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The arm dts directory has grown to 1559 boards which makes it a bit
unwieldy to maintain and use. Past attempts stalled out due to plans to
move .dts files out of the kernel tree. Doing that is no longer planned
(any time soon at least), so let's go ahead and group .dts files by
vendors. This move aligns arm with arm64 .dts file structure.
There's no change to dtbs_install as the flat structure is maintained on
install.
The naming of vendor directories is roughly in this order of preference:
- Matching original and current SoC vendor prefix/name (e.g. ti, qcom)
- Current vendor prefix/name if still actively sold (SoCs which have
been aquired) (e.g. nxp/imx)
- Existing platform name for older platforms not sold/maintained by any
company (e.g. gemini, nspire)
The whole move was scripted with the exception of MAINTAINERS and a few
makefile fixups.
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Acked-by: Michal Simek <michal.simek@amd.com> #Xilinx
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Acked-by: Neil Armstrong <neil.armstrong@linaro.org>
Acked-by: Paul Barker <paul.barker@sancloud.com>
Acked-by: Tony Lindgren <tony@atomide.com>
Acked-by: Gregory CLEMENT <gregory.clement@bootlin.com>
Acked-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Wei Xu <xuwei5@hisilicon.com> #hisilicon
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Acked-by: Nick Hawkins <nick.hawkins@hpe.com>
Acked-by: Baruch Siach <baruch@tkos.co.il>
Reviewed-by: Linus Walleij <linus.walleij@linaro.org>
Reviewed-by: Andre Przywara <andre.przywara@arm.com>
Acked-by: Andre Przywara <andre.przywara@arm.com>
Reviewed-by: Claudiu Beznea <claudiu.beznea@microchip.com>
Acked-by: Peter Rosin <peda@axentia.se>
Acked-by: Jesper Nilsson <jesper.nilsson@axis.com>
Acked-by: Sudeep Holla <sudeep.holla@arm.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #broadcom
Acked-by: Manivannan Sadhasivam <mani@kernel.org>
Reviewed-by: Jisheng Zhang <jszhang@kernel.org>
Acked-by: Patrice Chotard <patrice.chotard@foss.st.com>
Acked-by: Romain Perier <romain.perier@gmail.com>
Acked-by: Alexandre TORGUE <alexandre.torgue@st.com>
Acked-by: Shawn Guo <shawnguo@kernel.org>
Acked-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com>
Acked-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Rob Herring <robh@kernel.org>
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Add aliases for eMMC, SD card and WiFi where applicable, so that
assigned mmc indeces are always the same.
Co-developed-by: Anton Bambura <jenneron@protonmail.com>
Signed-off-by: Anton Bambura <jenneron@protonmail.com>
[ Tested on exynos5800-peach-pi ]
Tested-by: Valentine Iourine <iourine@iourine.msk.su>
Signed-off-by: Henrik Grimler <henrik@grimler.se>
Tested-by: Marek Szyprowski <m.szyprowski@samsung.com>
Link: https://lore.kernel.org/r/20230402144724.17839-3-henrik@grimler.se
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
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Previously, the mshc0 alias has been necessary so that
MMC_CAP_1_8V_DDR | MMC_CAP_8_BIT_DATA are set for mshc_0/mmc_0.
However, these capabilities should be described in the device tree so
that we do not have to rely on the alias.
The property mmc-ddr-1_8v replaces MMC_CAP_1_8V_DDR, while bus_width =
<8>, which is already set for all the mshc0/mmc0 nodes, replaces
MMC_CAP_8_BIT_DATA.
Also drop other mshc aliases as they are not needed.
Signed-off-by: Henrik Grimler <henrik@grimler.se>
Tested-by: Marek Szyprowski <m.szyprowski@samsung.com>
Link: https://lore.kernel.org/r/20230402144724.17839-2-henrik@grimler.se
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
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TMU node uses 0 as thermal-sensor-cells, thus thermal zone referencing
it must not have an argument to phandle. This was not critical before,
but since rework of thermal Devicetree initialization in the
commit 3fd6d6e2b4e8 ("thermal/of: Rework the thermal device tree
initialization"), this leads to errors registering thermal zones other
than first one:
thermal_sys: cpu0-thermal: Failed to read thermal-sensors cells: -2
thermal_sys: Failed to find thermal zone for tmu id=0
exynos-tmu 10064000.tmu: Failed to register sensor: -2
exynos-tmu: probe of 10064000.tmu failed with error -2
Fixes: f1722d7dd8b8 ("ARM: dts: Define default thermal-zones for exynos5422")
Cc: <stable@vger.kernel.org>
Link: https://lore.kernel.org/r/20230209105841.779596-6-krzysztof.kozlowski@linaro.org
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
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Align the pin controller related nodes with dtschema. No functional
change expected.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com>
Link: https://lore.kernel.org/r/20220111201722.327219-10-krzysztof.kozlowski@canonical.com
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The Devicetree specification expects device node names to have a generic
name, representing the class of a device. Also the convention for node
names is to use hyphens, not underscores.
No functional changes.
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Link: https://lore.kernel.org/r/20201027170947.132725-9-krzk@kernel.org
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Add trip points and cooling maps for GPU thermal zone for Odroid
XU3/XU4/HC1 boards. Trip points are based on the CPU thermal zone for the
those boards.
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Add missing 2.0GHz, 1.9GHz & 1.8GHz OPPs (for A15 cores) and 1.4GHz
OPP (for A7 cores). Also update common Odroid-XU3 Lite/XU3/XU4
thermal cooling maps to account for new OPPs.
Since some new OPPs are not available on all Exynos5422/5800 boards
modify dts files for Odroid XU3 Lite (limited to 1.8 GHz / 1.3 GHz) &
Peach Pi (limited to 2.0 GHz / 1.3 GHz) accordingly.
This patch uses maximum voltages for new OPPs. This is a temporary
solution till proper Exynos ASV support is added.
Also while at it fix the number of cooling down steps for big cores
(should be 11 instead of 12 on Odroid XU3 Lite and 14 on XU3/XU4).
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
[mszyprow: rebased onto v5.5-rc1 and adapted to recent dts changes,
fixed removal of the 1.4GHz OPP for A7s on Peach-Pi]
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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The eMMC memory on Odroid XU3/XU4 boards is supplied by two regulators
LDO18 and buck10 (and LDO13 for the host interface).
However the Odroid HC1 board does not have eMMC connector so this
regulator does not have to be always on.
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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The old "cooling-{min,max}-state" properties for thermal bindings were
ratified to "cooling-{min,max}-level" by commit eb168b70dea5 ("of:
thermal: Fix inconsitency between cooling-*-state and cooling-*-level"),
which were later removed entirely by commit e04907dbc259 ("dt-bindings:
thermal: Remove "cooling-{min|max}-level" properties").
The pwm-fan binding, however, was apparently in-flight in parallel with
that ratification, and so managed to introduce an example of the old
properties which escaped the scope of the later cleanup and has thus
continued to be dutifully copied for new boards despite being useless.
Clean up these remaining undocumented anachronisms to minimise any
further confusion.
Acked-by: Guenter Roeck <linux@roeck-us.net>
Reviewed-by: Krzysztof Kozlowski <krzk@kernel.org>
Acked-by: Thierry Reding <treding@nvidia.com>
Acked-by: Heiko Stuebner <heiko@sntech.de>
Acked-by: Shawn Guo <shawnguo@kernel.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Robin Murphy <robin.murphy@arm.com>
Signed-off-by: Olof Johansson <olof@lixom.net>
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Odroid HC1 uses the exynos5422-odroid-core.dtsi file as a base. All
other Exynos5422 Odroids use the "common". The ADC node was defined
only in the latter.
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Each CPU can (and does) participate in cooling down the system but the
DT only captures a handful of them, normally CPU0, in the cooling maps.
Things work by chance currently as under normal circumstances its the
first CPU of each cluster which is used by the operating systems to
probe the cooling devices. But as soon as this CPU ordering changes and
any other CPU is used to bring up the cooling device, we will start
seeing failures.
Also the DT is rather incomplete when we list only one CPU in the
cooling maps, as the hardware doesn't have any such limitations.
Update cooling maps to include all devices affected by individual trip
points.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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There are two common DTSI files for Exynos5422 Odroid XU3 family of
boards. One is shared between all of them (XU3, XU3-Lite, XU4 and HC1)
and the second skips HC1. Document this in the files.
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Set the eMMC max-frequency to 200MHz for optimal performance on Odroid
XU3/XU4 family of boards.
Signed-off-by: Anand Moon <linux.amoon@gmail.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Disable unused PMIC regulators on Exynos5422 Odroid boards to reduce
energy used. According to schematics:
1. LDO12, LDO16 and LDO24 are not connected,
2. LDO26 is not used on Odroid HC1.
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Replace GPL v2.0 license statements with SPDX license identifiers.
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Odroid HC1 board is based on Odroid XU4 board, but it has no HDMI,
no eMMC, no built-in USB3.0 hub, no extension port pins, and no GPIO
button. USB3.0 ports are used for built-in JMicron USB to SATA bridge
and Gigabit R8152 ethernet chips. HC1 uses only passive cooling.
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Audio subsystem clocks configuration is a part of audio block,
so there it should be moved to exynos5422-odroidxu3-audio.dtsi
to avoid it on Odroid XU4, which has no audio codec.
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Reviewed-by: Sylwester Nawrocki <s.nawrocki@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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HDMI support requires some additional off-SoC logic, so Mixer device (part
of HDMI display path) should be disabled by default in SoC dtsi and enabled
then in each board dts. This patch unifies Mixer handling with other
Exynos SoCs.
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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boards
Commit 2b7681326dc2 ("drm/exynos: hdmi: remove the i2c drivers and use")
merged to v3.15 kernel added a required 'ddc' property to Exynos HDMI
device tree bindings, which should point to i2c bus used for handling DDC
(mainly reading display's EDID information). It has been enough time to
convert all boards to use new bindings, but sadly due to copy/paste design
the old approach using separate node with 'samsung,exynos4210-hdmiddc'
compatible was used also for many new boards. This patch finally converts
all boards to the new approach and unifies HDMI DDC definition across all
Exynos boards.
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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The power button (SW2) on Odroid XU3/4 is connected to the PWRON pin
of the S2MPS11 PMIC.
The S2MPS11 datasheet says that ONOB pin operates as 'PWRON key active
low signal'. In fact, S2MPS11 PMIC acts as a 16ms debouce filter and
signal inverter, thus effectively repeating PWRON (active high) to ONOB
pin (active low).
ONOB PMIC pin is then connected to XEINT3 SoC pin, so we get the state
of the power button on the gpx0-3 GPIO.
This patch adds device-tree bindings for the power button of Odroid
XU3/4 boards.
Signed-off-by: Brian Kim <brian.kim@hardkernel.com>
[mszyprow: extended commit message, added comments and fixed minor
issues in the dts]
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Reviewed-by: Anand Moon <linux.amoon@gmail.com>
Tested-by: Anand Moon <linux.amoon@gmail.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Odroid XU3/4 boards have thermal sensors per 4 pairs of A7+A15
cores but currently there is only one thermal-zone (including
cooling maps) defined (for the first pair of cores - the first
core of the A7 cluster and the first core of A15 cluster) so
i.e. if the task is running on any of A15 cores but the first
one, such core can reach high temperature without any proper
cooling action.
Fix it by adding missing thermal-zones definitions.
Also while at it fix the number of steps in cpufreq cooling for
cpu4 (11 steps for A15 corresponds to 700MHz, for 600MHz 12 steps
should be used).
Signed-off-by: Willy Wolff <willy.mh.wolff@gmail.com>
[b.zolnierkie: rewrote patch subject & description + minor fixups]
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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CEC support was added for Exynos5 in 4.13, but for the Odroids we need to set
'needs-hpd' as well since CEC is disabled when there is no HDMI hotplug signal,
just as for the exynos4 Odroid-U3.
This is due to the level-shifter that is disabled when there is no HPD, thus
blocking the CEC signal as well. Same close-but-no-cigar board design as the
Odroid-U3.
Tested with my Odroid XU4.
Signed-off-by: Hans Verkuil <hans.verkuil@cisco.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
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Exynos5250 and Exynos542x SoCs have the same CEC hardware module as
Exynos4 SoC series, so enable support for it using the same compatible
string.
Tested on Odroid XU3 (Exynos5422) and Google Snow (Exynos5250) boards.
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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During my research I found that some of the requirements for the memory
buffers for MFC v6+ devices were blindly copied from the previous (v5)
version and simply turned out to be excessive. The relaxed requirements
are applied by the recent patches to the MFC driver and the driver is
now fully functional even without the reserved memory blocks for all
v6+ variants. This patch removes those reserved memory nodes from all
boards having MFC v6+ hardware block.
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Reviewed-by: Javier Martinez Canillas <javier@osg.samsung.com>
Tested-by: Javier Martinez Canillas <javier@osg.samsung.com>
Acked-by: Andrzej Hajda <a.hajda@samsung.com>
Tested-by: Smitha T Murthy <smitha.t@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Odroid XU3/4 didn't need to use the cd-gpios for detecting card.
Because host controller has the CDETECT register through SDx_CDN line.
Host controller can know whether card is inserted or not with this
register.
When I have checked the Odroid XU3/4, they are using CDETECT register
(not using exteranl cd-gpio).
Signed-off-by: Jaehoon Chung <jh80.chung@samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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Odroid-X, -X2, -XU3 and -XU4 have SOC-ADC routed to an external connector.
Enable the ADC for use as iio-device.
Signed-off-by: Markus Reichl <m.reichl@fivetechno.de>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/krzk/linux into next/dt
Pull "Topic branch for Samsung DeviceTree cleanup for 4.9" from Krzysztof Kozłowski:
Replace in DT sources hard-coded values for pinctrl configuration like pull
up/down, drive strength and function. This makes the DTS easier to read,
especially that some drive strengths values are quite non-obvious.
* tag 'samsung-dt-pinctrl-4.9' of git://git.kernel.org/pub/scm/linux/kernel/git/krzk/linux:
ARM: dts: s3c64xx: Use macros for pinctrl configuration
ARM: dts: s3c2416: Use macros for pinctrl configuration
ARM: dts: s5pv210: Use macros for pinctrl configuration
ARM: dts: s3c64xx: Use common macros for pinctrl configuration
ARM: dts: exynos: Fix mismatched values of SD drive strengh configuration on exynos4415
ARM: dts: exynos: Fix mismatched value for SD4 pull up/down configuration on exynos4210
ARM: dts: exynos: Use macros for pinctrl configuration on exynos542x/exynos5800
ARM: dts: exynos: Use macros for pinctrl configuration on exynos5410
ARM: dts: exynos: Use macros for pinctrl configuration on exynos5260
ARM: dts: exynos: Use macros for pinctrl configuration on exynos5250
ARM: dts: exynos: Use macros for pinctrl configuration on exynos4415
ARM: dts: exynos: Use macros for pinctrl configuration on exynos4x12
ARM: dts: exynos: Use macros for pinctrl configuration on exynos4210
ARM: dts: exynos: Use macros for pinctrl configuration on exynos3250
ARM: dts: exynos: Use common macros for pinctrl configuration
pinctrl: dt-bindings: samsung: Update documentation with new macros
pinctrl: dt-bindings: samsung: Add header with values used for configuration
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Usage of DTS macros instead of hard-coded numbers makes code easier to
read. One does not have to remember which value means pull-up/down or
specific driver strength.
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Reviewed-by: Javier Martinez Canillas <javier@osg.samsung.com>
Acked-by: Linus Walleij <linus.walleij@linaro.org>
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This patch fixes the following DTC warnings:
"Node /memory has a reg or ranges property, but no unit name"
Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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The skeleton.dtsi file was removed in ARM64 for different reasons as
explained in commit ("3ebee5a2e141 arm64: dts: kill skeleton.dtsi").
These also applies to ARM and it will also allow to get rid of the
following DTC warnings in the future:
"Node /memory has a reg or ranges property, but no unit name"
The disassembled DTB are almost the same besides an empty chosen
node being removed and nodes reordered, so it should not have
functional changes.
Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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This patch enables getting a HPD GPIO descriptor quicker.
The exynos-hdmi driver uses "hpd" for HDMI hot plug detection.
static int hdmi_resources_init(struct hdmi_context *hdata)
{
...
hdata->hpd_gpio = devm_gpiod_get(dev, "hpd", GPIOD_IN);
...
}
This calls 'of_find_gpio()' and it generates the GPIO consumer ID by referring
GPIO suffix. So 'hpd-gpios' is preferred on getting a GPIO descriptor.
However, if the device tree uses 'hpd-gpio', then the exynos-hdmi driver
always retries to get a GPIO descriptor because the first GPIO suffix is not
'gpio' but 'gpios'. So you always see the debug message below.
of_get_named_gpiod_flags: can't parse 'hpd-gpios' property of node '/soc/hdmi@14530000[0]'
Use the preferred property, 'hpd-gpios' instead of 'hpd-gpio'.
Acked-by: Rob Herring <robh@kernel.org>
Reviewed-by: Andrzej Hajda <a.hajda@samsung.com>
Cc: devicetree@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Milo Kim <woogyom.kim@gmail.com>
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
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to Odroid XU/XU3/XU4
The "linux,stdout-path" is deprecated.
Add serial options so the console can be properly configured when
bootloader does not pass "console" parameter to the command line. Without
options and lack of "console" in command line, the serial output dies
during boot (just after probing sound, probably because of rate change).
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Reviewed-by: Javier Martinez Canillas <javier@osg.samsung.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/krzk/linux into next/dt
Topic branch for Exynos MFC changes for v4.8, part 2:
Replace hardcoded reserved memory ranges with auto-allocated ones
and enable MFC for all boards.
* tag 'samsung-drivers-exynos-mfc-4.8-2' of git://git.kernel.org/pub/scm/linux/kernel/git/krzk/linux:
ARM: dts: exynos: enable MFC device for all boards
ARM: dts: exynos: move MFC reserved memory regions from boards to .dtsi
ARM: dts: exynos: replace hardcoded reserved memory ranges with auto-allocated ones
ARM: dts: exynos: Enable MFC device on Exynos4412 Odroid boards
ARM: dts: exynos: Convert MFC device to generic reserved memory bindings
ARM: EXYNOS: Remove code for MFC custom reserved memory handling
media: s5p-mfc: add iommu support
media: s5p-mfc: replace custom reserved memory handling code with generic one
media: s5p-mfc: use generic reserved memory bindings
of: reserved_mem: add support for using more than one region for given device
media: set proper max seg size for devices on Exynos SoCs
media: vb2-dma-contig: add helper for setting dma max seg size
s5p-mfc: Fix race between s5p_mfc_probe() and s5p_mfc_open()
s5p-mfc: Add release callback for memory region devs
s5p-mfc: Set device name for reserved memory region devs
Signed-off-by: Olof Johansson <olof@lixom.net>
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This patch moves assigning reserved memory regions from each board dts
to common exynos-mfc-reserved-memory.dtsi file, where those regions are
defined.
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Reviewed-by: Javier Martinez Canillas <javier@osg.samsung.com>
Tested-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
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The thermal nodes are not disabled in exynos5420.dtsi so there is no
need to manually enable them on Odroid XU3/XU3-Lite/XU4 boards.
Signed-off-by: Krzysztof Kozlowski <krzk@kernel.org>
Reviewed-by: Javier Martinez Canillas <javier@osg.samsung.com>
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This patch replaces custom properties for defining reserved memory
regions with generic reserved memory bindings for MFC video codec
device.
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Reviewed-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Reviewed-by: Javier Martinez Canillas <javier@osg.samsung.com>
Tested-by: Javier Martinez Canillas <javier@osg.samsung.com>
[k.kozlowski: Add Samsung copyrights]
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
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Include the CPU thermal nodes directly in Odroid XU3-family common DTS
because it is the only user of it. Keeping it in separate DTSI file does
not bring benefits because:
1. It is not re-usable on other non-fan boards (fan is referenced),
2. It won't be re-used on future Odroid XU board because different
CPU cluster behavior.
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Reviewed-by: Javier Martinez Canillas <javier@osg.samsung.com>
Tested-by: Anand Moon <linux.amoon@gmail.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc
Pull ARM SoC late DT updates from Arnd Bergmann:
"This is a collection of a few late fixes and other misc stuff that had
dependencies on things being merged from other trees.
The Renesas R-Car power domain handling, and the Nvidia Tegra USB
support both hand notable changes that required changing the DT
binding in a way that only provides compatibility with old DT blobs on
new kernels but not vice versa. As a consequence, the DT changes are
based on top of the driver changes and are now in this branch.
For NXP i.MX and Samsung Exynos, the changes in here depend on other
changes that got merged through the clk maintainer tree"
* tag 'armsoc-late' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (35 commits)
ARM: dts: exynos: Add support of Bus frequency using VDD_INT for exynos5422-odroidxu3
ARM: dts: exynos: Add bus nodes using VDD_INT for Exynos542x SoC
ARM: dts: exynos: Add NoC Probe dt node for Exynos542x SoC
ARM: dts: exynos: Add support of bus frequency for exynos4412-trats/odroidu3
ARM: dts: exynos: Expand the voltage range of buck1/3 regulator for exynos4412-odroidu3
ARM: dts: exynos: Add support of bus frequency using VDD_INT for exynos3250-rinato
ARM: dts: exynos: Add exynos4412-ppmu-common dtsi to delete duplicate PPMU nodes
ARM: dts: exynos: Add bus nodes using VDD_MIF for Exynos4210
ARM: dts: exynos: Add bus nodes using VDD_INT for Exynos4x12
ARM: dts: exynos: Add bus nodes using VDD_MIF for Exynos4x12
ARM: dts: exynos: Add bus nodes using VDD_INT for Exynos3250
ARM: dts: exynos: Add DMC bus frequency for exynos3250-rinato/monk
ARM: dts: exynos: Add DMC bus node for Exynos3250
ARM: tegra: Enable XUSB on Nyan
ARM: tegra: Enable XUSB on Jetson TK1
ARM: tegra: Enable XUSB on Venice2
ARM: tegra: Add Tegra124 XUSB controller
ARM: tegra: Move Tegra124 to the new XUSB pad controller binding
ARM: dts: r8a7794: Use SYSC "always-on" PM Domain
ARM: dts: r8a7793: Use SYSC "always-on" PM Domain
...
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exynos5422-odroidxu3
This patch adds the bus device tree nodes for INT (Internal) block
to enable the AMBA bus frequency scaling and add the NoC (Network on Chip)
Probe Device Tree node to measure the bandwidth for AMBA AXI bus.
The WCORE bus bus is parent device in INT block using VDD_INT.
Signed-off-by: Chanwoo Choi <cw00.choi@samsung.com>
Tested-by: Markus Reichl <m.reichl@fivetechno.de>
Tested-by: Anand Moon <linux.amoon@gmail.com>
Reviewed-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
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Exynos5420 boards
The bindings like s2mps11,buck6-ramp-enable or s2mps11,buck2-ramp-delay
were ignored. They were never parsed by s2mps11 regulator driver. Also
the values used in these bindings were equal to default reset values of
S2MPS11 device. It is safe to remove them.
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Reviewed-by: Javier Martinez Canillas <javier@osg.samsung.com>
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Add vmmc and vqmmc supplies from MF circuit sheets for eMMC and SD on
odroid XU3 and XU4 to avoid warnings:
dwmmc_exynos 12200000.mmc: Looking up vmmc-supply property in node /mmc@12200000 failed
Also remove their always_on properties so the regulators could be
disabled when not used.
Signed-off-by: Markus Reichl <m.reichl@fivetechno.de>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
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Add cluster regulator supply properties as a preparation to
adding generic cpufreq-dt driver support for Exynos542x and
Exynos5800 based boards.
Cc: Doug Anderson <dianders@chromium.org>
Cc: Javier Martinez Canillas <javier@osg.samsung.com>
Cc: Andreas Faerber <afaerber@suse.de>
Cc: Thomas Abraham <thomas.ab@samsung.com>
Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
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FIMD device is not used at all on Exynos5422-based Odroid XU3-lite and
XU4. XU3 board theorethically can support FIMD with DisplayPort
connector, but due to hw limitation/design it doesn't work in most
cases. It is also not even enabled in XU3 dts file.
FIMD node was enabled mainly due to limitation of early Exynos DRM
driver, which didn't initialize properly when no FIMD device was
available. This node can be now safely removed from XU3-common dtsi and
added layer to Odroid XU3 dts, when Display Port driver gets enabled.
Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
Tested-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Reviewed-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
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The board DTS are using numeric values instead of the defined GPIO
constanst to express polarity, use them to make the DTS more clear.
Signed-off-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Kukjin Kim <kgene@kernel.org>
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Add Hardkernel Odroid XU4 board Device Tree sources. The board differs
from Odroid XU3 and XU3-Lite by:
1. No green and red LEDs (except standard red power LED).
2. Only two PWM outputs are used (fan and blue LED)
3. No audio codec.
4. Two USB3 ports in host mode (no micro USB3 connector for OTG).
5. Realtek RTL8153-CG gigabit network adapter (instead of SMSC9514).
6. Additional connector with IO ports (I2S_0, I2C_5).
7. No DisplayPort (like XU3-Lite).
8. No TI INA231 power measurement sensors (like XU3-Lite).
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Reviewed-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Kukjin Kim <kgene@kernel.org>
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The Odroid XU4 board does not have audio codec so before adding DTS
for new board split the audio codec to separate DTSI file. Include
the audio codec DTSI in Odroid XU3 and XU3-Lite boards.
Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Reviewed-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Kukjin Kim <kgene@kernel.org>
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The Odroid XU3 family boards have ACOKB pin of PMIC grounded, instead of
pulled up as usual. This means that PMIC must manually set PWRHOLD field
in its CTRL1 register to low before initiating power down.
This fixes Odroid XU3 powering off:
[ 25.966053] reboot: Power down
[ 25.967679] Power down.
[ 26.070174] Power down failed, please power off system manually.
Signed-off-by: Krzysztof Kozlowski <k.kozlowski.k@gmail.com>
Reported-by: Anand Moon <linux.amoon@gmail.com>
Reviewed-by: Javier Martinez Canillas <javier@osg.samsung.com>
Signed-off-by: Kukjin Kim <kgene@kernel.org>
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The LEDs on Odroid XU3 family boards could not properly probe
because PWM outputs were reduced only to PWM for fan. Fix it
for Odroid XU3 and XU3-Lite boards by switching to usage of
all 4 outputs (although the PWM for MIPI probably is redundant
because board does not have MIPI connector available).
This fixes warnings on dmesg:
[ 4.838712] samsung-pwm 12dd0000.pwm: tried to request PWM channel 1 without output
[ 4.838725] leds_pwm pwmleds: unable to request PWM for green:mmc0: -22
[ 4.838767] leds_pwm: probe of pwmleds failed with error -22
Fixes: b685d540cc26 ("ARM: dts: Add pwm-fan node for exynos5422-odroidxu3")
Signed-off-by: Krzysztof Kozlowski <k.kozlowski.k@gmail.com>
Signed-off-by: Kukjin Kim <kgene@kernel.org>
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The odroid-xu3 board which is based on exynos5422 not exynos5800
is booted from cortex-a7 core unlike exynos5800. The odroid-xu3's
cpu order is quite strange. cpu0 and cpu5-7 are cortex-a7 cores and
cpu1-4 are cortex-a15 cores. To correct this mis-odering, I added
exynos5422-cpus.dtsi and reversing cpu orders from exynos5420.
Now, cpu0-3 are cortex-a7 and cpu4-7 are cortex-a15.
Reviewed-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Chanho Park <parkch98@gmail.com>
Signed-off-by: Kukjin Kim <kgene@kernel.org>
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