux on PowerPC Developer List <linuxppc-dev@lists.ozlabs.org>
+Description: read only
+ This sysfs file exposes the cpumask which is designated to make
+ HCALLs to retrieve hv-24x7 pmu event counter data.
+
What: /sys/bus/event_source/devices/hv_24x7/event_descs/<event-name>
Date: February 2014
Contact: Linux on PowerPC Developer List <linuxppc-dev@lists.ozlabs.org>
diff --git a/Documentation/ABI/testing/sysfs-bus-papr-pmem b/Documentation/ABI/testing/sysfs-bus-papr-pmem
index 5b10d036a8d4..c1a67275c43f 100644
--- a/Documentation/ABI/testing/sysfs-bus-papr-pmem
+++ b/Documentation/ABI/testing/sysfs-bus-papr-pmem
@@ -25,3 +25,30 @@ Description:
NVDIMM have been scrubbed.
* "locked" : Indicating that NVDIMM contents cant
be modified until next power cycle.
+
+What: /sys/bus/nd/devices/nmemX/papr/perf_stats
+Date: May, 2020
+KernelVersion: v5.9
+Contact: linuxppc-dev <linuxppc-dev@lists.ozlabs.org>, linux-nvdimm@lists.01.org,
+Description:
+ (RO) Report various performance stats related to papr-scm NVDIMM
+ device. Each stat is reported on a new line with each line
+ composed of a stat-identifier followed by it value. Below are
+ currently known dimm performance stats which are reported:
+
+ * "CtlResCt" : Controller Reset Count
+ * "CtlResTm" : Controller Reset Elapsed Time
+ * "PonSecs " : Power-on Seconds
+ * "MemLife " : Life Remaining
+ * "CritRscU" : Critical Resource Utilization
+ * "HostLCnt" : Host Load Count
+ * "HostSCnt" : Host Store Count
+ * "HostSDur" : Host Store Duration
+ * "HostLDur" : Host Load Duration
+ * "MedRCnt " : Media Read Count
+ * "MedWCnt " : Media Write Count
+ * "MedRDur " : Media Read Duration
+ * "MedWDur " : Media Write Duration
+ * "CchRHCnt" : Cache Read Hit Count
+ * "CchWHCnt" : Cache Write Hit Count
+ * "FastWCnt" : Fast Write Count \ No newline at end of file
diff --git a/Documentation/ABI/testing/sysfs-class-ocxl b/Documentation/ABI/testing/sysfs-class-ocxl
index b5b1fa197592..ae1276efa45a 100644
--- a/Documentation/ABI/testing/sysfs-class-ocxl
+++ b/Documentation/ABI/testing/sysfs-class-ocxl
@@ -33,3 +33,14 @@ Date: January 2018
Contact: linuxppc-dev@lists.ozlabs.org
Description: read/write
Give access the global mmio area for the AFU
+
+What: /sys/class/ocxl/<afu name>/reload_on_reset
+Date: February 2020
+Contact: linuxppc-dev@lists.ozlabs.org
+Description: read/write
+ Control whether the FPGA is reloaded on a link reset. Enabled
+ through a vendor-specific logic block on the FPGA.
+ 0 Do not reload FPGA image from flash
+ 1 Reload FPGA image from flash
+ unavailable
+ The device does not support this capability
diff --git a/Documentation/ABI/testing/sysfs-driver-ufs b/Documentation/ABI/testing/sysfs-driver-ufs
index 016724ec26d5..d1a352194d2e 100644
--- a/Documentation/ABI/testing/sysfs-driver-ufs
+++ b/Documentation/ABI/testing/sysfs-driver-ufs
@@ -883,3 +883,139 @@ Contact: Subhash Jadavani <subhashj@codeaurora.org>
Description: This entry shows the target state of an UFS UIC link
for the chosen system power management level.
The file is read only.
+
+What: /sys/bus/platform/drivers/ufshcd/*/device_descriptor/wb_presv_us_en
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: This entry shows if preserve user-space was configured
+ The file is read only.
+
+What: /sys/bus/platform/drivers/ufshcd/*/device_descriptor/wb_shared_alloc_units
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: This entry shows the shared allocated units of WB buffer
+ The file is read only.
+
+What: /sys/bus/platform/drivers/ufshcd/*/device_descriptor/wb_type
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: This entry shows the configured WB type.
+ 0x1 for shared buffer mode. 0x0 for dedicated buffer mode.
+ The file is read only.
+
+What: /sys/bus/platform/drivers/ufshcd/*/geometry_descriptor/wb_buff_cap_adj
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: This entry shows the total user-space decrease in shared
+ buffer mode.
+ The value of this parameter is 3 for TLC NAND when SLC mode
+ is used as WriteBooster Buffer. 2 for MLC NAND.
+ The file is read only.
+
+What: /sys/bus/platform/drivers/ufshcd/*/geometry_descriptor/wb_max_alloc_units
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: This entry shows the Maximum total WriteBooster Buffer size
+ which is supported by the entire device.
+ The file is read only.
+
+What: /sys/bus/platform/drivers/ufshcd/*/geometry_descriptor/wb_max_wb_luns
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: This entry shows the maximum number of luns that can support
+ WriteBooster.
+ The file is read only.
+
+What: /sys/bus/platform/drivers/ufshcd/*/geometry_descriptor/wb_sup_red_type
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: The supportability of user space reduction mode
+ and preserve user space mode.
+ 00h: WriteBooster Buffer can be configured only in
+ user space reduction type.
+ 01h: WriteBooster Buffer can be configured only in
+ preserve user space type.
+ 02h: Device can be configured in either user space
+ reduction type or preserve user space type.
+ The file is read only.
+
+What: /sys/bus/platform/drivers/ufshcd/*/geometry_descriptor/wb_sup_wb_type
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: The supportability of WriteBooster Buffer type.
+ 00h: LU based WriteBooster Buffer configuration
+ 01h: Single shared WriteBooster Buffer
+ configuration
+ 02h: Supporting both LU based WriteBooster
+ Buffer and Single shared WriteBooster Buffer
+ configuration
+ The file is read only.
+
+What: /sys/bus/platform/drivers/ufshcd/*/flags/wb_enable
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: This entry shows the status of WriteBooster.
+ 0: WriteBooster is not enabled.
+ 1: WriteBooster is enabled
+ The file is read only.
+
+What: /sys/bus/platform/drivers/ufshcd/*/flags/wb_flush_en
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: This entry shows if flush is enabled.
+ 0: Flush operation is not performed.
+ 1: Flush operation is performed.
+ The file is read only.
+
+What: /sys/bus/platform/drivers/ufshcd/*/flags/wb_flush_during_h8
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: Flush WriteBooster Buffer during hibernate state.
+ 0: Device is not allowed to flush the
+ WriteBooster Buffer during link hibernate
+ state.
+ 1: Device is allowed to flush the
+ WriteBooster Buffer during link hibernate
+ state
+ The file is read only.
+
+What: /sys/bus/platform/drivers/ufshcd/*/attributes/wb_avail_buf
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: This entry shows the amount of unused WriteBooster buffer
+ available.
+ The file is read only.
+
+What: /sys/bus/platform/drivers/ufshcd/*/attributes/wb_cur_buf
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: This entry shows the amount of unused current buffer.
+ The file is read only.
+
+What: /sys/bus/platform/drivers/ufshcd/*/attributes/wb_flush_status
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: This entry shows the flush operation status.
+ 00h: idle
+ 01h: Flush operation in progress
+ 02h: Flush operation stopped prematurely.
+ 03h: Flush operation completed successfully
+ 04h: Flush operation general failure
+ The file is read only.
+
+What: /sys/bus/platform/drivers/ufshcd/*/attributes/wb_life_time_est
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: This entry shows an indication of the WriteBooster Buffer
+ lifetime based on the amount of performed program/erase cycles
+ 01h: 0% - 10% WriteBooster Buffer life time used
+ ...
+ 0Ah: 90% - 100% WriteBooster Buffer life time used
+ The file is read only.
+
+What: /sys/class/scsi_device/*/device/unit_descriptor/wb_buf_alloc_units
+Date: June 2020
+Contact: Asutosh Das <asutoshd@codeaurora.org>
+Description: This entry shows the configured size of WriteBooster buffer.
+ 0400h corresponds to 4GB.
+ The file is read only.
diff --git a/Documentation/admin-guide/kernel-parameters.txt b/Documentation/admin-guide/kernel-parameters.txt
index c95552269689..98ea67f27809 100644
--- a/Documentation/admin-guide/kernel-parameters.txt
+++ b/Documentation/admin-guide/kernel-parameters.txt
@@ -916,6 +916,10 @@
disable_radix [PPC]
Disable RADIX MMU mode on POWER9
+ radix_hcall_invalidate=on [PPC/PSERIES]
+ Disable RADIX GTSE feature and use hcall for TLB
+ invalidate.
+
disable_tlbie [PPC]
Disable TLBIE instruction. Currently does not work
with KVM, with HASH MMU, or with coherent accelerators.
diff --git a/Documentation/core-api/cpu_hotplug.rst b/Documentation/core-api/cpu_hotplug.rst
index f64668759b6a..298c9c8bea9a 100644
--- a/Documentation/core-api/cpu_hotplug.rst
+++ b/Documentation/core-api/cpu_hotplug.rst
@@ -50,13 +50,6 @@ Command Line Switches
This option is limited to the X86 and S390 architecture.
-``cede_offline={"off","on"}``
- Use this option to disable/enable putting offlined processors to an extended
- ``H_CEDE`` state on supported pseries platforms. If nothing is specified,
- ``cede_offline`` is set to "on".
-
- This option is limited to the PowerPC architecture.
-
``cpu0_hotplug``
Allow to shutdown CPU0.
diff --git a/Documentation/devicetree/bindings/arm/arm,scmi.txt b/Documentation/devicetree/bindings/arm/arm,scmi.txt
index 1f293ea24cd8..55deb68230eb 100644
--- a/Documentation/devicetree/bindings/arm/arm,scmi.txt
+++ b/Documentation/devicetree/bindings/arm/arm,scmi.txt
@@ -102,7 +102,7 @@ Required sub-node properties:
[0] http://infocenter.arm.com/help/topic/com.arm.doc.den0056a/index.html
[1] Documentation/devicetree/bindings/clock/clock-bindings.txt
[2] Documentation/devicetree/bindings/power/power-domain.yaml
-[3] Documentation/devicetree/bindings/thermal/thermal.txt
+[3] Documentation/devicetree/bindings/thermal/thermal*.yaml
[4] Documentation/devicetree/bindings/sram/sram.yaml
[5] Documentation/devicetree/bindings/reset/reset.txt
diff --git a/Documentation/devicetree/bindings/arm/arm,scpi.txt b/Documentation/devicetree/bindings/arm/arm,scpi.txt
index dd04d9d9a1b8..bcd6c3ec471e 100644
--- a/Documentation/devicetree/bindings/arm/arm,scpi.txt
+++ b/Documentation/devicetree/bindings/arm/arm,scpi.txt
@@ -108,7 +108,7 @@ Required properties:
[0] http://infocenter.arm.com/help/topic/com.arm.doc.dui0922b/index.html
[1] Documentation/devicetree/bindings/clock/clock-bindings.txt
-[2] Documentation/devicetree/bindings/thermal/thermal.txt
+[2] Documentation/devicetree/bindings/thermal/thermal*.yaml
[3] Documentation/devicetree/bindings/sram/sram.yaml
[4] Documentation/devicetree/bindings/power/power-domain.yaml
diff --git a/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt b/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt
index 10b8459e49f8..6064d98b1031 100644
--- a/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt
+++ b/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt
@@ -176,7 +176,7 @@ Required properties:
"fsl,imx8qxp-sc-thermal"
followed by "fsl,imx-sc-thermal";
-- #thermal-sensor-cells: See Documentation/devicetree/bindings/thermal/thermal.txt
+- #thermal-sensor-cells: See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
for a description.
Example (imx8qxp):
diff --git a/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt b/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt
index 098d932fc963..e31511255d8e 100644
--- a/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt
+++ b/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt
@@ -111,7 +111,7 @@ Thermal:
--------
For common binding part and usage, refer to
-Documentation/devicetree/bindings/thermal/thermal.txt
+Documentation/devicetree/bindings/thermal/thermal*.yaml
The thermal IP can probe the temperature all around the processor. It
may feature several channels, each of them wired to one sensor.
diff --git a/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt b/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt
index f982a8ed9396..a21f7709596c 100644
--- a/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt
+++ b/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt
@@ -203,7 +203,7 @@ It is possible to setup an overheat interrupt by giving at least one
critical point to any subnode of the thermal-zone node.
For common binding part and usage, refer to
-Documentation/devicetree/bindings/thermal/thermal.txt
+Documentation/devicetree/bindings/thermal/thermal*.yaml
Required properties:
- compatible: must be one of:
diff --git a/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt b/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt
index 332aed8f4597..56f442374383 100644
--- a/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt
+++ b/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt
@@ -18,7 +18,8 @@ Optional properties:
in unit of nanoseconds.
- voltage-tolerance: Specify the CPU voltage tolerance in percentage.
- #cooling-cells:
- Please refer to Documentation/devicetree/bindings/thermal/thermal.txt.
+ Please refer to
+ Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml.
Examples:
diff --git a/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt b/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt
index 0551c78619de..ea4994b35207 100644
--- a/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt
+++ b/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt
@@ -21,8 +21,8 @@ Optional properties:
flow is handled by hardware, hence no software "voltage tracking" is
needed.
- #cooling-cells:
- Please refer to Documentation/devicetree/bindings/thermal/thermal.txt
- for detail.
+ For details, please refer to
+ Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
Example 1 (MT7623 SoC):
diff --git a/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt b/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt
index daeca6ae6b76..52a24b82fd86 100644
--- a/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt
+++ b/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt
@@ -5,7 +5,7 @@ Required properties:
- clocks: Must contain an entry for the CPU clock.
See ../clocks/clock-bindings.txt for details.
- operating-points-v2: See ../bindings/opp/opp.txt for details.
-- #cooling-cells: Should be 2. See ../thermal/thermal.txt for details.
+- #cooling-cells: Should be 2. See ../thermal/thermal-cooling-devices.yaml for details.
For each opp entry in 'operating-points-v2' table:
- opp-supported-hw: Two bitfields indicating:
diff --git a/Documentation/devicetree/bindings/hwmon/gpio-fan.txt b/Documentation/devicetree/bindings/hwmon/gpio-fan.txt
index 2becdcfdc840..f4cfa350f6a1 100644
--- a/Documentation/devicetree/bindings/hwmon/gpio-fan.txt
+++ b/Documentation/devicetree/bindings/hwmon/gpio-fan.txt
@@ -12,7 +12,8 @@ Optional properties:
- alarm-gpios: This pin going active indicates something is wrong with
the fan, and a udev event will be fired.
- #cooling-cells: If used as a cooling device, must be <2>
- Also see: Documentation/devicetree/bindings/thermal/thermal.txt
+ Also see:
+ Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
min and max states are derived from the speed-map of the fan.
Note: At least one the "gpios" or "alarm-gpios" properties must be set.
diff --git a/Documentation/devicetree/bindings/hwmon/lm90.txt b/Documentation/devicetree/bindings/hwmon/lm90.txt
index c76a7ac47c34..398dcb965751 100644
--- a/Documentation/devicetree/bindings/hwmon/lm90.txt
+++ b/Documentation/devicetree/bindings/hwmon/lm90.txt
@@ -34,8 +34,8 @@ Optional properties:
LM90 "-ALERT" pin output.
See interrupt-controller/interrupts.txt for the format.
-- #thermal-sensor-cells: should be set to 1. See thermal/thermal.txt for
- details. See <include/dt-bindings/thermal/lm90.h> for the
+- #thermal-sensor-cells: should be set to 1. See thermal/thermal-sensor.yaml
+ for details. See <include/dt-bindings/thermal/lm90.h> for the
definition of the local, remote and 2nd remote sensor index
constants.
diff --git a/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml
index 87369264feb9..44ba6765697d 100644
--- a/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml
+++ b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml
@@ -50,7 +50,7 @@ properties:
nvmem-cell-names:
const: calibration
- # See ./thermal.txt for details
+ # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details
"#thermal-sensor-cells":
enum:
- 0
diff --git a/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt
index 703979dbd577..12fc4ef04837 100644
--- a/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt
@@ -6,7 +6,7 @@ transaction.
Required properties:
- compatible: "amazon,al-thermal".
- reg: The physical base address and length of the sensor's registers.
-- #thermal-sensor-cells: Must be 1. See ./thermal.txt for a description.
+- #thermal-sensor-cells: Must be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
Example:
thermal: thermal {
diff --git a/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml
index f3e68ed03abf..1ab5070c751d 100644
--- a/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml
+++ b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml
@@ -23,7 +23,7 @@ properties:
compatible:
const: brcm,bcm2711-thermal
- # See ./thermal.txt for details
+ # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details
"#thermal-sensor-cells":
const: 0
diff --git a/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt
index da8c5b73ad10..a3e9ec5dc7ac 100644
--- a/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt
@@ -7,7 +7,7 @@ compatible: should be one of: "brcm,bcm2835-thermal",
"brcm,bcm2836-thermal" or "brcm,bcm2837-thermal"
reg: Address range of the thermal registers.
clocks: Phandle of the clock used by the thermal sensor.
-#thermal-sensor-cells: should be 0 (see thermal.txt)
+#thermal-sensor-cells: should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml)
Example:
diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
index cef716a236f1..4b19d80e6558 100644
--- a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
@@ -9,7 +9,7 @@
by /SOCTHERM/tsensor.
- clock-names: Input clock name, should be 'thermal_clk'.
- clocks: phandles for clock specified in "clock-names" property.
-- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
+- #thermal-sensor-cells: Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
Example :
diff --git a/Documentation/devicetree/bindings/thermal/max77620_thermal.txt b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt
index 323a3b3822aa..82ed5d487966 100644
--- a/Documentation/devicetree/bindings/thermal/max77620_thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt
@@ -8,12 +8,12 @@ below threshold level.
Required properties:
-------------------
-#thermal-sensor-cells: Please refer <devicetree/bindings/thermal/thermal.txt>
- for more details.
+#thermal-sensor-cells: For more details, please refer to
+ <devicetree/bindings/thermal/thermal-sensor.yaml>
The value must be 0.
For more details, please refer generic thermal DT binding document
-<devicetree/bindings/thermal/thermal.txt>.
+<devicetree/bindings/thermal/thermal*.yaml>.
Please refer <devicetree/bindings/mfd/max77620.txt> for mfd DT binding
document for the MAX77620.
diff --git a/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt
index f8d7831f3974..1e249c42fae0 100644
--- a/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt
@@ -23,7 +23,7 @@ Required properties:
- resets: Reference to the reset controller controlling the thermal controller.
- mediatek,auxadc: A phandle to the AUXADC which the thermal controller uses
- mediatek,apmixedsys: A phandle to the APMIXEDSYS controller.
-- #thermal-sensor-cells : Should be 0. See ./thermal.txt for a description.
+- #thermal-sensor-cells : Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
Optional properties:
- nvmem-cells: A phandle to the calibration data provided by a nvmem device. If
diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
index f02f38527a6b..db880e7ed713 100644
--- a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
+++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt
@@ -28,9 +28,10 @@ Required properties :
See ../reset/reset.txt for details.
- reset-names : Must include the following entries:
- soctherm
-- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description
- of this property. See <dt-bindings/thermal/tegra124-soctherm.h> for a
- list of valid values when referring to thermal sensors.
+- #thermal-sensor-cells : Should be 1. For a description of this property, see
+ Documentation/devicetree/bindings/thermal/thermal-sensor.yaml.
+ See <dt-bindings/thermal/tegra124-soctherm.h> for a list of valid values
+ when referring to thermal sensors.
- throttle-cfgs: A sub-node which is a container of configuration for each
hardware throttle events. These events can be set as cooling devices.
* throttle events: Sub-nodes must be named as "light" or "heavy".
@@ -62,7 +63,8 @@ Required properties :
TEGRA_SOCTHERM_THROT_LEVEL_MED (75%),
TEGRA_SOCTHERM_THROT_LEVEL_HIGH (85%).
- #cooling-cells: Should be 1. This cooling device only support on/off state.
- See ./thermal.txt for a description of this property.
+ For a description of this property see:
+ Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
Optional properties: The following properties are T210 specific and
valid only for OCx throttle events.
diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
index e17c07be270b..fc87f6aa1b8f 100644
--- a/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt
@@ -8,7 +8,7 @@ exposed by BPMP.
The BPMP thermal node must be located directly inside the main BPMP node. See
../firmware/nvidia,tegra186-bpmp.txt for details of the BPMP binding.
-This node represents a thermal sensor. See thermal.txt for details of the
+This node represents a thermal sensor. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details of the
core thermal binding.
Required properties:
diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
index 0273a92a2a84..2d5b2ad03314 100644
--- a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
+++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
@@ -8,7 +8,7 @@ Required properties:
- compatible: Should contain "qcom,spmi-temp-alarm".
- reg: Specifies the SPMI address.
- interrupts: PMIC temperature alarm interrupt.
-- #thermal-sensor-cells: Should be 0. See thermal.txt for a description.
+- #thermal-sensor-cells: Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
Optional properties:
- io-channels: Should contain IIO channel specifier for the ADC channel,
diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
index adac01c9d9cd..95462e071ab4 100644
--- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
+++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
@@ -23,6 +23,7 @@ properties:
items:
- enum:
- qcom,msm8916-tsens
+ - qcom,msm8939-tsens
- qcom,msm8974-tsens
- const: qcom,tsens-v0_1
diff --git a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
index c6aac9bcacf1..7f94669e9ebe 100644
--- a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
@@ -24,7 +24,7 @@ Required properties:
- pinctrl-1 : The "default" pinctrl state, it will be set after reset the
TSADC controller.
- pinctrl-2 : The "sleep" pinctrl state, it will be in for suspend.
-- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description.
+- #thermal-sensor-cells : Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
Optional properties:
- rockchip,hw-tshut-temp : The hardware-controlled shutdown temperature value.
diff --git a/Documentation/devicetree/bindings/thermal/tango-thermal.txt b/Documentation/devicetree/bindings/thermal/tango-thermal.txt
index 212198d4b937..2c918d742867 100644
--- a/Documentation/devicetree/bindings/thermal/tango-thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/tango-thermal.txt
@@ -4,7 +4,7 @@ The SMP8758 SoC includes 3 instances of this temperature sensor
(in the CPU, video decoder, and PCIe controller).
Required properties:
-- #thermal-sensor-cells: Should be 0 (see thermal.txt)
+- #thermal-sensor-cells: Should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml)
- compatible: "sigma,smp8758-thermal"
- reg: Address range of the thermal registers
diff --git a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
index 691a09db2fef..e136946a2f4f 100644
--- a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
+++ b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt
@@ -8,7 +8,7 @@ temperature using voltage-temperature lookup table.
Required properties:
===================
- compatible: Must be "generic-adc-thermal".
-- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description
+- #thermal-sensor-cells: Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description
of this property.
Optional properties:
===================
diff --git a/Documentation/devicetree/bindings/thermal/thermal.txt b/Documentation/devicetree/bindings/thermal/thermal.txt
deleted file mode 100644
index f78bec19ca35..000000000000
--- a/Documentation/devicetree/bindings/thermal/thermal.txt
+++ /dev/null
@@ -1,586 +0,0 @@
-* Thermal Framework Device Tree descriptor
-
-This file describes a generic binding to provide a way of
-defining hardware thermal structure using device tree.
-A thermal structure includes thermal zones and their components,
-such as trip points, polling intervals, sensors and cooling devices
-binding descriptors.
-
-The target of device tree thermal descriptors is to describe only
-the hardware thermal aspects. The thermal device tree bindings are
-not about how the system must control or which algorithm or policy
-must be taken in place.
-
-There are five types of nodes involved to describe thermal bindings:
-- thermal sensors: devices which may be used to take temperature
- measurements.
-- cooling devices: devices which may be used to dissipate heat.
-- trip points: describe key temperatures at which cooling is recommended. The
- set of points should be chosen based on hardware limits.
-- cooling maps: used to describe links between trip points and cooling devices;
-- thermal zones: used to describe thermal data within the hardware;
-
-The following is a description of each of these node types.
-
-* Thermal sensor devices
-
-Thermal sensor devices are nodes providing temperature sensing capabilities on
-thermal zones. Typical devices are I2C ADC converters and bandgaps. These are
-nodes providing temperature data to thermal zones. Thermal sensor devices may
-control one or more internal sensors.
-
-Required property:
-- #thermal-sensor-cells: Used to provide sensor device specific information
- Type: unsigned while referring to it. Typically 0 on thermal sensor
- Size: one cell nodes with only one sensor, and at least 1 on nodes
- with several internal sensors, in order
- to identify uniquely the sensor instances within
- the IC. See thermal zone binding for more details
- on how consumers refer to sensor devices.
-
-* Cooling device nodes
-
-Cooling devices are nodes providing control on power dissipation. There
-are essentially two ways to provide control on power dissipation. First
-is by means of regulating device performance, which is known as passive
-cooling. A typical passive cooling is a CPU that has dynamic voltage and
-frequency scaling (DVFS), and uses lower frequencies as cooling states.
-Second is by means of activating devices in order to remove
-the dissipated heat, which is known as active cooling, e.g. regulating
-fan speeds. In both cases, cooling devices shall have a way to determine
-the state of cooling in which the device is.
-
-Any cooling device has a range of cooling states (i.e. different levels
-of heat dissipation). For example a fan's cooling states correspond to
-the different fan speeds possible. Cooling states are referred to by
-single unsigned integers, where larger numbers mean greater heat
-dissipation. The precise set of cooling states associated with a device
-should be defined in a particular device's binding.
-For more examples of cooling devices, refer to the example sections below.
-
-Required properties:
-- #cooling-cells: Used to provide cooling device specific information
- Type: unsigned while referring to it. Must be at least 2, in order
- Size: one cell to specify minimum and maximum cooling state used
- in the reference. The first cell is the minimum
- cooling state requested and the second cell is
- the maximum cooling state requested in the reference.
- See Cooling device maps section below for more details
- on how consumers refer to cooling devices.
-
-* Trip points
-
-The trip node is a node to describe a point in the temperature domain
-in which the system takes an action. This node describes just the point,
-not the action.
-
-Required properties:
-- temperature: An integer indicating the trip temperature level,
- Type: signed in millicelsius.
- Size: one cell
-
-- hysteresis: A low hysteresis value on temperature property (above).
- Type: unsigned This is a relative value, in millicelsius.
- Size: one cell
-
-- type: a string containing the trip type. Expected values are:
- "active": A trip point to enable active cooling
- "passive": A trip point to enable passive cooling
- "hot": A trip point to notify emergency
- "critical": Hardware not reliable.
- Type: string
-
-* Cooling device maps
-
-The cooling device maps node is a node to describe how cooling devices
-get assigned to trip points of the zone. The cooling devices are expected
-to be loaded in the target system.
-
-Required properties:
-- cooling-device: A list of phandles of cooling devices with their specifiers,
- Type: phandle + referring to which cooling devices are used in this
- cooling specifier binding. In the cooling specifier, the first cell
- is the minimum cooling state and the second cell
- is the maximum cooling state used in this map.
-- trip: A phandle of a trip point node within the same thermal
- Type: phandle of zone.
- trip point node
-
-Optional property:
-- contribution: The cooling contribution to the thermal zone of the
- Type: unsigned referred cooling device at the referred trip point.
- Size: one cell The contribution is a ratio of the sum
- of all cooling contributions within a thermal zone.
-
-Note: Using the THERMAL_NO_LIMIT (-1UL) constant in the cooling-device phandle
-limit specifier means:
-(i) - minimum state allowed for minimum cooling state used in the reference.
-(ii) - maximum state allowed for maximum cooling state used in the reference.
-Refer to include/dt-bindings/thermal/thermal.h for definition of this constant.
-
-* Thermal zone nodes
-
-The thermal zone node is the node containing all the required info
-for describing a thermal zone, including its cooling device bindings. The
-thermal zone node must contain, apart from its own properties, one sub-node
-containing trip nodes and one sub-node containing all the zone cooling maps.
-
-Required properties:
-- polling-delay: The maximum number of milliseconds to wait between polls
- Type: unsigned when checking this thermal zone.
- Size: one cell
-
-- polling-delay-passive: The maximum number of milliseconds to wait
- Type: unsigned between polls when performing passive cooling.
- Size: one cell
-
-- thermal-sensors: A list of thermal sensor phandles and sensor specifier
- Type: list of used while monitoring the thermal zone.
- phandles + sensor
- specifier
-
-- trips: A sub-node which is a container of only trip point nodes
- Type: sub-node required to describe the thermal zone.
-
-Optional property:
-- cooling-maps: A sub-node which is a container of only cooling device
- Type: sub-node map nodes, used to describe the relation between trips
- and cooling devices.
-
-- coefficients: An array of integers (one signed cell) containing
- Type: array coefficients to compose a linear relation between
- Elem size: one cell the sensors listed in the thermal-sensors property.
- Elem type: signed Coefficients defaults to 1, in case this property
- is not specified. A simple linear polynomial is used:
- Z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn.
-
- The coefficients are ordered and they match with sensors
- by means of sensor ID. Additional coefficients are
- interpreted as constant offset.
-
-- sustainable-power: An estimate of the sustainable power (in mW) that the
- Type: unsigned thermal zone can dissipate at the desired
- Size: one cell control temperature. For reference, the
- sustainable power of a 4'' phone is typically
- 2000mW, while on a 10'' tablet is around
- 4500mW.
-
-Note: The delay properties are bound to the maximum dT/dt (temperature
-derivative over time) in two situations for a thermal zone:
-(i) - when passive cooling is activated (polling-delay-passive); and
-(ii) - when the zone just needs to be monitored (polling-delay) or
-when active cooling is activated.
-
-The maximum dT/dt is highly bound to hardware power consumption and dissipation
-capability. The delays should be chosen to account for said max dT/dt,
-such that a device does not cross several trip boundaries unexpectedly
-between polls. Choosing the right polling delays shall avoid having the
-device in temperature ranges that may damage the silicon structures and
-reduce silicon lifetime.
-
-* The thermal-zones node
-
-The "thermal-zones" node is a container for all thermal zone nodes. It shall
-contain only sub-nodes describing thermal zones as in the section
-"Thermal zone nodes". The "thermal-zones" node appears under "/".
-
-* Examples
-
-Below are several examples on how to use thermal data descriptors
-using device tree bindings:
-
-(a) - CPU thermal zone
-
-The CPU thermal zone example below describes how to setup one thermal zone
-using one single sensor as temperature source and many cooling devices and
-power dissipation control sources.
-
-#include <dt-bindings/thermal/thermal.h>
-
-cpus {
- /*
- * Here is an example of describing a cooling device for a DVFS
- * capable CPU. The CPU node describes its four OPPs.
- * The cooling states possible are 0..3, and they are
- * used as OPP indexes. The minimum cooling state is 0, which means
- * all four OPPs can be available to the system. The maximum
- * cooling state is 3, which means only the lowest OPPs (198MHz@0.85V)
- * can be available in the system.
- */
- cpu0: cpu@0 {
- ...
- operating-points = <
- /* kHz uV */
- 970000 1200000
- 792000 1100000
- 396000 950000
- 198000 850000
- >;
- #cooling-cells = <2>; /* min followed by max */
- };
- ...
-};
-
-&i2c1 {
- ...
- /*
- * A simple fan controller which supports 10 speeds of operation
- * (represented as 0-9).
- */
- fan0: fan@48 {
- ...
- #cooling-cells = <2>; /* min followed by max */
- };
-};
-
-ocp {
- ...
- /*
- * A simple IC with a single bandgap temperature sensor.
- */
- bandgap0: bandgap@0000ed00 {
- ...
- #thermal-sensor-cells = <0>;
- };
-};
-
-thermal-zones {
- cpu_thermal: cpu-thermal {
- polling-delay-passive = <250>; /* milliseconds */
- polling-delay = <1000>; /* milliseconds */
-
- thermal-sensors = <&bandgap0>;
-
- trips {
- cpu_alert0: cpu-alert0 {
- temperature = <90000>; /* millicelsius */
- hysteresis = <2000>; /* millicelsius */
- type = "active";
- };
- cpu_alert1: cpu-alert1 {
- temperature = <100000>; /* millicelsius */
- hysteresis = <2000>; /* millicelsius */
- type = "passive";
- };
- cpu_crit: cpu-crit {
- temperature = <125000>; /* millicelsius */
- hysteresis = <2000>; /* millicelsius */
- type = "critical";
- };
- };
-
- cooling-maps {
- map0 {
- trip = <&cpu_alert0>;
- cooling-device = <&fan0 THERMAL_NO_LIMIT 4>;
- };
- map1 {
- trip = <&cpu_alert1>;
- cooling-device = <&fan0 5 THERMAL_NO_LIMIT>, <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
- };
- };
- };
-};
-
-In the example above, the ADC sensor (bandgap0) at address 0x0000ED00 is
-used to monitor the zone 'cpu-thermal' using its sole sensor. A fan
-device (fan0) is controlled via I2C bus 1, at address 0x48, and has ten
-different cooling states 0-9. It is used to remove the heat out of
-the thermal zone 'cpu-thermal' using its cooling states
-from its minimum to 4, when it reaches trip point 'cpu_alert0'
-at 90C, as an example of active cooling. The same cooling device is used at
-'cpu_alert1', but from 5 to its maximum state. The cpu@0 device is also
-linked to the same thermal zone, 'cpu-thermal', as a passive cooling device,
-using all its cooling states at trip point 'cpu_alert1',
-which is a trip point at 100C. On the thermal zone 'cpu-thermal', at the
-temperature of 125C, represented by the trip point 'cpu_crit', the silicon
-is not reliable anymore.
-
-(b) - IC with several internal sensors
-
-The example below describes how to deploy several thermal zones based off a
-single sensor IC, assuming it has several internal sensors. This is a common
-case on SoC designs with several internal IPs that may need different thermal
-requirements, and thus may have their own sensor to monitor or detect internal
-hotspots in their silicon.
-
-#include <dt-bindings/thermal/thermal.h>
-
-ocp {
- ...
- /*
- * A simple IC with several bandgap temperature sensors.
- */
- bandgap0: bandgap@0000ed00 {
- ...
- #thermal-sensor-cells = <1>;
- };
-};
-
-thermal-zones {
- cpu_thermal: cpu-thermal {
- polling-delay-passive = <250>; /* milliseconds */
- polling-delay = <1000>; /* milliseconds */
-
- /* sensor ID */
- thermal-sensors = <&bandgap0 0>;
-
- trips {
- /* each zone within the SoC may have its own trips */
- cpu_alert: cpu-alert {
- temperature = <100000>; /* millicelsius */
- hysteresis = <2000>; /* millicelsius */
- type = "passive";
- };
- cpu_crit: cpu-crit {
- temperature = <125000>; /* millicelsius */
- hysteresis = <2000>; /* millicelsius */
- type = "critical";
- };
- };
-
- cooling-maps {
- /* each zone within the SoC may have its own cooling */
- ...
- };
- };
-
- gpu_thermal: gpu-thermal {
- polling-delay-passive = <120>; /* milliseconds */
- polling-delay = <1000>; /* milliseconds */
-
- /* sensor ID */
- thermal-sensors = <&bandgap0 1>;
-
- trips {
- /* each zone within the SoC may have its own trips */
- gpu_alert: gpu-alert {
- temperature = <90000>; /* millicelsius */
- hysteresis = <2000>; /* millicelsius */
- type = "passive";
- };
- gpu_crit: gpu-crit {
- temperature = <105000>; /* millicelsius */
- hysteresis = <2000>; /* millicelsius */
- type = "critical";
- };
- };
-
- cooling-maps {
- /* each zone within the SoC may have its own cooling */
- ...
- };
- };
-
- dsp_thermal: dsp-thermal {
- polling-delay-passive = <50>; /* milliseconds */
- polling-delay = <1000>; /* milliseconds */
-
- /* sensor ID */
- thermal-sensors = <&bandgap0 2>;
-
- trips {
- /* each zone within the SoC may have its own trips */
- dsp_alert: dsp-alert {
- temperature = <90000>; /* millicelsius */
- hysteresis = <2000>; /* millicelsius */
- type = "passive";
- };
- dsp_crit: gpu-crit {
- temperature = <135000>; /* millicelsius */
- hysteresis = <2000>; /* millicelsius */
- type = "critical";
- };
- };
-
- cooling-maps {
- /* each zone within the SoC may have its own cooling */
- ...
- };
- };
-};
-
-In the example above, there is one bandgap IC which has the capability to
-monitor three sensors. The hardware has been designed so that sensors are
-placed on different places in the DIE to monitor different temperature
-hotspots: one for CPU thermal zone, one for GPU thermal zone and the
-other to monitor a DSP thermal zone.
-
-Thus, there is a need to assign each sensor provided by the bandgap IC
-to different thermal zones. This is achieved by means of using the
-#thermal-sensor-cells property and using the first cell of the sensor
-specifier as sensor ID. In the example, then, <bandgap 0> is used to
-monitor CPU thermal zone, <bandgap 1> is used to monitor GPU thermal
-zone and <bandgap 2> is used to monitor DSP thermal zone. Each zone
-may be uncorrelated, having its own dT/dt requirements, trips
-and cooling maps.
-
-
-(c) - Several sensors within one single thermal zone
-
-The example below illustrates how to use more than one sensor within
-one thermal zone.
-
-#include <dt-bindings/thermal/thermal.h>
-
-&i2c1 {
- ...
- /*
- * A simple IC with a single temperature sensor.
- */
- adc: sensor@49 {
- ...
- #thermal-sensor-cells = <0>;
- };
-};
-
-ocp {
- ...
- /*
- * A simple IC with a single bandgap temperature sensor.
- */
- bandgap0: bandgap@0000ed00 {
- ...
- #thermal-sensor-cells = <0>;
- };
-};
-
-thermal-zones {
- cpu_thermal: cpu-thermal {
- polling-delay-passive = <250>; /* milliseconds */
- polling-delay = <1000>; /* milliseconds */
-
- thermal-sensors = <&bandgap0>, /* cpu */
- <&adc>; /* pcb north */
-
- /* hotspot = 100 * bandgap - 120 * adc + 484 */
- coefficients = <100 -120 484>;
-
- trips {
- ...
- };
-
- cooling-maps {
- ...
- };
- };
-};
-
-In some cases, there is a need to use more than one sensor to extrapolate
-a thermal hotspot in the silicon. The above example illustrates this situation.
-For instance, it may be the case that a sensor external to CPU IP may be placed
-close to CPU hotspot and together with internal CPU sensor, it is used
-to determine the hotspot. Assuming this is the case for the above example,
-the hypothetical extrapolation rule would be:
- hotspot = 100 * bandgap - 120 * adc + 484
-
-In other context, the same idea can be used to add fixed offset. For instance,
-consider the hotspot extrapolation rule below:
- hotspot = 1 * adc + 6000
-
-In the above equation, the hotspot is always 6C higher than what is read
-from the ADC sensor. The binding would be then:
- thermal-sensors = <&adc>;
-
- /* hotspot = 1 * adc + 6000 */
- coefficients = <1 6000>;
-
-(d) - Board thermal
-
-The board thermal example below illustrates how to setup one thermal zone
-with many sensors and many cooling devices.
-
-#include <dt-bindings/thermal/thermal.h>
-
-&i2c1 {
- ...
- /*
- * An IC with several temperature sensor.
- */
- adc_dummy: sensor@50 {
- ...
- #thermal-sensor-cells = <1>; /* sensor internal ID */
- };
-};
-
-thermal-zones {
- batt-thermal {
- polling-delay-passive = <500>; /* milliseconds */
- polling-delay = <2500>; /* milliseconds */
-
- /* sensor ID */
- thermal-sensors = <&adc_dummy 4>;
-
- trips {
- ...
- };
-
- cooling-maps {
- ...
- };
- };
-
- board_thermal: board-thermal {
- polling-delay-passive = <1000>; /* milliseconds */
- polling-delay = <2500>; /* milliseconds */
-
- /* sensor ID */
- thermal-sensors = <&adc_dummy 0>, /* pcb top edge */
- <&adc_dummy 1>, /* lcd */
- <&adc_dummy 2>; /* back cover */
- /*
- * An array of coefficients describing the sensor
- * linear relation. E.g.:
- * z = c1*x1 + c2*x2 + c3*x3
- */
- coefficients = <1200 -345 890>;
-
- sustainable-power = <2500>;
-
- trips {
- /* Trips are based on resulting linear equation */
- cpu_trip: cpu-trip {
- temperature = <60000>; /* millicelsius */
- hysteresis = <2000>; /* millicelsius */
- type = "passive";
- };
- gpu_trip: gpu-trip {
- temperature = <55000>; /* millicelsius */
- hysteresis = <2000>; /* millicelsius */
- type = "passive";
- }
- lcd_trip: lcp-trip {
- temperature = <53000>; /* millicelsius */
- hysteresis = <2000>; /* millicelsius */
- type = "passive";
- };
- crit_trip: crit-trip {
- temperature = <68000>; /* millicelsius */
- hysteresis = <2000>; /* millicelsius */
- type = "critical";
- };
- };
-
- cooling-maps {
- map0 {
- trip = <&cpu_trip>;
- cooling-device = <&cpu0 0 2>;
- contribution = <55>;
- };
- map1 {
- trip = <&gpu_trip>;
- cooling-device = <&gpu0 0 2>;
- contribution = <20>;
- };
- map2 {
- trip = <&lcd_trip>;
- cooling-device = <&lcd0 5 10>;
- contribution = <15>;
- };
- };
- };
-};
-
-The above example is a mix of previous examples, a sensor IP with several internal
-sensors used to monitor different zones, one of them is composed by several sensors and
-with different cooling devices.
diff --git a/Documentation/features/core/jump-labels/arch-support.txt b/Documentation/features/core/jump-labels/arch-support.txt
index f8ec5c13cde4..894d9693b380 100644
--- a/Documentation/features/core/jump-labels/arch-support.txt
+++ b/Documentation/features/core/jump-labels/arch-support.txt
@@ -23,7 +23,7 @@
| openrisc: | TODO |
| parisc: | ok |
| powerpc: | ok |
- | riscv: | TODO |
+ | riscv: | ok |
| s390: | ok |
| sh: | TODO |
| sparc: | ok |
diff --git a/Documentation/features/debug/debug-vm-pgtable/arch-support.txt b/Documentation/features/debug/debug-vm-pgtable/arch-support.txt
index ca6bacb1e99e..53da483c8326 100644
--- a/Documentation/features/debug/debug-vm-pgtable/arch-support.txt
+++ b/Documentation/features/debug/debug-vm-pgtable/arch-support.txt
@@ -23,7 +23,7 @@
| openrisc: | TODO |
| parisc: | TODO |
| powerpc: | ok |
- | riscv: | TODO |
+ | riscv: | ok |
| s390: | ok |
| sh: | TODO |
| sparc: | TODO |
diff --git a/Documentation/features/sched/membarrier-sync-core/arch-support.txt b/Documentation/features/sched/membarrier-sync-core/arch-support.txt
index 68658a6f8c5b..47e6903f47a5 100644
--- a/Documentation/features/sched/membarrier-sync-core/arch-support.txt
+++ b/Documentation/features/sched/membarrier-sync-core/arch-support.txt
@@ -5,7 +5,7 @@
#
# Architecture requirements
#
-# * arm/arm64
+# * arm/arm64/powerpc
#
# Rely on implicit context synchronization as a result of exception return
# when returning from IPI handler, and when returning to user-space.
@@ -45,7 +45,7 @@
| nios2: | TODO |
| openrisc: | TODO |
| parisc: | TODO |
- | powerpc: | TODO |
+ | powerpc: | ok |
| riscv: | TODO |
| s390: | TODO |
| sh: | TODO |
diff --git a/Documentation/filesystems/quota.rst b/Documentation/filesystems/quota.rst
index a30cdd47c652..abd4303c546e 100644
--- a/Documentation/filesystems/quota.rst
+++ b/Documentation/filesystems/quota.rst
@@ -18,7 +18,7 @@ Quota limits (and amount of grace time) are set independently for each
filesystem.
For more details about quota design, see the documentation in quota-tools package
-(http://sourceforge.net/projects/linuxquota).
+(https://sourceforge.net/projects/linuxquota).
Quota netlink interface
=======================
@@ -31,11 +31,11 @@ the above events to userspace. There they can be captured by an application
and processed accordingly.
The interface uses generic netlink framework (see
-http://lwn.net/Articles/208755/ and http://people.suug.ch/~tgr/libnl/ for more
-details about this layer). The name of the quota generic netlink interface
-is "VFS_DQUOT". Definitions of constants below are in <linux/quota.h>.
-Since the quota netlink protocol is not namespace aware, quota netlink messages
-are sent only in initial network namespace.
+https://lwn.net/Articles/208755/ and http://www.infradead.org/~tgr/libnl/ for
+more details about this layer). The name of the quota generic netlink interface
+is "VFS_DQUOT". Definitions of constants below are in <linux/quota.h>. Since
+the quota netlink protocol is not namespace aware, quota netlink messages are
+sent only in initial network namespace.
Currently, the interface supports only one message type QUOTA_NL_C_WARNING.
This command is used to send a notification about any of the above mentioned
diff --git a/Documentation/filesystems/udf.rst b/Documentation/filesystems/udf.rst
index d9badbf285b2..f9489ddbb767 100644
--- a/Documentation/filesystems/udf.rst
+++ b/Documentation/filesystems/udf.rst
@@ -72,4 +72,4 @@ For the latest version and toolset see:
Documentation on UDF and ECMA 167 is available FREE from:
- http://www.osta.org/
- - http://www.ecma-international.org/
+ - https://www.ecma-international.org/
diff --git a/Documentation/memory-barriers.txt b/Documentation/memory-barriers.txt
index 4e55aba3eb4a..96186332e5f4 100644
--- a/Documentation/memory-barriers.txt
+++ b/Documentation/memory-barriers.txt
@@ -1935,6 +1935,20 @@ There are some more advanced barrier functions:
relaxed I/O accessors and the Documentation/DMA-API.txt file for more
information on consistent memory.
+ (*) pmem_wmb();
+
+ This is for use with persistent memory to ensure that stores for which
+ modifications are written to persistent storage reached a platform
+ durability domain.
+
+ For example, after a non-temporal write to pmem region, we use pmem_wmb()
+ to ensure that stores have reached a platform durability domain. This ensures
+ that stores have updated persistent storage before any data access or
+ data transfer caused by subsequent instructions is initiated. This is
+ in addition to the ordering done by wmb().
+
+ For load from persistent memory, existing read memory barriers are sufficient
+ to ensure read ordering.
===============================
IMPLICIT KERNEL MEMORY BARRIERS
diff --git a/Documentation/powerpc/cpu_families.rst b/Documentation/powerpc/cpu_families.rst
index 1e063c5440c3..9b84e045e713 100644
--- a/Documentation/powerpc/cpu_families.rst
+++ b/Documentation/powerpc/cpu_families.rst
@@ -9,7 +9,9 @@ and are supported by arch/powerpc.
Book3S (aka sPAPR)
------------------
-- Hash MMU
+- Hash MMU (except 603 and e300)
+- Software loaded TLB (603 and e300)
+- Selectable Software loaded TLB in addition to hash MMU (755, 7450, e600)
- Mix of 32 & 64 bit::
+--------------+ +----------------+
@@ -24,9 +26,9 @@ Book3S (aka sPAPR)
| |
| |
v v
- +--------------+ +----------------+ +-------+
- | 604 | | 750 (G3) | ---> | 750CX |
- +--------------+ +----------------+ +-------+
+ +--------------+ +-----+ +----------------+ +-------+
+ | 604 | | 755 | <--- | 750 (G3) | ---> | 750CX |
+ +--------------+ +-----+ +----------------+ +-------+
| | |
| | |
v v v
diff --git a/Documentation/powerpc/mpc52xx.rst b/Documentation/powerpc/mpc52xx.rst
index 8676ac63e077..30260707c3fe 100644
--- a/Documentation/powerpc/mpc52xx.rst
+++ b/Documentation/powerpc/mpc52xx.rst
@@ -2,7 +2,7 @@
Linux 2.6.x on MPC52xx family
=============================
-For the latest info, go to http://www.246tNt.com/mpc52xx/
+For the latest info, go to https://www.246tNt.com/mpc52xx/
To compile/use :
diff --git a/Documentation/powerpc/syscall64-abi.rst b/Documentation/powerpc/syscall64-abi.rst
index e49f69f941b9..46caaadbb029 100644
--- a/Documentation/powerpc/syscall64-abi.rst
+++ b/Documentation/powerpc/syscall64-abi.rst
@@ -5,6 +5,15 @@ Power Architecture 64-bit Linux system call ABI
syscall
=======
+Invocation
+----------
+The syscall is made with the sc instruction, and returns with execution
+continuing at the instruction following the sc instruction.
+
+If PPC_FEATURE2_SCV appears in the AT_HWCAP2 ELF auxiliary vector, the
+scv 0 instruction is an alternative that may provide better performance,
+with some differences to calling sequence.
+
syscall calling sequence\ [1]_ matches the Power Architecture 64-bit ELF ABI
specification C function calling sequence, including register preservation
rules, with the following differences.
@@ -12,16 +21,23 @@ rules, with the following differences.
.. [1] Some syscalls (typically low-level management functions) may have
different calling sequences (e.g., rt_sigreturn).
-Parameters and return value
----------------------------
+Parameters
+----------
The system call number is specified in r0.
There is a maximum of 6 integer parameters to a syscall, passed in r3-r8.
-Both a return value and a return error code are returned. cr0.SO is the return
-error code, and r3 is the return value or error code. When cr0.SO is clear,
-the syscall succeeded and r3 is the return value. When cr0.SO is set, the
-syscall failed and r3 is the error code that generally corresponds to errno.
+Return value
+------------
+- For the sc instruction, both a value and an error condition are returned.
+ cr0.SO is the error condition, and r3 is the return value. When cr0.SO is
+ clear, the syscall succeeded and r3 is the return value. When cr0.SO is set,
+ the syscall failed and r3 is the error value (that normally corresponds to
+ errno).
+
+- For the scv 0 instruction, the return value indicates failure if it is
+ -4095..-1 (i.e., it is >= -MAX_ERRNO (-4095) as an unsigned comparison),
+ in which case the error value is the negated return value.
Stack
-----
@@ -34,22 +50,23 @@ Register preservation rules match the ELF ABI calling sequence with the
following differences:
=========== ============= ========================================
+--- For the sc instruction, differences with the ELF ABI ---
r0 Volatile (System call number.)
r3 Volatile (Parameter 1, and return value.)
r4-r8 Volatile (Parameters 2-6.)
-cr0 Volatile (cr0.SO is the return error condition)
+cr0 Volatile (cr0.SO is the return error condition.)
cr1, cr5-7 Nonvolatile
lr Nonvolatile
+
+--- For the scv 0 instruction, differences with the ELF ABI ---
+r0 Volatile (System call number.)
+r3 Volatile (Parameter 1, and return value.)
+r4-r8 Volatile (Parameters 2-6.)
=========== ============= ========================================
All floating point and vector data registers as well as control and status
registers are nonvolatile.
-Invocation
-----------
-The syscall is performed with the sc instruction, and returns with execution
-continuing at the instruction following the sc instruction.
-
Transactional Memory
--------------------
Syscall behavior can change if the processor is in transactional or suspended
@@ -75,6 +92,7 @@ auxiliary vector.
returning to the caller. This case is not well defined or supported, so this
behavior should not be relied upon.
+scv 0 syscalls will always behave as PPC_FEATURE2_HTM_NOSC.
vsyscall
========
diff --git a/Documentation/scsi/advansys.rst b/Documentation/scsi/advansys.rst
index e0367e179696..7ea12b100ff4 100644
--- a/Documentation/scsi/advansys.rst
+++ b/Documentation/scsi/advansys.rst
@@ -125,7 +125,7 @@ The following constants can be defined in the source file.
c. klogd is started with the appropriate -c parameter
(e.g. klogd -c 8)
- This will cause printk() messages to be be displayed on the
+ This will cause printk() messages to be displayed on the
current console. Refer to the klogd(8) and syslogd(8) man pages
for details.
diff --git a/Documentation/scsi/scsi-parameters.rst b/Documentation/scsi/scsi-parameters.rst
index 9aba897c97ac..e5f68b431f5c 100644
--- a/Documentation/scsi/scsi-parameters.rst
+++ b/Documentation/scsi/scsi-parameters.rst
@@ -94,7 +94,7 @@ parameters may be changed at runtime by the command
(/proc/sys/dev/scsi/logging_level).
There is also a nice 'scsi_logging_level' script in the
S390-tools package, available for download at
- http://www-128.ibm.com/developerworks/linux/linux390/s390-tools-1.5.4.html
+ https://github.com/ibm-s390-tools/s390-tools/blob/master/scripts/scsi_logging_level
scsi_mod.scan= [SCSI] sync (default) scans SCSI busses as they are
discovered. async scans them in kernel threads,
diff --git a/Documentation/virt/kvm/api.rst b/Documentation/virt/kvm/api.rst
index cdfd98155311..eb3a1316f03e 100644
--- a/Documentation/virt/kvm/api.rst
+++ b/Documentation/virt/kvm/api.rst
@@ -2160,9 +2160,12 @@ registers, find a list below:
PPC KVM_REG_PPC_MMCRA 64
PPC KVM_REG_PPC_MMCR2 64
PPC KVM_REG_PPC_MMCRS 64
+ PPC KVM_REG_PPC_MMCR3 64
PPC KVM_REG_PPC_SIAR 64
PPC KVM_REG_PPC_SDAR 64
PPC KVM_REG_PPC_SIER 64
+ PPC KVM_REG_PPC_SIER2 64
+ PPC KVM_REG_PPC_SIER3 64
PPC KVM_REG_PPC_PMC1 32
PPC KVM_REG_PPC_PMC2 32
PPC KVM_REG_PPC_PMC3 32