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2024-04-06dt-bindings: iio: accel: adxl345: Add spi-3wireLothar Rubusch
Add spi-3wire because the device allows to be configured for spi 3-wire communication. Signed-off-by: Lothar Rubusch <l.rubusch@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240401194906.56810-5-l.rubusch@gmail.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-03-28dt-bindings: iio: dac: ti,dac5571: Add DAC081C081 supportLaurent Pinchart
The DAC081C081 is a TI DAC whose software interface is compatible with the DAC5571. It is the 8-bit version of the DAC121C081, already supported by the DAC5571 bindings. Extends the bindings to support this chip. Signed-off-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com> Reviewed-by: Sean Nyekjaer <sean@geanix.com> Link: https://lore.kernel.org/r/20240325203245.31660-2-laurent.pinchart@ideasonboard.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-03-28dt-bindings: iio: health: maxim,max30102: add max30101Javier Carrasco
The Maxim max30101 is the replacement for the max30105, which is no longer recommended for future designs. The max30101 does not require new properties, and it can be described with the existing ones for the max30105, which will be used as a fallback compatible. Signed-off-by: Javier Carrasco <javier.carrasco.cruz@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240324-max30101-v2-1-611deb510c97@gmail.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-03-25dt-bindings: iio: humidity: hdc3020: add reset-gpiosJavier Carrasco
The HDC3020 provides an active low reset signal that is still not described in the bindings. Add reset-gpios to the bindings and the example. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Javier Carrasco <javier.carrasco.cruz@gmail.com> Link: https://lore.kernel.org/r/20240303-hdc3020-pm-v3-2-48bc02b5241b@gmail.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-03-25dt-bindings: iio: adc: add ad7944 ADCsDavid Lechner
This adds a new binding for the Analog Devices, Inc. AD7944, AD7985, and AD7986 ADCs. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: David Lechner <dlechner@baylibre.com> Link: https://lore.kernel.org/r/20240304-ad7944-mainline-v5-1-f0a38cea8901@baylibre.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-03-25dt-bindings: adc: ad7173: add support for additional modelsDumitru Ceclan
Add support for: AD7172-2, AD7175-8, AD7177-2. AD7172-4 does not feature an internal reference, check for external reference presence. Signed-off-by: Dumitru Ceclan <mitrutzceclan@gmail.com> Reviewed-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20240306110956.13167-2-mitrutzceclan@gmail.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-03-25dt-bindings: iio: light: Avago APDS9306Subhajit Ghosh
Extend avago,apds9300.yaml schema file to support apds9306 device. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Subhajit Ghosh <subhajit.ghosh@tweaklogic.com> Link: https://lore.kernel.org/r/20240309105031.10313-5-subhajit.ghosh@tweaklogic.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-03-25dt-bindings: iio: light: adps9300: Update interrupt definitionsSubhajit Ghosh
Include irq.h and irq level macro in the example for readability Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Subhajit Ghosh <subhajit.ghosh@tweaklogic.com> Link: https://lore.kernel.org/r/20240309105031.10313-4-subhajit.ghosh@tweaklogic.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-03-25dt-bindings: iio: light: adps9300: Add missing vdd-supplySubhajit Ghosh
All devices covered by the binding have a vdd supply. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Subhajit Ghosh <subhajit.ghosh@tweaklogic.com> Link: https://lore.kernel.org/r/20240309105031.10313-3-subhajit.ghosh@tweaklogic.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-03-25dt-bindings: iio: light: Merge APDS9300 and APDS9960 schemasSubhajit Ghosh
Merge very similar schemas for APDS9300 and APDS9960. Suggested-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/all/4e785d2e-d310-4592-a75a-13549938dcef@linaro.org/ Signed-off-by: Subhajit Ghosh <subhajit.ghosh@tweaklogic.com> Link: https://lore.kernel.org/r/20240309105031.10313-2-subhajit.ghosh@tweaklogic.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-03-25dt-bindings: adc: add AD7173Dumitru Ceclan
The AD7173 family offer a complete integrated Sigma-Delta ADC solution which can be used in high precision, low noise single channel applications or higher speed multiplexed applications. The Sigma-Delta ADC is intended primarily for measurement of signals close to DC but also delivers outstanding performance with input bandwidths out to ~10kHz. Reviewed-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Dumitru Ceclan <mitrutzceclan@gmail.com> Link: https://lore.kernel.org/r/20240228110622.25114-1-mitrutzceclan@gmail.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-28dt-bindings: iio: gyroscope: bosch,bmg160: add spi-max-frequencyMarco Felsch
Make use of the common spi-peripheral-props.yaml to pull in the common spi device properties and limit the spi-max-frequency to 10 MHz as this is the max. frequency if VDDIO >= 1.62V. Note all listed devices can either operate in I2C or in SPI mode. Signed-off-by: Marco Felsch <m.felsch@pengutronix.de> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240221174305.3423039-1-m.felsch@pengutronix.de Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-28dt-bindings: iio: adc: imx93: drop the 4th interruptPeng Fan
Per i.MX93 Reference Mannual Rev.4, 12/2013, there is no interrupt 268, so drop it. Signed-off-by: Peng Fan <peng.fan@nxp.com> Acked-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20240226130826.3824251-1-peng.fan@oss.nxp.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-28dt-bindings: iio: adc: drop redundant type from labelKrzysztof Kozlowski
dtschema defines label as string, so $ref in other bindings is redundant. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240226123004.91061-1-krzysztof.kozlowski@linaro.org Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-28dt-bindings: iio: ti,tmp117: add optional label propertyMarco Felsch
Add the support to provide an optional label like we do for ADC channels to identify the device more easily. Signed-off-by: Marco Felsch <m.felsch@pengutronix.de> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20240226121234.545662-1-m.felsch@pengutronix.de Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-28dt-bindings: iio: magnetometer: Add Voltafield AF8133JIcenowy Zheng
Voltafield AF8133J is a simple magnetometer sensor produced by Voltafield Technology Corp, with dual power supplies (one for core and one for I/O) and active-low reset pin. The sensor has configurable range 1.2 - 2.2 mT and a software controlled standby mode. Add a device tree binding for it. Signed-off-by: Icenowy Zheng <icenowy@aosc.io> Signed-off-by: Ondřej Jirman <megi@xff.cz> Reviewed-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20240222011341.3232645-3-megi@xff.cz Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-28dt-bindings: iio: light: vishay,veml6075: make vdd-supply requiredJavier Carrasco
The VEML6075 requires a single supply to operate. The property already exists in the bindings and it is used in the example, but it is still not on the list of required properties. Signed-off-by: Javier Carrasco <javier.carrasco.cruz@gmail.com> Acked-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20240223-veml6075_vdd-v1-1-ac76509b1998@gmail.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-28dt-bindings: iio: adc: adding support for PAC193XMarius Cristea
This is the device tree schema for iio driver for Microchip PAC193X series of Power Monitors with Accumulator. Signed-off-by: Marius Cristea <marius.cristea@microchip.com> Reviewed-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20240222164206.65700-2-marius.cristea@microchip.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-28dt-bindings: iio: hmc425a: add entry for LTC6373Dumitru Ceclan
The LTC6373 is a silicon, 3-bit Fully-Differential digital instrumentation amplifier that supports the following programmable gains (Vout/Vin): G = 0.25, 0.5, 1, 2, 4, 8, 16 + Shutdown. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Dumitru Ceclan <mitrutzceclan@gmail.com> Link: https://lore.kernel.org/r/20240220153553.2432-5-mitrutzceclan@gmail.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-28dt-bindings: iio: hmc425a: add conditional GPIO array size constraintsDumitru Ceclan
ADRF5740 and HMC540S have a 4 bit parallel interface. Update ctrl-gpios description and min/maxItems values depending on the matched compatible to correctly reflect the hardware properties. Fixes: 79f2ff6461e7 ("dt-bindings: iio: hmc425a: add entry for ADRF5740 Attenuator") Fixes: 20f87a9a26be ("dt-bindings: iio: hmc425a: add entry for HMC540S") Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Dumitru Ceclan <mitrutzceclan@gmail.com> Link: https://lore.kernel.org/r/20240220153553.2432-3-mitrutzceclan@gmail.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-28dt-bindings: iio: humidity: hdc20x0: add optional interrupts propertyJosua Mayer
HDC2010 and HDC2080 humidity sensors both have an interrupt / data-ready signal which can be used for signaling to the host. Add binding for "interrupts" property so that boards wiring this signal may describe the connection. Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Josua Mayer <josua@solid-run.com> Link: https://lore.kernel.org/r/20240219-iio-hdc20x0-interrupt-binding-v7-1-c8ffb39c3768@solid-run.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-28dt-bindings: iio: ti,tmp117: add vcc supply bindingThomas Haemmerle
Add the binding to specify the vcc supply. We can't make it required since this would break the backward compatibility. Reviewed-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Thomas Haemmerle <thomas.haemmerle@leica-geosystems.com> Signed-off-by: Marco Felsch <m.felsch@pengutronix.de> Link: https://lore.kernel.org/r/20240219131114.134607-1-m.felsch@pengutronix.de Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-19dt-bindings: iio: adc: ti-ads1298: Add bindingsMike Looijmans
Bindings for the TI ADS1298 medical ADC. This device is typically used for ECG and similar measurements. Supports data acquisition at configurable scale and sampling frequency. The device has so many options for connecting stuff, at this point the bindings aren't nearly complete but partial bindings are better than no bindings at all. Signed-off-by: Mike Looijmans <mike.looijmans@topic.nl> Reviewed-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20240216153020.485201-1-mike.looijmans@topic.nl Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-19dt-bindings: iio: pressure: honeywell,hsc030pa.yaml add spi propsPetre Rodan
Add spi-peripheral-props.yaml requirement needed by the spi-max-frequency property. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Petre Rodan <petre.rodan@subdimension.ro> Link: https://lore.kernel.org/r/20240211075645.28777-2-petre.rodan@subdimension.ro Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-19dt-bindings: adc: axi-adc: update bindings for backend frameworkNuno Sa
'adi,adc-dev' is now deprecated and must not be used anymore. Hence, also remove it from being required. The reason why it's being deprecated is because the axi-adc CORE is now an IIO service provider hardware (IIO backends) for consumers to make use of. Before, the logic with 'adi,adc-dev' was the opposite (it was kind of consumer referencing other nodes/devices) and that proved to be wrong and to not scale. Now, IIO consumers of this hardware are expected to reference it using the io-backends property. Hence, the new '#io-backend-cells' is being added so the device is easily identified as a provider. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Nuno Sa <nuno.sa@analog.com> Link: https://lore.kernel.org/r/20240210-iio-backend-v11-2-f5242a5fb42a@analog.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-19dt-bindings: adc: ad9467: add new io-backend propertyNuno Sa
The ad9467 will make use of the new IIO backend framework which is a provider - consumer interface where IIO backends provide services to consumers. As such, and being this device a consumer, add the new generic io-backend property to the bindings. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Nuno Sa <nuno.sa@analog.com> Link: https://lore.kernel.org/r/20240210-iio-backend-v11-1-f5242a5fb42a@analog.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-17dt-bindings: iio: humidity: hdc3020: add interrupt bindings in exampleDimitri Fedrau
Add interrupt bindings in example. Signed-off-by: Dimitri Fedrau <dima.fedrau@gmail.com> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20240214085350.19382-3-dima.fedrau@gmail.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-17dt-bindings: iio: afe: voltage-divider: Add io-channel-cellsNaresh Solanki
Enable the voltage divider to both receive and provide measurement services by adding #io-channel-cells. This is especially valuable in scenarios where an ADC has an analog frontend, like a voltage divider, and obtaining its raw value isn't interesting. It is desired to get the real voltage before the voltage divider. Signed-off-by: Naresh Solanki <naresh.solanki@9elements.com> Reviewed-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20240206105502.648255-1-naresh.solanki@9elements.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-17dt-bindings: iio: imu: st_lsm6dsx: add asm330lhhxg1Lorenzo Bianconi
Add device bindings for asm330lhhxg1 IMU sensor. The lsm6dsr supports the features and functionality provided by the asm330lhhxg1 via identical interfaces and so is a suitable fallback compatible. Signed-off-by: Lorenzo Bianconi <lorenzo@kernel.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/942452ec9626bc1166501cec0fa88c369e28ec6f.1706961432.git.lorenzo@kernel.org Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-02-17dt-bindings: iio: frequency: add admfm2000Kim Seer Paller
Dual microwave down converter module with input RF and LO frequency ranges from 0.5 to 32 GHz and an output IF frequency range from 0.1 to 8 GHz. It consists of a LNA, mixer, IF filter, DSA, and IF amplifier for each down conversion path. Signed-off-by: Kim Seer Paller <kimseer.paller@analog.com> Reviewed-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20240123081059.5746-1-kimseer.paller@analog.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-01-23dt-bindings: iio: adc: rtq6056: add support for the whole RTQ6056 familyChiYuan Huang
Add compatible support for RTQ6053 and RTQ6059. Signed-off-by: ChiYuan Huang <cy_huang@richtek.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/c1abb261bb00846f456eb8fe9b5919f59f287c24.1704676198.git.cy_huang@richtek.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-01-22dt-bindings: iio: pressure: honeywell,mprls0025pa.yaml add spi busPetre Rodan
Add spi based example. Add spi-max-frequency property required by chip specifications. Add additional maintainer. Co-developed-by: Andreas Klinger <ak@it-klinger.de> Signed-off-by: Andreas Klinger <ak@it-klinger.de> Signed-off-by: Petre Rodan <petre.rodan@subdimension.ro> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20231229092445.30180-4-petre.rodan@subdimension.ro Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-01-22dt-bindings: iio: pressure: honeywell,mprls0025pa.yaml add pressure-tripletPetre Rodan
Change order of properties in order for the end user to hopefully ignore pmin-pascal and pmax-pascal which are superseded by pressure-triplet. Add pressure-triplet property which automatically initializes pmin-pascal and pmax-pascal inside the driver. Rework honeywell,pmXX-pascal requirements based on feedback from Jonathan and Conor. Co-developed-by: Andreas Klinger <ak@it-klinger.de> Signed-off-by: Andreas Klinger <ak@it-klinger.de> Signed-off-by: Petre Rodan <petre.rodan@subdimension.ro> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20231229092445.30180-3-petre.rodan@subdimension.ro Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-01-22dt-bindings: iio: pressure: honeywell,mprls0025pa.yaml improvementsPetre Rodan
Define enum inside the honeywell,transfer-function property block. Set the correct irq edge in the example block. Based on the datasheet, in table 13 on page 11: "End-of-conversion indicator: This pin is set high when a measurement and calculation have been completed and the data is ready to be clocked out" Add description on End-of-conversion interrupt. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Co-developed-by: Andreas Klinger <ak@it-klinger.de> Signed-off-by: Andreas Klinger <ak@it-klinger.de> Signed-off-by: Petre Rodan <petre.rodan@subdimension.ro> Link: https://lore.kernel.org/r/20231229092445.30180-2-petre.rodan@subdimension.ro Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-01-22dt-bindings: iio: light: as73211: add support for as7331Javier Carrasco
This device has the same properties and I2C addresses as the as73211. The only difference between them is the photodiodes they use internally, which in this case is irrelevant for the bindings. Acked-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Javier Carrasco <javier.carrasco.cruz@gmail.com> Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2024-01-17Merge tag 'char-misc-6.8-rc1' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc Pull char/misc and other driver updates from Greg KH: "Here is the big set of char/misc and other driver subsystem changes for 6.8-rc1. Other than lots of binder driver changes (as you can see by the merge conflicts) included in here are: - lots of iio driver updates and additions - spmi driver updates - eeprom driver updates - firmware driver updates - ocxl driver updates - mhi driver updates - w1 driver updates - nvmem driver updates - coresight driver updates - platform driver remove callback api changes - tags.sh script updates - bus_type constant marking cleanups - lots of other small driver updates All of these have been in linux-next for a while with no reported issues" * tag 'char-misc-6.8-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc: (341 commits) android: removed duplicate linux/errno uio: Fix use-after-free in uio_open drivers: soc: xilinx: add check for platform firmware: xilinx: Export function to use in other module scripts/tags.sh: remove find_sources scripts/tags.sh: use -n to test archinclude scripts/tags.sh: add local annotation scripts/tags.sh: use more portable -path instead of -wholename scripts/tags.sh: Update comment (addition of gtags) firmware: zynqmp: Convert to platform remove callback returning void firmware: turris-mox-rwtm: Convert to platform remove callback returning void firmware: stratix10-svc: Convert to platform remove callback returning void firmware: stratix10-rsu: Convert to platform remove callback returning void firmware: raspberrypi: Convert to platform remove callback returning void firmware: qemu_fw_cfg: Convert to platform remove callback returning void firmware: mtk-adsp-ipc: Convert to platform remove callback returning void firmware: imx-dsp: Convert to platform remove callback returning void firmware: coreboot_table: Convert to platform remove callback returning void firmware: arm_scpi: Convert to platform remove callback returning void firmware: arm_scmi: Convert to platform remove callback returning void ...
2024-01-12Merge tag 'devicetree-for-6.8' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux Pull devicetree updates from Rob Herring: - Convert FPGA bridge, all TPMs (finally), and Rockchip HDMI bindings to schemas - Improvements in Samsung GPU schemas - A few more cases of dropping unneeded quotes in schemas - Merge QCom idle-states txt binding into common idle-states schema - Add X1E80100, SM8650, SM8650, and SDX75 SoCs to QCom Power Domain Controller - Add NXP i.mx8dl to SCU PD - Add synaptics r63353 panel controller - Clarify the wording around the use of 'wakeup-source' property - Add a DTS coding style doc - Add smi vendor prefix - Fix DT_SCHEMA_FILES incorrect matching of paths outside the kernel tree - Disable sysfb (e.g. EFI FB) when simple-framebuffer node is present - Fix double free in of_parse_phandle_with_args_map() - A couple of kerneldoc fixes * tag 'devicetree-for-6.8' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (37 commits) of: unittest: Fix of_count_phandle_with_args() expected value message dt-bindings: fpga: altera: Convert bridge bindings to yaml dt-bindings: fpga: Convert bridge binding to yaml dt-bindings: vendor-prefixes: Add smi dt-bindings: power: Clarify wording for wakeup-source property of: Fix double free in of_parse_phandle_with_args_map dt-bindings: ignore paths outside kernel for DT_SCHEMA_FILES drivers: of: Fixed kernel doc warning dt-bindings: tpm: Document Microsoft fTPM bindings dt-bindings: tpm: Convert IBM vTPM bindings to DT schema dt-bindings: tpm: Convert Google Cr50 bindings to DT schema dt-bindings: tpm: Consolidate TCG TIS bindings dt-bindings: display: rockchip,inno-hdmi: Document RK3128 compatible dt-bindings: arm: Add remote etm dt-binding dt-bindings: mmc: sdhci-pxa: Fix 'regs' typo media: dt-bindings: samsung,s5p-mfc: Fix iommu properties schemas dt-bindings: display: panel: Add synaptics r63353 panel controller dt-bindings: arm: merge qcom,idle-state with idle-state dt-bindings: drm: rockchip: convert inno_hdmi-rockchip.txt to yaml dt-bindings: cache: qcom,llcc: correct QDU1000 reg entries ...
2023-12-26dt-bindings: iio: Add AD7091R-8Marcelo Schmitt
Add device tree documentation for AD7091R-8. Reviewed-by: Conor Dooley <conor.dooley@microchip.com> Signed-off-by: Marcelo Schmitt <marcelo.schmitt@analog.com> Link: https://lore.kernel.org/r/632eb34801ae54feda453b6a65d60fc8ac2891fd.1703013352.git.marcelo.schmitt1@gmail.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2023-12-21dt-bindings: iio: dac: add MCP4821Anshul Dalal
Adds support for MCP48xx series of DACs. Datasheet: https://ww1.microchip.com/downloads/en/DeviceDoc/22244B.pdf #MCP48x1 Datasheet: https://ww1.microchip.com/downloads/en/DeviceDoc/20002249B.pdf #MCP48x2 Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Anshul Dalal <anshulusr@gmail.com> Link: https://lore.kernel.org/r/20231220151954.154595-1-anshulusr@gmail.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2023-12-17dt-bindings: iio: chemical: add aosong,ags02maAnshul Dalal
Add bindings for Aosong AGS02MA TVOC sensor. The sensor communicates over i2c with the default address 0x1a. TVOC values can be read in the units of ppb and ug/m^3 at register 0x00. Datasheet: https://asairsensors.com/wp-content/uploads/2021/09/AGS02MA.pdf Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Anshul Dalal <anshulusr@gmail.com> Link: https://lore.kernel.org/r/20231215162312.143568-2-anshulusr@gmail.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2023-12-11dt-bindings: iio: humidity: Add TI HDC302x supportLi peiyu
Add device tree bindings for HDC3020/HDC3021/HDC3022 humidity and temperature sensors. Signed-off-by: Li peiyu <579lpy@gmail.com> Reviewed-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20231211123101.9868-1-579lpy@gmail.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2023-12-11dt-bindings: iio: light: add ltr390Anshul Dalal
Add binding for Lite-On LTR390 which is an Ambient/UV light sensor that communicates over i2c with an address of 0x53. Datasheet: https://optoelectronics.liteon.com/upload/download/DS86-2015-0004/LTR-390UV_Final_%20DS_V1%201.pdf Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Anshul Dalal <anshulusr@gmail.com> Link: https://lore.kernel.org/r/20231208102211.413019-1-anshulusr@gmail.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2023-12-11dt-bindings: iio: pressure: add honeywell,hsc030Petre Rodan
Adds binding for digital Honeywell TruStability HSC and SSC series pressure and temperature sensors. Communication is one way. The sensor only requires 4 bytes worth of clock pulses on both i2c and spi in order to push the data out. The i2c address is hardcoded and depends on the part number. There is no additional GPIO control. driver is based on iio/togreg Datasheet: https://prod-edam.honeywell.com/content/dam/honeywell-edam/sps/siot/en-us/products/sensors/pressure-sensors/board-mount-pressure-sensors/trustability-hsc-series/documents/sps-siot-trustability-hsc-series-high-accuracy-board-mount-pressure-sensors-50099148-a-en-ciid-151133.pdf [HSC] Datasheet: https://prod-edam.honeywell.com/content/dam/honeywell-edam/sps/siot/en-us/products/sensors/pressure-sensors/board-mount-pressure-sensors/trustability-ssc-series/documents/sps-siot-trustability-ssc-series-standard-accuracy-board-mount-pressure-sensors-50099533-a-en-ciid-151134.pdf [SSC] Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Petre Rodan <petre.rodan@subdimension.ro> Link: https://lore.kernel.org/r/20231207164634.11998-1-petre.rodan@subdimension.ro Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2023-12-11dt-bindings: iio: temperature: add MLX90635 deviceCrt Mori
Add device tree bindings for MLX90635 Infra Red contactless temperature sensor. Signed-off-by: Crt Mori <cmo@melexis.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/0313c3b9f7490c32891627feb5ef35d5e5d9aae9.1701872051.git.cmo@melexis.com Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2023-12-06dt-bindings: iio/adc: qcom,spmi-vadc: clean up examplesJohan Hovold
Clean up the VADC examples by dropping a comment, dropping unnecessary labels and adding newline separators. Signed-off-by: Johan Hovold <johan+linaro@kernel.org> Acked-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20231130171628.12257-7-johan+linaro@kernel.org Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2023-12-06dt-bindings: iio/adc: qcom,spmi-vadc: fix example node namesJohan Hovold
The VADC is a child of an SPMI PMIC, which in turn sits on an SPMI bus. Fixes: 74e903461b17 ("dt-bindings: iio: adc: qcom,spmi-vadc: extend example") Fixes: 5a471662b5d9 ("iio: adc: Convert the QCOM SPMI ADC bindings to .yaml format") Signed-off-by: Johan Hovold <johan+linaro@kernel.org> Acked-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20231130171628.12257-6-johan+linaro@kernel.org Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2023-12-06dt-bindings: iio/adc: qcom,spmi-rradc: clean up exampleJohan Hovold
Clean up the RRADC example by dropping an unnecessary label and removing stray white space. Signed-off-by: Johan Hovold <johan+linaro@kernel.org> Acked-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20231130171628.12257-5-johan+linaro@kernel.org Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2023-12-06dt-bindings: iio/adc: qcom,spmi-iadc: clean up exampleJohan Hovold
Clean up the IADC example by adding a newline separator, dropping an unnecessary label and removing stray white space. Signed-off-by: Johan Hovold <johan+linaro@kernel.org> Acked-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20231130171628.12257-4-johan+linaro@kernel.org Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2023-12-06dt-bindings: iio/adc: qcom,spmi-iadc: fix example node nameJohan Hovold
The IADC is a child of an SPMI PMIC, which in turn sits on an SPMI bus. Fixes: a4e6bf69418c ("dt-bindings:iio:adc:qcom,spmi-iadc: txt to yaml format conversion.") Signed-off-by: Johan Hovold <johan+linaro@kernel.org> Acked-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20231130171628.12257-3-johan+linaro@kernel.org Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2023-12-06dt-bindings: iio/adc: qcom,spmi-iadc: fix reg descriptionJohan Hovold
The IADC register is just the base address in the SPMI PMIC and does not include any length. Signed-off-by: Johan Hovold <johan+linaro@kernel.org> Acked-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20231130171628.12257-2-johan+linaro@kernel.org Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
generated by cgit (git 2.34.1) at 2025-04-27 12:47:45 +0000