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Move USB PHYs to a standard arrays for Exynos EHCI/OHCI devices. This
resolves the conflict between Exynos EHCI/OHCI sub-nodes and generic USB
device bindings. Once the Exynos EHCI/OHCI sub-nodes are removed, the
boards can finally provide sub-nodes for the USB devices using generic USB
device bindings.
Suggested-by: Måns Rullgård <mans@mansr.com>
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Link: https://lore.kernel.org/r/20190726081453.9456-4-m.szyprowski@samsung.com
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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The old "cooling-{min,max}-state" properties for thermal bindings were
ratified to "cooling-{min,max}-level" by commit eb168b70dea5 ("of:
thermal: Fix inconsitency between cooling-*-state and cooling-*-level"),
which were later removed entirely by commit e04907dbc259 ("dt-bindings:
thermal: Remove "cooling-{min|max}-level" properties").
The pwm-fan binding, however, was apparently in-flight in parallel with
that ratification, and so managed to introduce an example of the old
properties which escaped the scope of the later cleanup and has thus
continued to be dutifully copied for new boards despite being useless.
Clean up these remaining undocumented anachronisms to minimise any
further confusion.
Acked-by: Guenter Roeck <linux@roeck-us.net>
Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>
Acked-by: Thierry Reding <treding@nvidia.com>
Acked-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Shawn Guo <shawnguo@kernel.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Robin Murphy <robin.murphy@arm.com>
Signed-off-by: Olof Johansson <olof@lixom.net>
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Add ADC node to Odroid U3 with its regulator, purely for documentation
purposes. The ADC stays disabled because it is not used (all inputs
grounded).
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Each CPU can (and does) participate in cooling down the system but the
DT only captures a handful of them, normally CPU0, in the cooling maps.
Things work by chance currently as under normal circumstances its the
first CPU of each cluster which is used by the operating systems to
probe the cooling devices. But as soon as this CPU ordering changes and
any other CPU is used to bring up the cooling device, we will start
seeing failures.
Also the DT is rather incomplete when we list only one CPU in the
cooling maps, as the hardware doesn't have any such limitations.
Update cooling maps to include all devices affected by individual trip
points.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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This patch switches Odroid X/X2/U3 to use dedicated Odroid audio subsystem
DT bindings instead of the simple-card in order to add support for audio
over HDMI.
Signed-off-by: Sylwester Nawrocki <s.nawrocki@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Replace GPL v2.0 license statements with SPDX license identifiers.
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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The Odroid-U3 board has an IP4791CZ12 level shifter that is
disabled if the HPD is low, which means that the CEC pin is
disabled as well.
Signed-off-by: Hans Verkuil <hans.verkuil@cisco.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Add CPU operating points for Exynos4412 Prime (it supports
additional 1704MHz & 1600MHz OPPs and 1500MHz OPP is just
a regular non-turbo OPP on this SoC). Also update relevant
cooling maps to account for new OPPs.
ODROID-X2/U2/U3 boards use Exynos4412 Prime SoC version so
update their board files accordingly.
Based on Hardkernel's kernel for ODROID-X2/U2/U3 boards.
Cc: Doug Anderson <dianders@chromium.org>
Cc: Andreas Faerber <afaerber@suse.de>
Cc: Thomas Abraham <thomas.ab@samsung.com>
Cc: Tobias Jakobi <tjakobi@math.uni-bielefeld.de>
Cc: Ben Gamari <ben@smart-cactus.org>
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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This patch fixes the following DTC warnings:
"Node /memory has a reg or ranges property, but no unit name"
Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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The skeleton.dtsi file was removed in ARM64 for different reasons as
explained in commit ("3ebee5a2e141 arm64: dts: kill skeleton.dtsi").
These also applies to ARM and it will also allow to get rid of the
following DTC warnings in the future:
"Node /memory has a reg or ranges property, but no unit name"
The disassembled DTB are almost the same besides an empty chosen
node being removed and nodes reordered, so it should not have
functional changes.
Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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The eMMC card vmmc-supply contained incorrectly two regulators: LDO20
and buck8. The second one is ignored. Additionally the buck8 is a vqmmc
supply only on X and X2. On U3 the buck8 is providing power to the LAN
(SMSC95xx) so instead the LDO22 should be used.
Fix this by defining proper vmmc and vqmmc supplies for respective
boards.
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Reviewed-by: Javier Martinez Canillas <javier@osg.samsung.com>
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The <dt-bindings/gpio/gpio.h> header is already included in the
exynos4412-odroid-common DTSI so there's no need to do it again
in the DTS file.
Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
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The board DTS are using numeric values instead of the defined GPIO
constanst to express polarity, use them to make the DTS more clear.
Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Kukjin Kim <kgene@kernel.org>
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With those bindings it is possible to use pwm-fan device available in
Odroid U3 as a cooling device.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Reviewed-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Kukjin Kim <kgene@kernel.org>
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Add pwm-fan node to the Odroid-U3 board file to enable PWM control of the
cooling fan. In addition, add the "pwm" label to the pwm@139D0000 node
in the exynos4412.dtsi.
Signed-off-by: Kamil Debski <k.debski@samsung.com>
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Kukjin Kim <kgene@kernel.org>
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SPI1 is available on IO Port #2 (as depicted on their website)
in PCB Revision 0.5 of Hardkernel Odroid U3 board.
The shield connects a 256KiB spi-nor flash on that bus.
Signed-off-by: Alexis Ballier <aballier@gentoo.org>
Reviewed-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Kukjin Kim <kgene@kernel.org>
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Now when the CDCLK I2S output clock can be handled through the clock
API the Odroid X2/U3 can be switched to the simple-audio-card DT binding.
Signed-off-by: Sylwester Nawrocki <s.nawrocki@samsung.com>
Signed-off-by: Mark Brown <broonie@kernel.org>
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Add MAX98090 audio codec, I2S interface and the sound complex
nodes to enable audio on Odroid-X2/U3 boards.
Signed-off-by: Sylwester Nawrocki <s.nawrocki@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
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This patch moves some parts of exynos4412-odroidx.dts to common
exynos4412-odroid-common.dtsi file and adds support for Odroid X2 and
U2/U3 boards. X2 is same as X, but it has faster SoC module (1.7GHz
instead of 1.4GHz), while U2/U3 differs from X2 by different way of
routing signals to host USB hub. It also lacks some hw modules not yet
supported by those dts files (i.e. LCD & touch panel).
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
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