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Merge thermal control core fixes for 6.0-rc3:
- Fix missing required property for thermal zone description (Daniel
Lezcano).
- Add missing export symbol for
thermal_zone_device_register_with_trips() (Daniel Lezcano).
* thermal-core:
dt-bindings: thermal: Fix missing required property
thermal/core: Add missing EXPORT_SYMBOL_GPL
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As indicated in
link: https://lore.kernel.org/all/20220822204945.GA808626-robh@kernel.org/
DT schema files should not have 'Device Tree Binding' as part of there
title: line. Remove this in most .yaml files, so hopefully preventing
developers copying it into new .yaml files, and being asked to remove
it.
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Link: https://lore.kernel.org/r/20220825020427.3460650-1-andrew@lunn.ch
Signed-off-by: Rob Herring <robh@kernel.org>
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Lots of double occurrences of "the" were replaced by single occurrences,
but some of them should become "to the" instead.
Fixes: 12e5bde18d7f6ca4 ("dt-bindings: Fix typo in comment")
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/c5743c0a1a24b3a8893797b52fed88b99e56b04b.1660755148.git.geert+renesas@glider.be
Signed-off-by: Jakub Kicinski <kuba@kernel.org>
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When the thermal zone description was converted to yaml schema, the
required 'trips' property was forgotten.
The initial text bindings was describing:
"
[ ... ]
* Thermal zone nodes
The thermal zone node is the node containing all the required info
for describing a thermal zone, including its cooling device bindings. The
thermal zone node must contain, apart from its own properties, one sub-node
containing trip nodes and one sub-node containing all the zone cooling maps.
Required properties:
- polling-delay: The maximum number of milliseconds to wait between polls
Type: unsigned when checking this thermal zone.
Size: one cell
- polling-delay-passive: The maximum number of milliseconds to wait
Type: unsigned between polls when performing passive cooling.
Size: one cell
- thermal-sensors: A list of thermal sensor phandles and sensor specifier
Type: list of used while monitoring the thermal zone.
phandles + sensor
specifier
- trips: A sub-node which is a container of only trip point nodes
Type: sub-node required to describe the thermal zone.
Optional property:
- cooling-maps: A sub-node which is a container of only cooling device
Type: sub-node map nodes, used to describe the relation between trips
and cooling devices.
[ ... ]
"
Now the schema describes:
"
[ ... ]
required:
- polling-delay
- polling-delay-passive
- thermal-sensors
[ ... ]
"
Add the missing 'trips' property in the required properties.
Fixed: 1202a442a31fd ("dt-bindings: thermal: Add yaml bindings for thermal zones")
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220809085629.509116-3-daniel.lezcano@linaro.org
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"Bindings:
- Add spi-peripheral-props.yaml references to various SPI device
bindings
- Convert qcom,pm8916-wdt, ds1307, Qualcomm BAM DMA, is31fl319x,
skyworks,aat1290, Rockchip EMAC, gpio-ir-receiver, ahci-ceva, Arm
CCN PMU, rda,8810pl-intc, sil,sii9022, ps2-gpio, and
arm-firmware-suite bindings to DT schema format
- New bindings for Arm virtual platforms display, Qualcomm IMEM
memory region, Samsung S5PV210 ChipID, EM Microelectronic EM3027
RTC, and arm,cortex-a78ae
- Add vendor prefixes for asrock, bytedance, hxt, ingrasys, inventec,
quanta, and densitron
- Add missing MSI and IOMMU properties to host-generic-pci
- Remove bindings for removed EFM32 platform
- Remove old chosen.txt binding (replaced by schema)
- Treewide add missing type information for properties
- Treewide fixing of typos and its vs. it's in bindings. Its all good
now.
- Drop unnecessary quoting in power related schemas
- Several LED binding updates which didn't get picked up
- Move various bindings to proper directories
DT core code:
- Convert unittest GPIO related tests to use fwnode
- Check ima-kexec-buffer against memory bounds
- Print reserved-memory allocation/reservation failures as errors
- Cleanup early_init_dt_reserve_memory_arch()
- Simplify of_overlay_fdt_apply() tail"
* tag 'devicetree-for-6.0' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (65 commits)
dt-bindings: mtd: microchip,mchp48l640: use spi-peripheral-props.yaml
dt-bindings: power: supply: drop quotes when not needed
dt-bindings: power: reset: drop quotes when not needed
dt-bindings: power: drop quotes when not needed
dt-bindings: PCI: host-generic-pci: Allow IOMMU and MSI properties
of/fdt: declared return type does not match actual return type
devicetree/bindings: correct possessive "its" typos
dt-bindings: net: convert emac_rockchip.txt to YAML
dt-bindings: eeprom: microchip,93lc46b: move to eeprom directory
dt-bindings: eeprom: at25: use spi-peripheral-props.yaml
dt-bindings: display: use spi-peripheral-props.yaml
dt-bindings: watchdog: qcom,pm8916-wdt: convert to dtschema
dt-bindings: power: reset: qcom,pon: use absolute path to other schema
dt-bindings: iio/dac: adi,ad5766: Add missing type to 'output-range-microvolts'
dt-bindings: power: supply: charger-manager: Add missing type for 'cm-battery-stat'
dt-bindings: panel: raydium,rm67191: Add missing type to 'video-mode'
of/fdt: Clean up early_init_dt_reserve_memory_arch()
dt-bindings: PCI: fsl,imx6q-pcie: Add missing type for 'reset-gpio-active-high'
dt-bindings: rtc: Add EM Microelectronic EM3027 bindings
dt-bindings: rtc: ds1307: Convert to json-schema
...
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git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These start a rework of the handling of trip points in the thermal
core, improve the cpufreq/devfreq cooling device handling, update some
thermal control drivers and the tmon utility and clean up code.
Specifics:
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to
be used by the different sensors when registering a thermal zone
(Daniel Lezcano).
- Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
(Lukasz Luba).
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn).
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3
(Wolfram Sang).
- Convert the QCom tsens DT binding to the dtsformat format
(Krzysztof Kozlowski).
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano).
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof).
- Fix array underflow in prep_lookup_table (Dan Carpenter).
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun).
- Fix typos in comments detected on sun8i by Coccinelle (Julia
Lawall).
- Fix typos in comments on rzg2l (Biju Das).
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li).
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov).
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer).
- Fix typo in the comments for the 'tmon' tool (Slark Xiao).
- Make the thermal core use ida_alloc()/free() directly instead of
ida_simple_get()/ida_simple_remove() that have been deprecated
(keliu).
- Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal
control driver (Rafael Wysocki)"
* tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (39 commits)
thermal/of: Initialize trip points separately
thermal/of: Use thermal trips stored in the thermal zone
thermal/core: Add thermal_trip in thermal_zone
thermal/core: Rename 'trips' to 'num_trips'
thermal/core: Move thermal_set_delay_jiffies to static
thermal/core: Remove unneeded EXPORT_SYMBOLS
thermal/of: Move thermal_trip structure to thermal.h
thermal/of: Remove the device node pointer for thermal_trip
thermal/of: Replace device node match with device node search
thermal/core: Remove duplicate information when an error occurs
thermal/core: Avoid calling ->get_trip_temp() unnecessarily
thermal/tools/tmon: Fix typo 'the the' in comment
thermal/tools/tmon: Include pthread and time headers in tmon.h
thermal/ti-soc-thermal: Fix comment typo
thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors
thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors
thermal/drivers/u8500: Remove unnecessary print function dev_err()
thermal/drivers/rzg2l: Fix comments
thermal/drivers/sun8i: Fix typo in comment
thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static
...
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git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal control changes for 5.20-rc1 from Daniel Lezcano:
"- Make per cpufreq / devfreq cooling device ops instead of using a
global variable, fix comments and rework the trace information
(Lukasz Luba)
- Add the include/dt-bindings/thermal.h under the area covered by the
thermal maintainer in the MAINTAINERS file (Lukas Bulwahn)
- Improve the error output by giving the sensor identification when a
thermal zone failed to initialize, the DT bindings by changing the
positive logic and adding the r8a779f0 support on the rcar3 (Wolfram
Sang)
- Convert the QCom tsens DT binding to the dtsformat format (Krzysztof
Kozlowski)
- Remove the pointless get_trend() function in the QCom, Ux500 and
tegra thermal drivers, along with the unused DROP_FULL and
RAISE_FULL trends definitions. Simplify the code by using clamp()
macros (Daniel Lezcano)
- Fix ref_table memory leak at probe time on the k3_j72xx bandgap
(Bryan Brattlof)
- Fix array underflow in prep_lookup_table (Dan Carpenter)
- Add static annotation to the k3_j72xx_bandgap_j7* data structure
(Jin Xiaoyun)
- Fix typos in comments detected on sun8i by Coccinelle (Julia Lawall)
- Fix typos in comments on rzg2l (Biju Das)
- Remove as unnecessary call to dev_err() as the error is already
printed by the failing function on u8500 (Yang Li)
- Register the thermal zones as hwmon sensors for the Qcom thermal
sensors (Dmitry Baryshkov)
- Fix 'tmon' tool compilation issue by adding phtread.h include
(Markus Mayer)
- Fix typo in the comments for the 'tmon' tool (Slark Xiao)
- Consolidate the thermal core code by beginning to move the thermal
trip structure from the thermal OF code as a generic structure to be
used by the different sensors when registering a thermal zone
(Daniel Lezcano)"
* tag 'thermal-v5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (36 commits)
thermal/of: Initialize trip points separately
thermal/of: Use thermal trips stored in the thermal zone
thermal/core: Add thermal_trip in thermal_zone
thermal/core: Rename 'trips' to 'num_trips'
thermal/core: Move thermal_set_delay_jiffies to static
thermal/core: Remove unneeded EXPORT_SYMBOLS
thermal/of: Move thermal_trip structure to thermal.h
thermal/of: Remove the device node pointer for thermal_trip
thermal/of: Replace device node match with device node search
thermal/core: Remove duplicate information when an error occurs
thermal/core: Avoid calling ->get_trip_temp() unnecessarily
thermal/tools/tmon: Fix typo 'the the' in comment
thermal/tools/tmon: Include pthread and time headers in tmon.h
thermal/ti-soc-thermal: Fix comment typo
thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors
thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors
thermal/drivers/u8500: Remove unnecessary print function dev_err()
thermal/drivers/rzg2l: Fix comments
thermal/drivers/sun8i: Fix typo in comment
thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static
...
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Add support for R-Car S4. The S4 IP differs a bit from its siblings in
such way that it has 3 out of 4 TSC nodes for Linux and the interrupts
are not routed to the INTC-AP but to the ECM.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220610201701.7946-2-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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When handling the V3U/r8a779a0 exception, avoid using 'not:' because
then its subschemas are far away in the 'else:' branch. Keep them
together using positive logic.
Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20220610201701.7946-1-wsa+renesas@sang-engineering.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Convert the Qualcomm QPNP PMIC Temperature Alarm to DT Schema.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220608112702.80873-1-krzysztof.kozlowski@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Fix typo in the comment
Signed-off-by: Slark Xiao <slark_xiao@163.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220721011746.19663-1-slark_xiao@163.com
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In order to replace the fsl,scu txt file from bindings/arm/freescale,
we need to split it between the right subsystems. This patch documents
separately the 'thermal' child node of the SCU main node.
Signed-off-by: Abel Vesa <abel.vesa@nxp.com>
Signed-off-by: Viorel Suman <viorel.suman@nxp.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"Bindings:
- Convert smsc,lan91c111, qcom,spi-qup, qcom,msm-uartdm,
qcom,i2c-qup, qcom,gsbi, i2c-mt65xx, TI wkup_m3_ipc (and new
props), qcom,smp2p, TI timer, Mediatek gnss, Mediatek topckgen,
Mediatek apmixedsys, Mediatek infracfg, fsl,ls-extirq,
fsl,layerscape-dcfg, QCom PMIC SPMI, rda,8810pl-timer, Xilinx
zynqmp_ipi, uniphier-pcie, and Ilitek touchscreen controllers
- Convert various Arm Ltd peripheral IP bindings to schemas
- New bindings for Menlo board CPLD, DH electronics board CPLD,
Qualcomm Geni based QUP I2C, Renesas RZ/G2UL OSTM, Broafcom BCM4751
GNSS, MT6360 PMIC, ASIX USB Ethernet controllers, and
Microchip/SMSC LAN95xx USB Ethernet controllers
- Add vendor prefix for Enclustra
- Add various compatible string additions
- Various example fixes and cleanups
- Remove unused hisilicon,hi6220-reset binding
- Treewide fix properties missing type definition
- Drop some empty and unreferenced .txt bindings
- Documentation improvements for writing schemas
DT driver core:
- Drop static IRQ resources for DT platform devices as IRQ setup is
dynamic and drivers have all been converted to use
platform_get_irq() and friends
- Rework memory allocations and frees for overlays
- Continue overlay notifier callbacks on successful calls and add
unittests
- Handle 'interrupts-extended' in early DT IRQ setup
- Fix of_property_read_string() errors to match documentation
- Ignore disabled nodes in FDT API calls"
* tag 'devicetree-for-5.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (86 commits)
of/irq: fix typo in comment
dt-bindings: Fix properties without any type
Revert "dt-bindings: mailbox: qcom-ipcc: add missing properties into example"
dt-bindings: input: touchscreen: ilitek_ts_i2c: Absorb ili2xxx bindings
dt-bindings: timer: samsung,exynos4210-mct: define strict clock order
dt-bindings: timer: samsung,exynos4210-mct: drop unneeded minItems
dt-bindings: timer: cdns,ttc: drop unneeded minItems
dt-bindings: mailbox: zynqmp_ipi: convert to yaml
dt-bindings: usb: ci-hdrc-usb2: fix node node for ethernet controller
dt-bindings: net: add schema for Microchip/SMSC LAN95xx USB Ethernet controllers
dt-bindings: net: add schema for ASIX USB Ethernet controllers
of/fdt: Ignore disabled memory nodes
dt-bindings: arm: fix typos in compatible
dt-bindings: mfd: Add bindings child nodes for the Mediatek MT6360
dt-bindings: display: convert Arm Komeda to DT schema
dt-bindings: display: convert Arm Mali-DP to DT schema
dt-bindings: display: convert Arm HDLCD to DT schema
dt-bindings: display: convert PL110/PL111 to DT schema
dt-bindings: arm: convert vexpress-config to DT schema
dt-bindings: arm: convert vexpress-sysregs to DT schema
...
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Add VTM bindings documentation. In the Voltage Thermal
Management Module(VTM), K3 J72XX supplies a voltage
reference and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.
Signed-off-by: Keerthy <j-keerthy@ti.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220517172920.10857-2-j-keerthy@ti.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The Qualcomm SC8280XP platform has three instances of the tsens block,
add a compatible for these instances.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220503153436.960184-1-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Add compatible for the LMh blocks found in the Qualcomm sc8180x
platform.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220502164504.3972938-2-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Document RZ/G2UL TSU bindings. The TSU block on RZ/G2UL is identical to one
found on RZ/G2L SoC. No driver changes are required as generic compatible
string "renesas,rzg2l-tsu" will be used as a fallback.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220501081930.23743-1-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Add compatibility string for the thermal sensors on MSM8960/APQ8064
platforms.
Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://lore.kernel.org/r/20220406002648.393486-2-dmitry.baryshkov@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Add documentation for PMIC5 Gen2 ADC_TM peripheral.
It is used for monitoring ADC channel thresholds for PMIC7-type
PMICs. It is present on PMK8350, like PMIC7 ADC and can be used
to monitor up to 8 ADC channels, from any of the PMIC7 PMICs
on a target, through PBS(Programmable Boot Sequence).
Signed-off-by: Jishnu Prakash <quic_jprakash@quicinc.com>
Reviewed-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/1648991869-20899-2-git-send-email-quic_jprakash@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Document RZ/V2L TSU bindings. The TSU block on RZ/V2L is identical to one
found on RZ/G2L SoC. No driver changes are required as generic compatible
string "renesas,rzg2l-tsu" will be used as a fallback.
Signed-off-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Biju Das <biju.das.jz@bp.renesas.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://lore.kernel.org/r/20220308212315.4551-1-prabhakar.mahadev-lad.rj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Pick up new meta-schema fixes.
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree fixes from Rob Herring:
- Drop unused 'max-link-speed' in Apple PCIe
- More redundant 'maxItems/minItems' schema fixes
- Support values for pinctrl 'drive-push-pull' and 'drive-open-drain'
- Fix redundant 'unevaluatedProperties' in MT6360 LEDs binding
- Add missing 'power-domains' property to Cadence UFSHC
* tag 'devicetree-fixes-for-5.18-3' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux:
dt-bindings: pci: apple,pcie: Drop max-link-speed from example
dt-bindings: Drop redundant 'maxItems/minItems' in if/then schemas
dt-bindings: pinctrl: Allow values for drive-push-pull and drive-open-drain
dt-bindings: leds-mt6360: Drop redundant 'unevaluatedProperties'
dt-bindings: ufs: cdns,ufshc: Add power-domains
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Another round of removing redundant minItems/maxItems when 'items' list is
specified. This time it is in if/then schemas as the meta-schema was
failing to check this case.
If a property has an 'items' list, then a 'minItems' or 'maxItems' with the
same size as the list is redundant and can be dropped. Note that is DT
schema specific behavior and not standard json-schema behavior. The tooling
will fixup the final schema adding any unspecified minItems/maxItems.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org> # For MMC
Acked-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> #for IIO
Link: https://lore.kernel.org/r/20220503162738.3827041-1-robh@kernel.org
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Add devicetree compatible for tsens on SM6350 SoC.
Signed-off-by: Luca Weiss <luca.weiss@fairphone.com>
Acked-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211213082614.22651-6-luca.weiss@fairphone.com
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Krzysztof Kozlowski's @canonical.com email stopped working, so switch to
generic @kernel.org account for all Devicetree bindings.
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Acked-by: Arnd Bergmann <arnd@arndb.de>
Link: https://lore.kernel.org/r/20220330074016.12896-2-krzysztof.kozlowski@linaro.org
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
- Add Krzysztof Kozlowski as co-maintainer for DT bindings providing
much needed help.
- DT schema validation now takes DTB files as input rather than
intermediate YAML files. This decouples the validation from the
source level syntax information. There's a bunch of schema fixes as a
result of switching to DTB based validation which exposed some errors
and incomplete schemas and examples.
- Kbuild improvements to explicitly warn users running 'make
dt_binding_check' on missing yamllint
- Expand DT_SCHEMA_FILES kbuild variable to take just a partial
filename or path instead of the full path to 1 file.
- Convert various bindings to schema format: mscc,vsc7514-switch,
multiple GNSS bindings, ahci-platform, i2c-at91, multiple UFS
bindings, cortina,gemini-sata-bridge, cortina,gemini-ethernet, Atmel
SHA, Atmel TDES, Atmel AES, armv7m-systick, Samsung Exynos display
subsystem, nuvoton,npcm7xx-timer, samsung,s3c2410-i2c, zynqmp_dma,
msm/mdp4, rda,8810pl-uart
- New schemas for u-boot environment variable partition, TI clksel
- New compatible strings for Renesas RZ/V2L SoC
- Vendor prefixes for Xen, HPE, deprecated Synopsys, deprecated
HiSilicon
- Add/fix schemas for QEMU Arm 'virt' machine
- Drop unused of_alias_get_alias_list() function
- Add a script to check DT unittest EXPECT message output. Pass
messages also now print by default at PR_INFO level to help test
automation.
* tag 'devicetree-for-5.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (96 commits)
dt-bindings: kbuild: Make DT_SCHEMA_LINT a recursive variable
dt-bindings: nvmem: add U-Boot environment variables binding
dt-bindings: ufs: qcom: Add SM6350 compatible string
dt-bindings: dmaengine: sifive,fu540-c000: include generic schema
dt-bindings: gpio: pca95xx: drop useless consumer example
Revert "of: base: Introduce of_alias_get_alias_list() to check alias IDs"
dt-bindings: virtio,mmio: Allow setting devices 'dma-coherent'
dt-bindings: gnss: Add two more chips
dt-bindings: gnss: Rewrite sirfstar binding in YAML
dt-bindings: gnss: Modify u-blox to use common bindings
dt-bindings: gnss: Rewrite common bindings in YAML
dt-bindings: ata: ahci-platform: Add rk3568-dwc-ahci compatible
dt-bindings: ata: ahci-platform: Add power-domains property
dt-bindings: ata: ahci-platform: Convert DT bindings to yaml
dt-bindings: kbuild: Use DTB files for validation
dt-bindings: kbuild: Pass DT_SCHEMA_FILES to dt-validate
dt-bindings: Add QEMU virt machine compatible
dt-bindings: arm: Convert QEMU fw-cfg to DT schema
dt-bindings: i2c: at91: Add SAMA7G5 compatible strings list
dt-bindings: i2c: convert i2c-at91 to json-schema
...
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Document the compatible string for tsens found in msm8953.
Signed-off-by: Luca Weiss <luca@z3ntu.xyz>
Acked-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Acked-by: Amit Kucheria <amitk@kernel.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220220201909.445468-3-luca@z3ntu.xyz
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Extend the LMh dt binding document to include compatible string
supporting sm8150 SoC.
Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20220106173138.411097-4-thara.gopinath@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Convert the Samsung Exynos SoC Thermal Management Unit bindings to DT
schema format.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20220122132554.65192-2-krzysztof.kozlowski@canonical.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The 'phandle-array' type is a bit ambiguous. It can be either just an
array of phandles or an array of phandles plus args. Many schemas for
phandle-array properties aren't clear in the schema which case applies
though the description usually describes it.
The array of phandles case boils down to needing:
items:
maxItems: 1
The phandle plus args cases should typically take this form:
items:
- items:
- description: A phandle
- description: 1st arg cell
- description: 2nd arg cell
With this change, some examples need updating so that the bracketing of
property values matches the schema.
Signed-off-by: Rob Herring <robh@kernel.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Acked-by: Vinod Koul <vkoul@kernel.org>
Acked-by: Ulf Hansson <ulf.hansson@linaro.org>
Acked-by: Georgi Djakov <djakov@kernel.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Acked-by: Stephen Boyd <sboyd@kernel.org>
Acked-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Acked-by: Marc Kleine-Budde <mkl@pengutronix.de>
Link: https://lore.kernel.org/r/20220119015038.2433585-1-robh@kernel.org
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"Bindings:
- DT schema conversions for Samsung clocks, RNG bindings, Qcom
Command DB and rmtfs, gpio-restart, i2c-mux-gpio, i2c-mux-pinctl,
Tegra I2C and BPMP, pwm-vibrator, Arm DSU, and Cadence macb
- DT schema conversions for Broadcom platforms: interrupt
controllers, STB GPIO, STB waketimer, STB reset, iProc MDIO mux,
iProc PCIe, Cygnus PCIe PHY, PWM, USB BDC, BCM6328 LEDs, TMON,
SYSTEMPORT, AMAC, Northstar 2 PCIe PHY, GENET, moca PHY, GISB
arbiter, and SATA
- Add binding schemas for Tegra210 EMC table, TI DC-DC converters,
- Clean-ups of MDIO bus schemas to fix 'unevaluatedProperties' issues
- More fixes due to 'unevaluatedProperties' enabling
- Data type fixes and clean-ups of binding examples found in
preparation to move to validating DTB files directly (instead of
intermediate YAML representation.
- Vendor prefixes for T-Head Semiconductor, OnePlus, and Sunplus
- Add various new compatible strings
DT core:
- Silence a warning for overlapping reserved memory regions
- Reimplement unittest overlay tracking
- Fix stack frame size warning in unittest
- Clean-ups of early FDT scanning functions
- Fix handling of "linux,usable-memory-range" on EFI booted systems
- Add support for 'fail' status on CPU nodes
- Improve error message in of_phandle_iterator_next()
- kbuild: Disable duplicate unit-address warnings for disabled nodes"
* tag 'devicetree-for-5.17' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (114 commits)
dt-bindings: net: mdio: Drop resets/reset-names child properties
dt-bindings: clock: samsung: convert S5Pv210 to dtschema
dt-bindings: clock: samsung: convert Exynos5410 to dtschema
dt-bindings: clock: samsung: convert Exynos5260 to dtschema
dt-bindings: clock: samsung: extend Exynos7 bindings with UFS
dt-bindings: clock: samsung: convert Exynos7 to dtschema
dt-bindings: clock: samsung: convert Exynos5433 to dtschema
dt-bindings: i2c: maxim,max96712: Add bindings for Maxim Integrated MAX96712
dt-bindings: iio: adi,ltc2983: Fix 64-bit property sizes
dt-bindings: power: maxim,max17040: Fix incorrect type for 'maxim,rcomp'
dt-bindings: interrupt-controller: arm,gic-v3: Fix 'interrupts' cell size in example
dt-bindings: iio/magnetometer: yamaha,yas530: Fix invalid 'interrupts' in example
dt-bindings: clock: imx5: Drop clock consumer node from example
dt-bindings: Drop required 'interrupt-parent'
dt-bindings: net: ti,dp83869: Drop value on boolean 'ti,max-output-impedance'
dt-bindings: net: wireless: mt76: Fix 8-bit property sizes
dt-bindings: PCI: snps,dw-pcie-ep: Drop conflicting 'max-functions' schema
dt-bindings: i2c: st,stm32-i2c: Make each example a separate entry
dt-bindings: net: stm32-dwmac: Make each example a separate entry
dt-bindings: net: Cleanup MDIO node schemas
...
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git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull thermal control updates from Rafael Wysocki:
"These add a new driver for Renesas RZ/G2L TSU, update a few existing
thermal control drivers and clean up the tmon utility.
Specifics:
- Add new TSU driver and DT bindings for the Renesas RZ/G2L platform
(Biju Das).
- Fix missing check when calling reset_control_deassert() in the
rz2gl thermal driver (Biju Das).
- In preparation for FORTIFY_SOURCE performing compile-time and
run-time field bounds checking for memcpy(), avoid intentionally
writing across neighboring fields in the int340x thermal control
driver (Kees Cook).
- Fix RFIM mailbox write commands handling in the int340x thermal
control driver (Sumeet Pawnikar).
- Fix PM issue occurring in the iMX thermal control driver during
suspend/resume by implementing PM runtime support in it (Oleksij
Rempel).
- Add 'const' annotation to thermal_cooling_ops in the Intel
powerclamp driver (Rikard Falkeborn).
- Fix missing ADC bit set in the iMX8MP thermal driver to enable the
sensor (Paul Gerber).
- Drop unused local variable definition from tmon (ran jianping)"
* tag 'thermal-5.17-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm:
thermal/drivers/int340x: Fix RFIM mailbox write commands
thermal/drivers/rz2gl: Add error check for reset_control_deassert()
thermal/drivers/imx8mm: Enable ADC when enabling monitor
thermal/drivers: Add TSU driver for RZ/G2L
dt-bindings: thermal: Document Renesas RZ/G2L TSU
thermal/drivers/intel_powerclamp: Constify static thermal_cooling_device_ops
thermal/drivers/imx: Implement runtime PM support
thermal: tools: tmon: remove unneeded local variable
thermal: int340x: Use struct_group() for memcpy() region
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Convert the Tegra186 (and later) BPMP thermal device tree bindings from
the free-form text format to json-schema.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Thierry Reding <treding@nvidia.com>
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Convert the Broadcom AVS TMON Device Tree binding to YAML to help with
validation.
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Link: https://lore.kernel.org/r/20211208003727.3596577-12-f.fainelli@gmail.com
Signed-off-by: Rob Herring <robh@kernel.org>
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Document the Thermal Sensor Unit(TSU) in the RZ/G2L SoC.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Reviewed-by: Lad Prabhakar <prabhakar.mahadev-lad.rj@bp.renesas.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211130155757.17837-2-biju.das.jz@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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When converting the thermal-zones bindings to yaml the definition of the
contribution property changed. The intention is the same, an integer
value expressing a ratio of a sum on how much cooling is provided by the
device to the zone. But after the conversion the integer value is
limited to the range 0 to 100 and expressed as a percentage.
This is problematic for two reasons.
- This do not match how the binding is used. Out of the 18 files that
make use of the property only two (ste-dbx5x0.dtsi and
ste-hrefv60plus.dtsi) sets it at a value that satisfy the binding,
100. The remaining 16 files set the value higher and fail to validate.
- Expressing the value as a percentage instead of a ratio of the sum is
confusing as there is nothing to enforce the sum in the zone is not
greater then 100.
This patch restore the pre yaml conversion description and removes the
value limitation allowing the usage of the bindings to validate.
Fixes: 1202a442a31fd2e5 ("dt-bindings: thermal: Add yaml bindings for thermal zones")
Reported-by: Kieran Bingham <kieran.bingham+renesas@ideasonboard.com>
Signed-off-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Link: https://lore.kernel.org/r/20211109103045.1403686-1-niklas.soderlund+renesas@ragnatech.se
Signed-off-by: Rob Herring <robh@kernel.org>
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Not all @st.com email address are concerned, only people who have
a specific @foss.st.com email will see their entry updated.
For some people, who left the company, remove their email.
Cc: Alexandre Torgue <alexandre.torgue@foss.st.com>
Cc: Arnaud Pouliquen <arnaud.pouliquen@foss.st.com>
Cc: Fabien Dessenne <fabien.dessenne@foss.st.com>
Cc: Christophe Roullier <christophe.roullier@foss.st.com>
Cc: Gabriel Fernandez <gabriel.fernandez@foss.st.com>
Cc: Lionel Debieve <lionel.debieve@foss.st.com>
Cc: Amelie Delaunay <amelie.delaunay@foss.st.com>
Cc: Pierre-Yves MORDRET <pierre-yves.mordret@foss.st.com>
Cc: Ludovic Barre <ludovic.barre@foss.st.com>
Cc: Christophe Kerello <christophe.kerello@foss.st.com>
Cc: pascal Paillet <p.paillet@foss.st.com>
Cc: Erwan Le Ray <erwan.leray@foss.st.com>
Cc: Philippe CORNU <philippe.cornu@foss.st.com>
Cc: Yannick Fertre <yannick.fertre@foss.st.com>
Cc: Fabrice Gasnier <fabrice.gasnier@foss.st.com>
Cc: Olivier Moysan <olivier.moysan@foss.st.com>
Cc: Hugues Fruchet <hugues.fruchet@foss.st.com>
Signed-off-by: Patrice Chotard <patrice.chotard@foss.st.com>
Reviewed-by: Mathieu Poirier <mathieu.poirier@linaro.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Lee Jones <lee.jones@linaro.org>
Acked-By: Vinod Koul <vkoul@kernel.org>
Acked-by: Miquel Raynal <miquel.raynal@bootlin.com>
Link: https://lore.kernel.org/r/20211110150144.18272-6-patrice.chotard@foss.st.com
Signed-off-by: Rob Herring <robh@kernel.org>
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Update thermal binding document for UniPhier NX1 SoC.
Signed-off-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Link: https://lore.kernel.org/r/1634520891-16801-2-git-send-email-hayashi.kunihiko@socionext.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Remove redundent comments from rockchip-thermal.yaml
Sort compatibles in alphabetical order.
Signed-off-by: Johan Jonker <jbx6244@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210930110517.14323-2-jbx6244@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The tsadc node in rk356x.dtsi has more resets defined then currently
allowed by rockchip-thermal.yaml, so fix that in the documentation.
The driver now uses the devm_reset_control_array_get() function,
so reset-names is no longer required, but keep it for legacy reasons.
Signed-off-by: Johan Jonker <jbx6244@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20210930110517.14323-1-jbx6244@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The HC generation of the ADC Thermal Monitor is quite similar to the 5th
generation, but differs in valid values for a few properties. Create a
new binding for the HC version of the hardware, rather than sprinkle
conditionals throughout the existing binding.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20211005032531.2251928-2-bjorn.andersson@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add the tegra3 thermal sensor and fix the compilation testing on
tegra by adding a dependency on ARCH_TEGRA along with COMPILE_TEST
(Dmitry Osipenko)
- Fix the error code for the exynos when devm_get_clk() fails (Dan
Carpenter)
- Add the TCC cooling support for AlderLake platform (Sumeet Pawnikar)
- Add support for hardware trip points for the rcar gen3 thermal driver
and store TSC id as unsigned int (Niklas Söderlund)
- Replace the deprecated CPU-hotplug functions get_online_cpus() and
put_online_cpus (Sebastian Andrzej Siewior)
- Add the thermal tools directory in the MAINTAINERS file (Daniel
Lezcano)
- Fix the Makefile and the cross compilation flags for the userspace
'tmon' tool (Rolf Eike Beer)
- Allow to use the IMOK independently from the GDDV on Int340x (Sumeet
Pawnikar)
- Fix the stub thermal_cooling_device_register() function prototype
which does not match the real function (Arnd Bergmann)
- Make the thermal trip point optional in the DT bindings (Maxime
Ripard)
- Fix a typo in a comment in the core code (Geert Uytterhoeven)
- Reduce the verbosity of the trace in the SoC thermal tegra driver
(Dmitry Osipenko)
- Add the support for the LMh (Limit Management hardware) driver on the
QCom platforms (Thara Gopinath)
- Allow processing of HWP interrupt by adding a weak function in the
Intel driver (Srinivas Pandruvada)
- Prevent an abort of the sensor probe is a channel is not used
(Matthias Kaehlcke)
* tag 'thermal-v5.15-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux:
thermal/drivers/qcom/spmi-adc-tm5: Don't abort probing if a sensor is not used
thermal/drivers/intel: Allow processing of HWP interrupt
dt-bindings: thermal: Add dt binding for QCOM LMh
thermal/drivers/qcom: Add support for LMh driver
firmware: qcom_scm: Introduce SCM calls to access LMh
thermal/drivers/tegra-soctherm: Silence message about clamped temperature
thermal: Spelling s/scallbacks/callbacks/
dt-bindings: thermal: Make trips node optional
thermal/core: Fix thermal_cooling_device_register() prototype
thermal/drivers/int340x: Use IMOK independently
tools/thermal/tmon: Add cross compiling support
thermal/tools/tmon: Improve the Makefile
MAINTAINERS: Add missing userspace thermal tools to the thermal section
thermal/drivers/intel_powerclamp: Replace deprecated CPU-hotplug functions.
thermal/drivers/rcar_gen3_thermal: Store TSC id as unsigned int
thermal/drivers/rcar_gen3_thermal: Add support for hardware trip points
drivers/thermal/intel: Add TCC cooling support for AlderLake platform
thermal/drivers/exynos: Fix an error code in exynos_tmu_probe()
thermal/drivers/tegra: Correct compile-testing of drivers
thermal/drivers/tegra: Add driver for Tegra30 thermal sensor
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Add dt binding documentation to describe Qualcomm
Limits Management Hardware node.
Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210809191605.3742979-8-thara.gopinath@linaro.org
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Even though the previous binding made it a required child node, the
implementation in Linux never made it mandatory and just ignored thermal
zones without trip points.
This was even effectively encouraged, since the thermal core wouldn't
allow a thermal sensor to probe without a thermal zone.
In the case where you had a thermal device that had multiple sensors but
with enough knowledge to provide trip points for only a few of them,
this meant that the only way to make that driver probe was to provide a
thermal zone without the trips node required by the binding.
This obviously led to a fair number of device trees doing exactly that,
making the initial binding requirement ineffective.
Let's make it clear by dropping that requirement.
Cc: Amit Kucheria <amitk@kernel.org>
Cc: Daniel Lezcano <daniel.lezcano@linaro.org>
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Maxime Ripard <maxime@cerno.tech>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210721140424.725744-34-maxime@cerno.tech
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This will enable temperature reporting for various SoC
components.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@somainline.org>
Signed-off-by: Konrad Dybcio <konrad.dybcio@somainline.org>
Link: https://lore.kernel.org/r/20210728222542.54269-15-konrad.dybcio@somainline.org
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Add rk3568 sensor support (Finley Xiao)
- Add missing MODULE_DEVICE_TABLE for the Spreadtrum sensor (Chunyan
Zhang)
- Export additionnal attributes for the int340x thermal processor
(Srinivas Pandruvada)
- Add SC7280 compatible for the tsens driver (Rajeshwari Ravindra
Kamble)
- Fix kernel documentation for thermal_zone_device_unregister() and use
devm_platform_get_and_ioremap_resource() (Yang Yingliang)
- Fix coefficient calculations for the rcar_gen3 sensor driver (Niklas
Söderlund)
- Fix shadowing variable rcar_gen3_ths_tj_1 (Geert Uytterhoeven)
- Add missing of_node_put() for the iMX and Spreadtrum sensors
(Krzysztof Kozlowski)
- Add tegra3 thermal sensor DT bindings (Dmitry Osipenko)
- Stop the thermal zone monitoring when unregistering it to prevent a
temperature update without the 'get_temp' callback (Dmitry Osipenko)
- Add rk3568 DT bindings, convert bindings to yaml schemas and add the
corresponding compatible in the Rockchip sensor (Ezequiel Garcia)
- Add the sc8180x compatible for the Qualcomm tsensor (Bjorn Andersson)
- Use the find_first_zero_bit() function instead of custom code (Andy
Shevchenko)
- Fix the kernel doc for the device cooling device (Yang Li)
- Reorg the processor thermal int340x to set the scene for the PCI mmio
driver (Srinivas Pandruvada)
- Add PCI MMIO driver for the int340x processor thermal driver
(Srinivas Pandruvada)
- Add hwmon sensors for the mediatek sensor (Frank Wunderlich)
- Fix warning for return value reported by Smatch for the int340x
thermal processor (Srinivas Pandruvada)
- Fix wrong register access and decoding for the int340x thermal
processor (Srinivas Pandruvada)
* tag 'thermal-v5.14-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (23 commits)
thermal/drivers/int340x/processor_thermal: Fix tcc setting
thermal/drivers/int340x/processor_thermal: Fix warning for return value
thermal/drivers/mediatek: Add sensors-support
thermal/drivers/int340x/processor_thermal: Add PCI MMIO based thermal driver
thermal/drivers/int340x/processor_thermal: Split enumeration and processing part
thermal: devfreq_cooling: Fix kernel-doc
thermal/drivers/intel/intel_soc_dts_iosf: Switch to use find_first_zero_bit()
dt-bindings: thermal: tsens: Add sc8180x compatible
dt-bindings: rockchip-thermal: Support the RK3568 SoC compatible
dt-bindings: thermal: convert rockchip-thermal to json-schema
thermal/core/thermal_of: Stop zone device before unregistering it
dt-bindings: thermal: Add binding for Tegra30 thermal sensor
thermal/drivers/sprd: Add missing of_node_put for loop iteration
thermal/drivers/imx_sc: Add missing of_node_put for loop iteration
thermal/drivers/rcar_gen3_thermal: Do not shadow rcar_gen3_ths_tj_1
thermal/drivers/rcar_gen3_thermal: Fix coefficient calculations
thermal/drivers/st: Use devm_platform_get_and_ioremap_resource()
thermal/core: Correct function name thermal_zone_device_unregister()
dt-bindings: thermal: tsens: Add compatible string to TSENS binding for SC7280
thermal/drivers/int340x: processor_thermal: Export additional attributes
...
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The Qualcomm sc8180x platform has the usual tsens blocks, add compatible
for this.
Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Acked-by: Thara Gopinath <thara.gopinath@linaro.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210608201638.2136344-1-bjorn.andersson@linaro.org
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Add a new compatible for the thermal sensor device on RK3568 SoCs.
Signed-off-by: Ezequiel Garcia <ezequiel@collabora.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210506175514.168365-4-ezequiel@collabora.com
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Convert Rockchip Thermal sensor dt-bindings to YAML.
Signed-off-by: Ezequiel Garcia <ezequiel@collabora.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210506175514.168365-3-ezequiel@collabora.com
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All NVIDIA Tegra30 SoCs have on-chip sensors which monitor temperature
and voltage of the SoC. Sensors also controls CPU x2 freq throttle and
emits emergency shutdown signal. TSENSOR has has two separate channels
for each sensor placed in a different parts of the SoC. Add binding for
the sensor hardware.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Dmitry Osipenko <digetx@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210616190417.32214-2-digetx@gmail.com
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