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Document the compatible string for tsens v1.4 block found in MSM8937.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org>
Link: https://lore.kernel.org/r/20241113-msm8917-v6-4-c348fb599fef@mainlining.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Document compatible for thermal sensors on Qualcomm SAR2130P platform.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20241027-sar2130p-tsens-v1-1-8dee27fc02ae@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT Bindings:
- Drop duplicate devices in trivial-devices.yaml
- Add a common serial peripheral device schema and reference it in
serial device schemas.
- Convert nxp,lpc1850-wdt, zii,rave-wdt, ti,davinci-wdt,
snps,archs-pct, fsl,bcsr, fsl,fpga-qixis-i2c, fsl,fpga-qixis,
fsl,cpm-enet, fsl,cpm-mdio, fsl,ucc-hdlc, maxim,ds26522,
aspeed,ast2400-cvic, aspeed,ast2400-vic, fsl,ftm-timer,
ti,davinci-timer, fsl,rcpm, and qcom,ebi2 to DT schema
- Add support for rockchip,rk3576-wdt, qcom,apss-wdt-sa8255p,
fsl,imx8qm-irqsteer, qcom,pm6150-vib, qcom,sa8255p-pdc,
isil,isl69260, ti,tps546d24, and lpc32xx DMA mux
- Drop duplicate nvidia,tegra186-ccplex-cluster.yaml and
mediatek,mt6795-sys-clock.yaml
- Add arm,gic ESPI and EPPI interrupt type specifiers
- Add another batch of legacy compatible strings which we have no
intention of documenting
- Add dmas/dma-names properties to FSL lcdif
- Fix wakeup-source reference to m8921-keypad.yaml
- Treewide fixes of typos in bindings
DT Core:
- Update dtc/libfdt to upstream version v1.7.0-95-gbcd02b523429
- More conversions to scoped iterators and __free() initializer
- Handle overflows in address resources on 32-bit systems
- Extend extracting compatible strings in sources from function
parameters
- Use of_property_present() in DT unittest
- Clean-up of_irq_to_resource() to use helpers
- Support #msi-cells=<0> in of_msi_get_domain()
- Improve the kerneldoc for of_property_match_string()
- kselftest: Ignore nodes that have ancestors disabled"
* tag 'devicetree-for-6.12' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (59 commits)
dt-bindings: watchdog: Add rockchip,rk3576-wdt compatible
dt-bindings: cpu: Drop duplicate nvidia,tegra186-ccplex-cluster.yaml
dt-bindings: clock: mediatek: Drop duplicate mediatek,mt6795-sys-clock.yaml
of/irq: Use helper to define resources
of/irq: Make use of irq_get_trigger_type()
dt-bindings: clk: vc5: Make SD/OE pin configuration properties not required
drivers/of: Improve documentation for match_string
of: property: Do some clean up with use of __free()
dt-bindings: watchdog: qcom-wdt: document support on SA8255p
dt-bindings: interrupt-controller: fsl,irqsteer: Document fsl,imx8qm-irqsteer
dt-bindings: interrupt-controller: arm,gic: add ESPI and EPPI specifiers
dt-bindings: dma: Add lpc32xx DMA mux binding
dt-bindings: trivial-devices: Drop duplicate "maxim,max1237"
dt-bindings: trivial-devices: Drop duplicate LM75 compatible devices
dt-bindings: trivial-devices: Deprecate "ad,ad7414"
dt-bindings: trivial-devices: Drop incorrect and duplicate at24 compatibles
dt-bindings: wakeup-source: update reference to m8921-keypad.yaml
dt-bindings: interrupt-controller: qcom-pdc: document support for SA8255p
dt-bindings: Fix various typos
of: address: Unify resource bounds overflow checking
...
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Corrected several typos in Documentation/devicetree/bindings files.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Kuan-Wei Chiu <visitorckw@gmail.com>
Reviewed-by: Matti Vaittinen <mazziesaccount@gmail.com>
Signed-off-by: Yu-Chun Lin <eleanor15x@gmail.com>
Link: https://lore.kernel.org/r/20240905151943.2792056-1-eleanor15x@gmail.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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Add compatible for sensors representing support on SA8255p.
Signed-off-by: Nikunj Kela <quic_nkela@quicinc.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240828203721.2751904-14-quic_nkela@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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On newer SoCs, the thermal hardware can require a power domain to
operate so add corresponding optional property.
Signed-off-by: George Stark <gnstark@salutedevices.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240710223214.2348418-3-gnstark@salutedevices.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT Bindings:
- Convert and add a bunch of IBM FSI related bindings
- Add a new schema listing legacy compatibles which will (probably)
never be documented. This will silence various checks warning about
them.
- Add bindings for Sierra Wireless mangOH Green SPI IoT interface,
new Arm 2024 Cortex and Neoverse CPUs, QCom sc8180x PDC, QCom SDX75
GPI DMA, imx8mp/imx8qxp fsl,irqsteer, and Renesas RZ/G2UL CRU and
CSI-2 blocks
- Convert Spreadtrum sprd-timer, FSL cpm_qe, FSL fsl,ls-scfg-msi, FSL
q(b)man-*, FSL qoriq-mc, and img,pdc-wdt bindings to DT schema
- Drop obsolete stericsson,abx500.txt
DT core:
- Update dtc to upstream version v1.7.0-93-g1df7b047fe43
- Add support to run DT validation on DTs with applied overlays
- Add helper for creating boolean properties in dynamic nodes and use
that for dynamic PCI nodes
- Clean-up early parsing of '#{address,size}-cells'"
* tag 'devicetree-for-6.11' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (39 commits)
dt-bindings: timer: sprd-timer: convert to YAML
dt-bindings: incomplete-devices: document devices without bindings
dt-bindings: trivial-devices: document the Sierra Wireless mangOH Green SPI IoT interface
scripts/dtc: Update to upstream version v1.7.0-93-g1df7b047fe43
dt-bindings: soc: fsl: Add fsl,ls1028a-reset for reset syscon node
dt-bindings: soc: fsl: cpm_qe: convert to yaml format
dt-bindings: i2c: i2c-fsi: Convert to json-schema
dt-bindings: fsi: Document the FSI Hub Controller
dt-bindings: fsi: Document the AST2700 FSI controller
dt-bindings: fsi: ast2600-fsi-master: Convert to json-schema
dt-bindings: fsi: ibm,i2cr-fsi-master: Reference common FSI controller
dt-bindings: fsi: Document the FSI controller common properties
dt-bindings: fsi: Document the IBM SBEFIFO engine
dt-bindings: fsi: p9-occ: Convert to json-schema
dt-bindings: fsi: Document the IBM SCOM engine
dt-bindings: fsi: fsi2spi: Document SPI controller child nodes
dt-bindings: interrupt-controller: convert fsl,ls-scfg-msi to yaml
dt-bindings: soc: fsl: Convert q(b)man-* to yaml format
dt-bindings: misc: fsl,qoriq-mc: convert to yaml format
dt-bindings: drop stale Anson Huang from maintainers
...
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It is possible to have thermal zones which don't have any trip points.
These zones in effect simply represent a temperature sensor without any
action associated with it. While the schema has always required a
'trips' node, users have existed for a long time without it. Update the
schema to match reality.
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240709150154.3272825-1-robh@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-12-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Preferred indentation for DTS examples in the bindings is 4-space. It
is also preferred not to have redundant/unused labels. No functional
change
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-22-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Simplify few bindings which already reference thermal-sensor.yaml schema
by dropping unneeded requiring of '#thermal-sensor-cells' and dropping
assigned-clocks properties (core schema allows it if 'clocks' are
there).
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-21-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-20-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-19-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-18-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-17-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-16-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-15-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-14-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-13-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-11-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-10-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-9-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-8-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-7-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-6-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-5-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Acked-by: Florian Fainelli <florian.fainelli@broadcom.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-4-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and it requires '#thermal-sensor-cells', so
reference the thermal-sensor.yaml to simplify it and bring the
common definition of '#thermal-sensor-cells' property.
Reviewed-by: Vasily Khoruzhick <anarsoul@gmail.com>
Acked-by: Chen-Yu Tsai <wens@csie.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-3-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Device is a thermal sensor and all in-tree DTS provide
'#thermal-sensor-cells', so reference the thermal-sensor.yaml to
simplify it, bring the common definition of '#thermal-sensor-cells'
property and require it.
Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org>
Reviewed-by: Guillaume LA ROQUE <glaroque@baylibre.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-2-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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All Samsung Exynos SoCs Thermal Management Units have only one sensor,
so make '#thermal-sensor-cells' fixed at 0.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240705-dt-bindings-thermal-allof-v1-1-554061b52fbc@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Linux kernel uses thermal zone node name during registering thermal
zones and has a hard-coded limit of 20 characters, including terminating
NUL byte. The bindings expect node names to finish with '-thermal'
which is eight bytes long, thus we have only 11 characters for the reset
of the node name (thus 10 for the pattern after leading fixed character).
Reported-by: Rob Herring <robh@kernel.org>
Closes: https://lore.kernel.org/all/CAL_JsqKogbT_4DPd1n94xqeHaU_J8ve5K09WOyVsRX3jxxUW3w@mail.gmail.com/
Fixes: 1202a442a31f ("dt-bindings: thermal: Add yaml bindings for thermal zones")
Cc: stable@vger.kernel.org
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240702145248.47184-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Document the Temperature Sensor (TSENS) on the X1E80100 Platform.
Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>
Signed-off-by: Abel Vesa <abel.vesa@linaro.org>
Reviewed-by: Amit Kucheria <amitk@kernel.org>
Link: https://lore.kernel.org/r/20240628-x1e80100-bindings-thermal-qcom-tsens-v2-1-4843d4c2ba24@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Convert the hisilicon SoCs tsensor txt bindings to dt-schema
Signed-off-by: Abdulrasaq Lawani <abdulrasaqolawani@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20240618-hisilicon-thermal-dt-bindings-conversion-v4-1-7eba97fbe6d0@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Emails to Anson Huang bounce:
Diagnostic-Code: smtp; 550 5.4.1 Recipient address rejected: Access denied.
Add IMX platform maintainers for bindings which would become orphaned.
Acked-by: Uwe Kleine-König <ukleinek@kernel.org>
Reviewed-by: Fabio Estevam <festevam@gmail.com>
Acked-by: Peng Fan <peng.fan@nxp.com>
Acked-by: Wolfram Sang <wsa+renesas@sang-engineering.com> # for I2C
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> # for IIO
Acked-by: Andi Shyti <andi.shyti@kernel.org>
Acked-by: Abel Vesa <abel.vesa@linaro.org>
Link: https://lore.kernel.org/r/20240617065828.9531-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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The temperature output register of the Loongson-2K2000 is defined in the
chip configuration domain, which is different from the Loongson-2K1000,
so it can't be fallbacked.
We need to use two groups of registers to describe it: the first group
is the high and low temperature threshold setting register; the second
group is the temperature output register.
It is true that this fix will cause ABI corruption, but it is necessary
otherwise the Loongson-2K2000 temperature sensor will not work properly.
Fixes: 72684d99a854 ("thermal: dt-bindings: add loongson-2 thermal")
Cc: Yinbo Zhu <zhuyinbo@loongson.cn>
Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Huacai Chen <chenhuacai@loongson.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/5198999d679f1a1c3457385acb9fadfc85da1f1e.1713837379.git.zhoubinbin@loongson.cn
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The thermal on the Loongson-2K0500 shares the design with the
Loongson-2K1000. Define corresponding compatible string, having the
loongson,ls2k1000-thermal as a fallback.
Signed-off-by: Binbin Zhou <zhoubinbin@loongson.cn>
Acked-by: Rob Herring <robh@kernel.org>
Acked-by: Huacai Chen <chenhuacai@loongson.cn>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/26524a63abd2d032e4c45efe6ce3fedb46841768.1713837379.git.zhoubinbin@loongson.cn
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MT8188
Add LVTS thermal controller definition for MT8188.
Signed-off-by: Nicolas Pitre <npitre@baylibre.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240402032729.2736685-13-nico@fluxnic.net
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MT8186
Add LVTS thermal controller definition for MT8186.
Signed-off-by: Nicolas Pitre <npitre@baylibre.com>
Acked-by: Krzysztof Kozlowski <krzk@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240402032729.2736685-7-nico@fluxnic.net
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Provide right compatible properties for Amlogic A1 Thermal Sensor
controller. A1 family supports only one thermal node - CPU thermal
sensor.
Signed-off-by: Dmitry Rokosov <ddrokosov@salutedevices.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240328191322.17551-2-ddrokosov@salutedevices.com
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'st,passive_colling_temp' does not appear in the device-tree, 'reg' and
'#thermal-sensor-cells' are also missing in the device description.
Convert st,stih407-thermal binding to DT schema format in order to clean
unused 'st,passive_cooling_temp' and add missing properties.
Signed-off-by: Raphael Gallais-Pou <rgallaispou@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240320-thermal-v3-1-700296694c4a@gmail.com
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Document the QCM2290 LMH.
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240308-topic-rb1_lmh-v2-1-bac3914b0fe3@linaro.org
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git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"These update thermal drivers for ARM platforms by adding new hardware
support (r8a779h0, H616 THS), addressing issues (Mediatek LVTS,
Mediatek MT7896, thermal-of) and cleaning up code.
Specifics:
- Fix memory leak in the error path at probe time in the Mediatek
LVTS driver (Christophe Jaillet)
- Fix control buffer enablement regression on Meditek MT7896 (Frank
Wunderlich)
- Drop spaces before TABs in different places: thermal-of, ST drivers
and Makefile (Geert Uytterhoeven)
- Adjust DT binding for NXP as fsl,tmu-range min/maxItems can vary
among several SoC versions (Fabio Estevam)
- Add support for the H616 THS controller on Sun8i platforms (Martin
Botka)
- Don't fail probe due to zone registration failure because there is
no trip points defined in the DT (Mark Brown)
- Support variable TMU array size for new platforms (Peng Fan)
- Adjust the DT binding for thermal-of and make the polling time not
required and assume it is zero when not found in the DT (Konrad
Dybcio)
- Add r8a779h0 support in both the DT and the rcar_gen3 driver (Geert
Uytterhoeven)"
* tag 'thermal-6.9-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal/drivers/rcar_gen3: Add support for R-Car V4M
dt-bindings: thermal: rcar-gen3-thermal: Add r8a779h0 support
thermal/of: Assume polling-delay(-passive) 0 when absent
dt-bindings: thermal-zones: Don't require polling-delay(-passive)
thermal/drivers/qoriq: Fix getting tmu range
thermal/drivers/sun8i: Don't fail probe due to zone registration failure
thermal/drivers/sun8i: Add support for H616 THS controller
thermal/drivers/sun8i: Add SRAM register access code
thermal/drivers/sun8i: Extend H6 calibration to support 4 sensors
thermal/drivers/sun8i: Explain unknown H6 register value
dt-bindings: thermal: sun8i: Add H616 THS controller
soc: sunxi: sram: export register 0 for THS on H616
dt-bindings: thermal: qoriq-thermal: Adjust fsl,tmu-range min/maxItems
thermal: Drop spaces before TABs
thermal/drivers/mediatek: Fix control buffer enablement on MT7896
thermal/drivers/mediatek/lvts_thermal: Fix a memory leak in an error handling path
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Document support for the Thermal Sensor/Chip Internal Voltage
Monitor/Core Voltage Monitor (THS/CIVM/CVM) on the Renesas R-Car V4M
(R8A779H0) SoC.
Just like on other R-Car Gen4 SoCs, interrupts are not routed to the
INTC-AP (GIC) but to the Error Control Module (ECM).
Signed-off-by: Duy Nguyen <duy.nguyen.rh@renesas.com>
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/b3d135f8b63b9fe2d0f0aa2e48c8a2211b2e947e.1709722342.git.geert+renesas@glider.be
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Currently, thermal zones associated with providers that have interrupts
for signaling hot/critical trips are required to set a polling-delay
of 0 to indicate no polling. This feels a bit backwards.
Assume 0 (no polling) when these properties are not defined.
Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240125-topic-thermal-v1-1-3c9d4dced138@linaro.org
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This controller is similar to the H6, but covers four sensors and uses
slightly different calibration methods.
Also the H616 requires to poke a bit in the SYS_CFG register range for
correct operation, so add a phandle property to point there.
Signed-off-by: Martin Botka <martin.botka@somainline.org>
Signed-off-by: Andre Przywara <andre.przywara@arm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Vasily Khoruzhick <anarsoul@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240219153639.179814-3-andre.przywara@arm.com
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The number of fsl,tmu-range entries vary among the several NXP SoCs.
- lx2160a has two fsl,tmu-range entries (fsl,qoriq-tmu compatible)
- imx8mq has four fsl,tmu-range entries. (fsl,imx8mq-tmu compatible)
- imx93 has seven fsl,tmu-range entries. (fsl,qoriq-tmu compatible)
Change minItems and maxItems accordingly.
This fixes the following schema warning:
imx93-11x11-evk.dtb: tmu@44482000: fsl,tmu-range: 'oneOf' conditional failed, one must be fixed:
[2147483866, 2147483881, 2147483906, 2147483946, 2147484006, 2147484071, 2147484086] is too long
Signed-off-by: Fabio Estevam <festevam@denx.de>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20240104124952.1975160-1-festevam@gmail.com
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Convert the da9062 PMIC device tree binding documentation to json-schema.
Document the missing gpio child node for da9062.
While at it, update description with link to product information and
example.
The missing child node with of_compatible defined in MFD_CELL_OF is
causing the below warning message:
da9062-gpio: Failed to locate of_node [id: -1]
So, make all child nodes with of_compatible defined in struct mfd_cell
as required property for da906{1,2} devices.
The "gpio-controller" and "#gpio-cells" properties are defined in the
parent instead of gpio child node as there are existing driver users
based on these parent properties.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Conor Dooley <conor.dooley@microchip.com>
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Link: https://lore.kernel.org/r/20240131102656.3379-7-biju.das.jz@bp.renesas.com
Signed-off-by: Lee Jones <lee@kernel.org>
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Convert the da906{1,2} thermal device tree binding documentation to
json-schema.
Update MAINTAINERS entries and description by referring to
dlg,da9062-thermal.yaml binding file.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20240131102656.3379-5-biju.das.jz@bp.renesas.com
Signed-off-by: Lee Jones <lee@kernel.org>
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Clean up the examples by adding newline separators, moving 'reg'
properties after 'compatible' and dropping unused labels.
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231130174114.13122-3-johan+linaro@kernel.org
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The ADC Thermal Monitor is part of an SPMI PMIC, which in turn sits on
an SPMI bus.
Fixes: db03874b8543 ("dt-bindings: thermal: qcom: add HC variant of adc-thermal monitor bindings")
Fixes: e8ffd6c0756b ("dt-bindings: thermal: qcom: add adc-thermal monitor bindings")
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20231130174114.13122-2-johan+linaro@kernel.org
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