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Since we do not have interrupts on BCM7216, we cannot have trip point
crossing, the thermal subsystem expects us to provide a NULL set_trips
operation in that case, so make it possible to provide per-process
thermal_zone_of_device_ops
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-7-f.fainelli@gmail.com
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If we are successful grabbing the interrupt resource, then register an
interrupt handler, this makes it easier to support the interrupt as
being optional, which is it for 7216.
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-6-f.fainelli@gmail.com
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Match the 7216 compatible string in order to derive the correct 16nm
process thermal parameters to obtain correct readings.
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-5-f.fainelli@gmail.com
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The driver is currently assuming that it is operating with a 28nm
process chip, which has a specific formula to convert temperature to a
code and vice versa. Update the code to support providing two key
values: offset and multiplier to derive the correct formulas.
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-3-f.fainelli@gmail.com
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At the time the brcmstb_thermal driver and its binding were merged, the
DT binding did not make the coefficients properties a mandatory one,
therefore all users of the brcmstb_thermal driver out there have a non
functional implementation with zero coefficients. Even if these
properties were provided, the formula used for computation is incorrect.
The coefficients are entirely process specific (right now, only 28nm is
supported) and not board or SoC specific, it is therefore appropriate to
hard code them in the driver given the compatibility string we are
probed with which has to be updated whenever a new process is
introduced.
We remove the existing coefficients definition since subsequent patches
are going to add support for a new process and will introduce new
coefficients as well.
Fixes: 9e03cf1b2dd5 ("thermal: add brcmstb AVS TMON driver")
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200114190607.29339-2-f.fainelli@gmail.com
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Based on 1 normalized pattern(s):
this software is licensed under the terms of the gnu general public
license version 2 as published by the free software foundation and
may be copied distributed and modified under those terms this
program is distributed in the hope that it will be useful but
without any warranty without even the implied warranty of
merchantability or fitness for a particular purpose see the gnu
general public license for more details
extracted by the scancode license scanner the SPDX license identifier
GPL-2.0-only
has been chosen to replace the boilerplate/reference in 285 file(s).
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Alexios Zavras <alexios.zavras@intel.com>
Reviewed-by: Allison Randal <allison@lohutok.net>
Cc: linux-spdx@vger.kernel.org
Link: https://lkml.kernel.org/r/20190529141900.642774971@linutronix.de
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal
Pull thermal SoC updates from Eduardo Valentin:
- Tegra DT binding documentation for Tegra194
- Armada now supports ap806 and cp110
- RCAR thermal now supports R8A774C0 and R8A77990
- Fixes on thermal_hwmon, IMX, generic-ADC, ST, RCAR, Broadcom,
Uniphier, QCOM, Tegra, PowerClamp, and Armada thermal drivers.
* 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal: (22 commits)
thermal: generic-adc: Fix adc to temp interpolation
thermal: rcar_thermal: add R8A77990 support
dt-bindings: thermal: rcar-thermal: add R8A77990 support
thermal: rcar_thermal: add R8A774C0 support
dt-bindings: thermal: rcar-thermal: add R8A774C0 support
dt-bindings: cp110: document the thermal interrupt capabilities
dt-bindings: ap806: document the thermal interrupt capabilities
MAINTAINERS: thermal: add entry for Marvell MVEBU thermal driver
thermal: armada: add overheat interrupt support
thermal: st: fix Makefile typo
thermal: uniphier: Convert to SPDX identifier
thermal/intel_powerclamp: Change to use DEFINE_SHOW_ATTRIBUTE macro
thermal: tegra: soctherm: Change to use DEFINE_SHOW_ATTRIBUTE macro
dt-bindings: thermal: tegra-bpmp: Add Tegra194 support
thermal: imx: save one condition block for normal case of nvmem initialization
thermal: imx: fix for dependency on cpu-freq
thermal: tsens: qcom: do not create duplicate regmap debugfs entries
thermal: armada: Use PTR_ERR_OR_ZERO in armada_thermal_probe_legacy()
dt-bindings: thermal: rcar-gen3-thermal: All variants use 3 interrupts
thermal: broadcom: use devm_thermal_zone_of_sensor_register
...
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Using devm_thermal_zone_of_sensor_register allows to simplify some
error handling code, drop a label, and drop the remove function.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The thermal_zone_of_device_ops structure can be const as it is only
passed as the last argument of thermal_zone_of_sensor_register
and the corresponding parameter is declared as const.
Done with the help of Coccinelle.
Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The AVS TMON core provides temperature readings, a pair of configurable
high- and low-temperature threshold interrupts, and an emergency
over-temperature chip reset. The driver utilizes the first two to
provide temperature readings and high-temperature notifications to
applications. The over-temperature reset is not exposed to
applications; this reset threshold is critical to the system and should
be set with care within the bootloader.
Applications may choose to utilize the notification mechanism, the
temperature reading mechanism (e.g., through polling), or both.
Signed-off-by: Brian Norris <computersforpeace@gmail.com>
Signed-off-by: Doug Berger <opendmb@gmail.com>
Signed-off-by: Markus Mayer <mmayer@broadcom.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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