| Age | Commit message (Collapse) | Author |
|---|
|
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
- fix a race condition issue in power allocator governor (Yi Zeng).
- add support for AP806 and CP110 in armada thermal driver, together
with several improvements (Baruch Siach, Miquel Raynal)
- add support for r8z7743 in rcar thermal driver (Biju Das)
- convert thermal core to use new hwmon API to avoid warning (Fabio
Estevam)
- small fixes and cleanups in thermal core and x86_pkg_thermal,
int3400_thermal, hisi_thermal, mtk_thermal and imx_thermal drivers
(Pravin Shedge, Geert Uytterhoeven, Alexey Khoroshilov, Brian Bian,
Matthias Brugger, Nicolin Chen, Uwe Kleine-König)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
thermal: thermal_hwmon: Convert to hwmon_device_register_with_info()
thermal/x86 pkg temp: Remove debugfs_create_u32() casts
thermal: int3400_thermal: fix error handling in int3400_thermal_probe()
thermal/drivers/hisi: Remove bogus const from function return type
thermal: armada: Give meaningful names to the thermal zones
thermal: armada: Wait sensors validity before exiting the init callback
thermal: armada: Change sensors trim default value
thermal: armada: Update Kconfig and module description
thermal: armada: Add support for Armada CP110
thermal: armada: Add support for Armada AP806
thermal: armada: Use real status register name
thermal: armada: Clarify control registers accesses
thermal: armada: Simplify the check of the validity bit
thermal: armada: Use msleep for long delays
dt-bindings: thermal: Describe Armada AP806 and CP110
dt-bindings: thermal: rcar: Add device tree support for r8a7743
thermal: mtk: Cleanup unused defines
thermal: imx: update to new formula according to NXP AN5215
thermal: imx: use consistent style to write temperatures
thermal: imx: improve comments describing algorithm for temp calculation
...
|
|
git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
|
|
Add compatible strings for AP806 and CP110 that are part of the Armada
8k/7k line of SoCs.
Add a note on the differences in the size of the control area in
different bindings. This is an existing difference between the Armada
375 binding and the other boards already supported. The new AP806 and
CP110 bindings are similar to the existing Armada 375 in this regard.
Signed-off-by: Baruch Siach <baruch@tkos.co.il>
[<miquel.raynal@free-electrons.com>: reword, additional details]
Signed-off-by: Miquel Raynal <miquel.raynal@free-electrons.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
Add thermal sensor support for r8a7743 SoC. The Renesas RZ/G1M
(r8a7743) thermal sensor module is identical to the R-Car Gen2 family.
No driver change is needed due to the fallback compatible value
"renesas,rcar-gen2-thermal".
Signed-off-by: Biju Das <biju.das@bp.renesas.com>
Reviewed-by: Fabrizio Castro <fabrizio.castro@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Simon Horman <simon.horman@netronome.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
DT unit addresses should be lower case hex. Fix all the
binding examples.
Converted with the following command from Krzysztof Kozlowski:
sed -e 's/@\([a-fA-F0-9_-]*\) {/@\L\1 {/' -i $(find Documentation/devicetree/bindings -name '*.txt')
Signed-off-by: Rob Herring <robh@kernel.org>
|
|
Improve the binding example by removing all the leading 0x to fix the
following dtc warnings:
Warning (unit_address_format): Node /XXX unit name should not have leading "0x"
Converted using the following command:
find Documentation/devicetree/bindings -name "*.txt" -exec sed -i -e 's/([^ ])\@0x([0-9a-f])/$1\@$2/g' {} +
This is a follow up to commit 48c926cd3414
Signed-off-by: Mathieu Malaterre <malat@debian.org>
Signed-off-by: Rob Herring <robh@kernel.org>
|
|
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
- introduce brcmstb AVS TMON thermal driver (Brian Norris)
- add Rockchip RV1108 support in rockchip thermal driver (Rocky Hao)
- major rework on HISI driver plus additional support of hisi3660
(Daniel Lezcano)
- add nvmem-cells binding on imx6sx (Leonard Crestez)
- fix a NULL pointer dereference on ti thermal driver unloading (Tony
Lindgren)
- improve tmon tool to make it easier to cross-compile tmon (Markus
Mayer)
- add Coffee Lake and Cannon Lake support for intel processor and pch
thermal drivers (Srinivas Pandruvada)
- other small fixes and cleanups (Arvind Yadav, Colin Ian King, Allen
Wild, Nicolin Chen, Baruch SiachNiklas Söderlund, Arnd Bergmann)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (44 commits)
thermal: pch: Add Cannon Lake support
thermal: int340x: processor_thermal: Add Coffee Lake support
thermal: int340x: processor_thermal: Add Cannon Lake support
thermal: bxt: remove redundant variable trip
thermal: cpu_cooling: pr_err() strings should end with newlines
thermal: add brcmstb AVS TMON driver
Documentation: devicetree: add binding for Broadcom STB AVS TMON
thermal/drivers/hisi: Add support for hi3660 SoC
thermal/drivers/hisi: Prepare to add support for other hisi platforms
thermal/drivers/hisi: Add platform prefix to function name
thermal/drivers/hisi: Put platform code together
thermal/drivers/qcom-spmi: Use devm_iio_channel_get
thermal/drivers/generic-iio-adc: Switch tz request to devm version
thermal/drivers/step_wise: Fix temperature regulation misbehavior
thermal/drivers/hisi: Use round up step value
thermal/drivers/hisi: Move the clk setup in the corresponding functions
thermal/drivers/hisi: Remove mutex_lock in the code
thermal/drivers/hisi: Remove thermal data back pointer
thermal/drivers/hisi: Convert long to int
thermal/drivers/hisi: Rename and remove unused field
...
|
|
|
|
Add binding for Broadcom STB thermal.
Signed-off-by: Brian Norris <computersforpeace@gmail.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Markus Mayer <mmayer@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
Add a new compatible for thermal founding on RV1108 SoCs.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
git://git.kernel.org/pub/scm/linux/kernel/git/tegra/linux into next/dt
Pull "dt-bindings: Updates for v4.15-rc1" from Thierry Reding:
This contains the addition of a clock alias which will be used to fix
the implementation of the SOR1 clock.
Also included are the bindings for the Tegra186 BPMP thermal driver, a
prerequisite for both the driver and device tree changes.
* tag 'tegra-for-4.15-dt-bindings' of git://git.kernel.org/pub/scm/linux/kernel/git/tegra/linux:
dt-bindings: Add bindings for nvidia,tegra186-bpmp-thermal
dt-bindings: clock: tegra: Add sor1_out clock
|
|
In Tegra186, the BPMP (Boot and Power Management Processor) implements
an interface that is used to read system temperatures, including CPU
cluster and GPU temperatures. This binding describes the thermal sensor
that is exposed by BPMP.
Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
|
|
This adds documentation of device tree bindings for the
thermal sensor controller of hi3660 SoC.
Signed-off-by: Kevin Wangtao <kevin.wangtao@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>
|
|
On newer imx SOCs accessing OCOTP directly is wrong because the ocotp
clock needs to be enabled first. Add a binding for accessing the same
values through the imx-ocotp nvmem driver using nvmem-cells. This is
similar to other thermal drivers.
The old binding is preserved for compatibility and because it still
works fine on imx6qdl series chips.
In theory this problem could be solved by adding a reference to the
OCOTP clock instead but it is better to hide such details in a specific
nvmem driver.
Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
|
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal updates from Zhang Rui:
- fix resources release in error paths when registering thermal zone.
(Christophe Jaillet)
- introduce a new thermal driver for on-chip PVT (Process, Voltage and
Temperature) monitoring unit implemented on UniPhier SoCs. This
driver supports temperature monitoring and alert function. (Kunihiko
Hayashi)
- Add support for mt2712 chip in the mtk_thermal driver. (Louis Yu)
- Add support for RK3328 SOC in rockchip_thermal driver. (Rocky Hao)
- cleanup a couple of platform thermal drivers to constify
thermal_zone_of_device_ops structures. (Julia Lawall)
- a couple of fixes in int340x and intel_pch_thermal thermal driver.
(Arvind Yadav, Sumeet Pawnikar, Brian Bian, Ed Swierk, Zhang Rui)
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (27 commits)
Thermal: int3406_thermal: fix thermal sysfs I/F
thermal: mediatek: minor mtk_thermal.c cleanups
thermal: mediatek: extend calibration data for mt2712 chip
thermal: mediatek: add Mediatek thermal driver for mt2712
dt-bindings: thermal: Add binding document for Mediatek thermal controller
thermal: intel_pch_thermal: Fix enable check on Broadwell-DE
thermal: rockchip: Support the RK3328 SOC in thermal driver
dt-bindings: rockchip-thermal: Support the RK3328 SoC compatible
thermal: bcm2835: constify thermal_zone_of_device_ops structures
thermal: exynos: constify thermal_zone_of_device_ops structures
thermal: zx2967: constify thermal_zone_of_device_ops structures
thermal: rcar_gen3_thermal: constify thermal_zone_of_device_ops structures
thermal: qoriq: constify thermal_zone_of_device_ops structures
thermal: hisilicon: constify thermal_zone_of_device_ops structures
thermal: core: Fix resources release in error paths in thermal_zone_device_register()
thermal: core: Use the new 'thermal_zone_destroy_device_groups()' helper function
thermal: core: Add some new helper functions to free resources
thermal: int3400_thermal: process "thermal table changed" event
thermal: uniphier: add UniPhier thermal driver
dt-bindings: thermal: add binding documentation for UniPhier thermal monitor
...
|
|
into thermal-soc
|
|
Pretty much any node can have a status property, so it doesn't need to
be in examples.
Converted with the following command and removed examples with SoC and
board specific splits:
git grep -l -E 'status.*=.*' Documentation/devicetree/ | xargs sed -i -E '/\sstatus.*=.*"(disabled|ok|okay)/d'
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Rob Herring <robh@kernel.org>
|
|
This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT2712.
Signed-off-by: Louis Yu <louis.yu@mediatek.com>
Reviewed-by: Dawei Chien <dawei.chien@mediatek.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
|
attempt to new compatible for thermal founding on RK3328 SoC.
Signed-off-by: Rocky Hao <rocky.hao@rock-chips.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
|
Add devicetree binding documentation for thermal monitor implemented on
Socionext UniPhier SoCs.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
|
Add the missing .txt extension to the Broadcom Northstar binding document.
Signed-off-by: Markus Mayer <mmayer@broadcom.com>
Signed-off-by: Rob Herring <robh@kernel.org>
|
|
Device tree binding information for DA9062 and DA9061 thermal junction
temperature monitor.
Binding descriptions for the DA9061 and DA9062 thermal TJUNC supervisor
device driver, using a single THERMAL_TRIP_HOT trip-wire and allowing for
a configurable polling period for over-temperature polling.
This patch also adds two examples, one for DA9062 and one for DA9061. The
DA9061 example uses a fall-back compatible string for the DA9062.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
This commit documents binding for thermal used in Northstar family SoCs.
There isn't any known Northstar device with active cooling system so DT
example has empty cooling-maps node. There is also no support for CPU
frequency throttling so I put only a critical trip in the example.
Signed-off-by: Rafał Miłecki <rafal@milecki.pl>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
Add a thermal zone in order to make the example complete.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
For different types of SoC the sensor id and endianness may vary.
"#thermal-sensor-cells" is used to provide sensor id information.
"little-endian" property is to tell the endianness of TMU.
Signed-off-by: Jia Hongtao <hongtao.jia@nxp.com>
Acked-by: Rob Herring <robh@kernel.org>
Acked-by: Scott Wood <scottwood@freescale.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
|
git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
|
|
This patch adds dt-binding documentation for zx2967 family thermal sensor.
Signed-off-by: Baoyou Xie <baoyou.xie@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Shawn Guo <shawnguo@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
Signed-off-by: Hien Dang <hien.dang.eb@renesas.com>
Signed-off-by: Khiem Nguyen <khiem.nguyen.xt@renesas.com>
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc
Pull ARM DT updates from Arnd Bergmann:
"Lots of changes as usual, so I'm trying to be brief here. Most of the
new hardware support has the respective driver changes merged through
other trees or has had it available for a while, so this is where
things come together.
We get a DT descriptions for a couple of new SoCs, all of them
variants of other chips we already support, and usually coming with a
new evaluation board:
- Oxford semiconductor (now Broadcom) OX820 SoC for NAS devices
- Qualcomm MDM9615 LTE baseband
- NXP imx6ull, the latest and smallest i.MX6 application processor variant
- Renesas RZ/G (r8a7743 and r8a7745) application processors
- Rockchip PX3, a variant of the rk3188 chip used in Android tablets
- Rockchip rk1108 single-core application processor
- ST stm32f746 Cortex-M7 based microcontroller
- TI DRA71x automotive processors
These are commercially available consumer platforms we now support:
- Motorola Droid 4 (xt894) mobile phone
- Rikomagic MK808 Android TV stick based on Rockchips rx3066
- Cloud Engines PogoPlug v3 based on OX820
- Various Broadcom based wireless devices:
- Netgear R8500 router
- Tenda AC9 router
- TP-LINK Archer C9 V1
- Luxul XAP-1510 Access point
- Turris Omnia open hardware router based on Armada 385
And a couple of new boards targeted at developers, makers or
industrial integration:
- Macnica Sodia development platform for Altera socfpga (Cyclone V)
- MicroZed board based on Xilinx Zynq FPGA platforms
- TOPEET itop/elite based on exynos4412
- WP8548 MangOH Open Hardware platform for IOT, based on Qualcomm MDM9615
- NextThing CHIP Pro gadget
- NanoPi M1 development board
- AM571x-IDK industrial board based on TI AM5718
- i.MX6SX UDOO Neo
- Boundary Devices Nitrogen6_SOM2 (i.MX6)
- Engicam i.CoreM6
- Grinn i.MX6UL liteSOM/liteBoard
- Toradex Colibri iMX6 module
Other changes:
- added peripherals on renesas, davinci, stm32f429, uniphier, sti,
mediatek, integrator, at91, imx, vybrid, ls1021a, omap, qualcomm,
mvebu, allwinner, broadcom, exynos, zynq
- Continued fixes for W=1 dtc warnings
- The old STiH415/416 SoC support gets removed, these never made it
into products and have served their purpose in the kernel as a
template for teh newer chips from ST
- The exynos4415 dtsi file is removed as nothing uses it.
- Intel PXA25x can now be booted using devicetree"
* tag 'armsoc-dt' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (422 commits)
arm: dts: zynq: Add MicroZed board support
ARM: dts: da850: enable high speed for mmc
ARM: dts: da850: Add node for pullup/pulldown pinconf
ARM: dts: da850: enable memctrl and mstpri nodes per board
ARM: dts: da850-lcdk: Add ethernet0 alias to DT
ARM: dts: artpec: add pcie support
ARM: dts: add support for Turris Omnia
devicetree: Add vendor prefix for CZ.NIC
ARM: dts: berlin2q-marvell-dmp: fix typo in chosen node
ARM: dts: berlin2q-marvell-dmp: fix regulators' name
ARM: dts: Add xo to sdhc clock node on qcom platforms
ARM: dts: r8a7794: Add device node for PRR
ARM: dts: r8a7793: Add device node for PRR
ARM: dts: r8a7792: Add device node for PRR
ARM: dts: r8a7791: Add device node for PRR
ARM: dts: r8a7790: Add device node for PRR
ARM: dts: r8a7779: Add device node for PRR
ARM: dts: r8a73a4: Add device node for PRR
ARM: dts: sk-rzg1e: add Ether support
ARM: dts: sk-rzg1e: initial device tree
...
|
|
http://github.com/Broadcom/stblinux into next/dt
Pull "Broadcom devicetree changes for 4.10" from Florian Fainelli:
This pull request contains Broadcom ARM-based SoC Device Tree changes for 4.10,
please pull the following:
- Rafal adds support for the Netgear R8500 routers, adds basic support
for the Tenda AC9 router which uses the new BCM53573 SoC (single core Cortex
A7). He also enables the UART on the Netgear R8000 and restructures the
include files a bit for the BCM47094 SoC, finally he adds USB 3.0 PHY nodes
which enables USB 3.0 on BCM5301X devices that support it. Finally he adds
support for the TP-LINK Archer C9 V1 router.
- Kamal adds support for the QSPI controller on the Northstar Plus SoCs and updates
the bcm958625k reference board to have it enabled
- Dan adds support for the Luxul XAP-1510 (using a BCM4708) and XWR-3100 (using
a BCM47094)
- Scott fixes the pinctrl names in the Cygnus DTS files
- Jonathan enables the Broadcom iProc mailbox controller for Broadcom Cygnus/iProc
SoCs, he adds interrupt support for the GPIO CRMU hardware block and finally adds
the node for the OTP controller found on Cygnus SoCs
- Dhananjay enables the GPIO B controller on Norstarh Plus SoCs
- Eric defines standard pinctrl groups in the BCM2835 GPIO node
- Gerd adds definitions for the pinctrl groups and updates the PWM, I2C and SDHCI nodes
to use their appropriate pinctrl functions
- Linus adds names for the Raspberry Pi GPIO lines based on the datasheet
- Martin adds the DT binding and nodes for the Raspberry Pi firmware thermal block
- Stefan fixes a few typos with respect to the BCM2835 mailbox binding example and
Device Tree nodes he also fixes the Raspberry Pi GPIO lines names and finally
adds names for the Raspberry Zero GPIO lines
* tag 'arm-soc/for-4.10/devicetree' of http://github.com/Broadcom/stblinux: (29 commits)
ARM: bcm2835: Add names for the RPi Zero GPIO lines
ARM: bcm2835: Fix names for the Raspberry Pi GPIO lines
ARM: dts: enable GPIO-b for Broadcom NSP
ARM: BCM5301X: Add DT for TP-LINK Archer C9 V1
ARM: dts: Add node for Broadcom OTP controller driver
ARM: dts: Enable interrupt support for cygnus crmu gpio driver
ARM: dts: Enable Broadcom iProc mailbox controller
ARM: bcm2835: Add names for the Raspberry Pi GPIO lines
ARM: bcm2835: dts: add thermal node to device-tree of bcm283x
dt: bindings: add thermal device driver for bcm2835
ARM: dts: bcm283x: fix typo in mailbox address
DT: binding: bcm2835-mbox: fix address typo in example
ARM: dts: cygnus: fix naming of pinctrl node
ARM: BCM53573: Specify PMU and its ILP clock in the DT
ARM: BCM5301X: Add DT for Luxul XWR-3100
ARM: BCM5301X: Add DT for Luxul XAP-1510
ARM: BCM5301X: Specify USB 3.0 PHY in DT
ARM: BCM5301X: Enable UART on Netgear R8000
ARM: BCM5301X: Add separated DTS include file for BCM47094
ARM: dts: NSP: Add QSPI nodes to NSPI and bcm958625k DTSes
...
|
|
"rockchip,hw-tshut-temp", "rockchip,hw-tshut-mode" and
"rockchip,hw-tshut-polarity" are not a required properties
actually as the code could also work by loading the default
settings there. So it is apprently misleading, although we
prefer to get these from DT. And it seems we miss the 'rockchip,grf'
here which should also be an optional property.
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Signed-off-by: Shawn Lin <shawn.lin@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
Add dt-binding documentation for bcm2835 SOC thermal sensor.
Signed-off-by: Martin Sperl <kernel@martin.sperl.org>
Acked-by: Eric Anholt <eric@anholt.net>
Acked-by: Rob Herring <robh@kernel.org>
Changelog:
V1 -> V2: renamed file to follow naming conventions
V2 -> V3: removed 0x in node name
Signed-off-by: Eric Anholt <eric@anholt.net>
|
|
STiH415/6 SoC's are being removed from the kernel. This
patch removes the compatibles from the dt doc and also
updates the example to a supported platform.
Signed-off-by: Peter Griffin <peter.griffin@linaro.org>
Cc: <rui.zhang@intel.com>
Cc: <edubezval@gmail.com>
Cc: <robh+dt@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
|
|
'thermal-tegra-hw-throttle' into next
|
|
Add HW throttle configuration sub-node for soctherm, which
is used to describe the throttle event, and worked as a
cooling device. The "hot" type trip in thermal zone can
be bound to this cooling device, and trigger the throttle
function.
Signed-off-by: Wei Ni <wni@nvidia.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
|
This adds the device tree binding documentation for the mediatek thermal
controller found on Mediatek MT2701.
Signed-off-by: Dawei Chien <dawei.chien@mediatek.com>
Reviewed-by: Keerthy <j-keerthy@ti.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
|
Maxim Semiconductor MAX77620 supports alarm interrupts when
its die temperature crosses 120C and 140C. These threshold
temperatures are not configurable.
Add DT binding document to details out the DT property related
to MAX77620 thermal functionality.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
|
TSENS is Qualcomms' thermal temperature sensor device. It
supports reading temperatures from multiple thermal sensors
present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory
(eeprom) device.
Add a skeleton driver with all the necessary abstractions so
a variety of qcom device families which support TSENS can
add driver extensions.
Also add the required device tree bindings which can be used
to describe the TSENS device in DT.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Reviewed-by: Lina Iyer <lina.iyer@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
|
See the thermal code, the obvious typo from my editor.
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
|
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
- Introduce generic ADC thermal driver, based on OF thermal (Laxman
Dewangan)
- Introduce new thermal driver for Tango chips (Marc Gonzalez)
- Rockchip driver support for RK3399, RK3366, and some fixes (Caesar
Wang, Elaine Zhang and Shawn Lin)
- Add CPU power cooling model to Mediatek thermal driver (Dawei Chien)
- Wider usage of dev_thermal_zone_of_sensor_register (Eduardo Valentin)
- TI thermal driver gained a new maintainer (Keerthy).
- Enabled powerclamp driver by checking CPU feature and package cstate
counter instead of CPU whitelist (Jacob Pan)
- Various fixes on thermal governor, OF thermal, Tegra, and RCAR
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (50 commits)
thermal: tango: initialize TEMPSI_CFG
thermal: rockchip: use the usleep_range instead of udelay
thermal: rockchip: add the notes for better reading
thermal: rockchip: Support RK3366 SoCs in the thermal driver
thermal: rockchip: handle the power sequence for tsadc controller
thermal: rockchip: update the tsadc table for rk3399
thermal: rockchip: fixes the code_to_temp for tsadc driver
thermal: rockchip: disable thermal->clk in err case
thermal: tegra: add Tegra132 specific SOC_THERM driver
thermal: fix ptr_ret.cocci warnings
thermal: mediatek: Add cpu dynamic power cooling model.
thermal: generic-adc: Add ADC based thermal sensor driver
thermal: generic-adc: Add DT binding for ADC based thermal sensor
thermal: tegra: fix static checker warning
thermal: tegra: mark PM functions __maybe_unused
thermal: add temperature sensor support for tango SoC
thermal: hisilicon: fix IRQ imbalance enabling
thermal: hisilicon: support to use any sensor
thermal: rcar: Remove binding docs for r8a7794
thermal: tegra: add PM support
...
|
|
Sometimes, thermal sensors like NCT thermistors are connected to
the ADC channel. The temperature is read by reading the voltage
across the sensor resistance via ADC and referring the lookup
table for ADC value to temperature.
Add DT binding doc for the ADC based thermal sensor driver to
detail the DT property and provide the example for how to use it.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Acked-by: Rob Herring <rob@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
The Tango thermal driver provides support for the primitive temperature
sensor embedded in Tango chips since the SMP8758.
This sensor only generates a 1-bit signal to indicate whether the die
temperature exceeds a programmable threshold.
Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
The latest information that I have is that there is no thermal IP
block present on the r8a7794 SoC so remove the corresponding binding.
Cc: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
The "critical" type trip in thermal zone can be
set to SOC_THERM hardware, it can trigger shut down
or reset event from hardware.
Signed-off-by: Wei Ni <wni@nvidia.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
Device tree binding for NVIDIA Tegra have traditionally carried the
"nvidia," vendor prefix in the filename. A couple of odd ones don't, so
fix them up for consistency.
Also rename existing bindings to reflect the first compatible value that
they document. This wasn't done consistently either.
Acked-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Rob Herring <robh@kernel.org>
|
|
When Tegra124 support was first merged the unit-addresses of all devices
were listed with a "0," prefix to encode the reg property's second cell.
It turns out that this notation is not correct, and the "," separator is
only used to separate fields in the unit address (such as the device and
function number in PCI devices), not individual cells for addresses
with more than one cell.
Acked-by: Stephen Warren <swarren@nvidia.com>
Signed-off-by: Thierry Reding <treding@nvidia.com>
Signed-off-by: Rob Herring <robh@kernel.org>
|
|
git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
|
|
The Exynos Thermal Management Unit binding says that the vtmu-supply
is optional but is listed in the required properties section. Add an
optional properties section and move the regulator property there.
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Reviewed-by: Andi Shyti <andi.shyti@samsung.com>
Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
Document the number of configurable temperature thresholds (for
trip-points in interrupt-driven mode).
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
|
Commit 488c7455d74c ("thermal: exynos: Add the support for Exynos5433
TMU") added new compatible but forgot to update documentation.
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Chanwoo Choi <cw00.choi@samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
|
