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Document the LTC2983 temperature sensor devicetree bindings.
Tweaked by Jonathan to take into account the lack of signed output
being maintained by dtc yaml output. For now a comment added
that the unsigned array should actually be signed.
Signed-off-by: Nuno Sá <nuno.sa@analog.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
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This patch added device tree binding info for MAX31856 driver.
Signed-off-by: Paresh Chaudhary <paresh.chaudhary@rockwellcollins.com>
Signed-off-by: Matt Weber <matthew.weber@rockwellcollins.com>
Signed-off-by: Patrick Havelange <patrick.havelange@essensium.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
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This patch introduces common thermocouple types used by various
temperature sensors. Also a brief documentation explaining this
"thermocouple-type" property.
Signed-off-by: Patrick Havelange <patrick.havelange@essensium.com>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
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'interrupt-parent' is often documented as part of define bindings, but
it is really outside the scope of a device binding. It's never required
in a given node as it is often inherited from a parent node. Or it can
be implicit if a parent node is an 'interrupt-controller' node. So
remove it from all the binding files.
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: devicetree@vger.kernel.org
Signed-off-by: Rob Herring <robh@kernel.org>
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Add device tree bindings for MLX90632 IR temperature sensor.
Signed-off-by: Crt Mori <cmo@melexis.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
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Add device tree bindings for Measurement Specialties TSYS01 temperature sensor
Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
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This patch adds optional interrupt binding support for TI TMP007 - IR thermopiler sensor
Signed-off-by: Manivannan Sadhasivam <manivannanece23@gmail.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
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This patch adds support for TI TMP007 - 16 bit IR thermopile sensor with integrated Math engine.
Sensor takes care of calculating the object temperature with the help of calibrated constants stored in non-volatile memory,
thereby reducing the calculation overhead.
Signed-off-by: Manivannan Sadhasivam <manivannanece23@gmail.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
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Add initial driver support for MAX6675, and MAX31855 thermocouple chips.
Cc: Marek Vasut <marex@denx.de>
Cc: Matt Porter <mporter@konsulko.com>
Signed-off-by: Matt Ranostay <mranostay@gmail.com>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
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Add support for system sleep and runtime power management.
To wake up the device, the SDA line should be held low for at least 33ms
while SCL is high. As this is not possible using the i2c API (and not
supported by all i2c adapters), a GPIO connected to the SDA line is
needed. The GPIO is named "wakeup" and can be specified in a device
tree with the "wakeup-gpios" binding.
If the wake-up GPIO is not given, disable power management for the
device. Entering sleep requires an SMBus byte access, hence power
management is also disabled if byte access is not supported by the
adapter.
Signed-off-by: Vianney le Clément de Saint-Marcq <vianney.leclement@essensium.com>
Cc: Arnout Vandecappelle (Essensium/Mind) <arnout@mind.be>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
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Also introduce "melexis" as a vendor prefix for device tree bindings.
Signed-off-by: Vianney le Clément de Saint-Marcq <vianney.leclement@essensium.com>
Cc: Arnout Vandecappelle (Essensium/Mind) <arnout@mind.be>
Signed-off-by: Jonathan Cameron <jic23@kernel.org>
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