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The DT of_device.h and of_platform.h date back to the separate
of_platform_bus_type before it as merged into the regular platform bus.
As part of that merge prepping Arm DT support 13 years ago, they
"temporarily" include each other. They also include platform_device.h
and of.h. As a result, there's a pretty much random mix of those include
files used throughout the tree. In order to detangle these headers and
replace the implicit includes with struct declarations, users need to
explicitly include the correct includes.
Signed-off-by: Rob Herring <robh@kernel.org>
Reviewed-by: Alim Akhtar <alim.akhtar@samsung.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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The thermal->tzp->no_hwmon parameter is only used when calling
thermal_zone_device_register().
Setting it to 'false' before calling thermal_add_hwmon_sysfs() has no
effect.
Remove the call and again prevent the drivers to access the thermal
internals.
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Use the devdata accessor introduced in the previous patch.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> #R-Car
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> #MediaTek auxadc and lvts
Reviewed-by: Balsam CHIHI <bchihi@baylibre.com> #Mediatek lvts
Reviewed-by: Adam Ward <DLG-Adam.Ward.opensource@dm.renesas.com> #da9062
Reviewed-by: Baolin Wang <baolin.wang@linux.alibaba.com> #spread
Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> #sun8i_thermal
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com> #Broadcom
Reviewed-by: Dhruva Gole <d-gole@ti.com> # K3 bandgap
Acked-by: Linus Walleij <linus.walleij@linaro.org>
Acked-by: Heiko Stuebner <heiko@sntech.de> #rockchip
Reviewed-by: Kunihiko Hayashi <hayashi.kunihiko@socionext.com> #uniphier
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
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The thermal OF code has a new API allowing to migrate the OF
initialization to a simpler approach. The ops are no longer device
tree specific and are the generic ones provided by the core code.
Convert the ops to the thermal_zone_device_ops format and use the new
API to register the thermal zone with these generic ops.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Tested-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Florian Fainelli <f.fainelli@gmail.com>
Link: https://lore.kernel.org/r/20220804224349.1926752-11-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The thermal sensor on BCM2711 is capable of negative temperatures, so don't
clamp the measurements at zero. Since this was the only use for variable t,
drop it.
This change based on a patch by Dom Cobley, who also tested the fix.
Fixes: 59b781352dc4 ("thermal: Add BCM2711 thermal driver")
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Acked-by: Florian Fainelli <f.fainelli@gmail.com>
Link: https://lore.kernel.org/r/20220412195423.104511-1-stefan.wahren@i2se.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Simplify the return expression.
Signed-off-by: Zheng Yongjun <zhengyongjun3@huawei.com>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Reviewed-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20201210135432.1249-1-zhengyongjun3@huawei.com
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This adds the thermal sensor driver for the Broadcom BCM2711 SoC,
which is placed on the Raspberry Pi 4. The driver only provides
SoC temperature reading so far.
Signed-off-by: Stefan Wahren <stefan.wahren@i2se.com>
Reviewed-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Tested-by: Nicolas Saenz Julienne <nsaenzjulienne@suse.de>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/1578941778-23321-3-git-send-email-stefan.wahren@i2se.com
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