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path: root/drivers/thermal/qcom/Makefile
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2018-12-07drivers: thermal: Move QCOM_SPMI_TEMP_ALARM into the qcom subdirAmit Kucheria
This cleans up the directory a bit allowing just one place to look for thermal related drivers for QCOM platforms instead of being scattered in the root directory and the qcom/ subdirectory. Compile-tested with ARCH=arm64 defconfig and the driver explicitly enabled with menuconfig. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2018-07-27thermal: tsens: Rename tsens-8996 to tsens-v2 for reuseAmit Kucheria
The TSENS block inside the 8996 is internally classified as version 2 of the IP. Several other SoC families use this block and can share this code. We rename get_temp() to reflect that it can be used across the v2 family. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Tested-by: Matthias Kaehlcke <mka@chromium.org> Reviewed-by: Matthias Kaehlcke <mka@chromium.org> Reviewed-by: Douglas Anderson <dianders@chromium.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-09-27thermal: qcom: tsens-8996: Add support for 8996 family of SoCsRajendra Nayak
The TSENS controller in 8996 family of SoCs is capable of converting the ADC code outputs to real temperature values (in decidegree Celsius). It can also be programmed to provide raw ADC code, but the secure software on 8996 programs it to provide real temperatures and also does the needed calibrations. We check the valid bit to ensure valid data is read by the AHB master. And the spec recommends the below algorithm to read data 3 consecutive times, which takes care of the worst case delay taken to propagate the updated data to the register. Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27thermal: qcom: tsens-8960: Add support for 8960 family of SoCsRajendra Nayak
8960 family of SoCs have the TSENS device as part of GCC, hence the driver probes the virtual child device created by GCC and uses the parent to extract all DT properties and reuses the GCC regmap. Also GCC/TSENS are part of a domain thats not always ON. Hence add .suspend and .resume hooks to save and restore some of the inited register context. Also 8960 family have some of the TSENS init sequence thats required to be done by the HLOS driver (some later versions of TSENS do not export these registers to non-secure world, and hence need these initializations to be done by secure bootloaders) 8660 from the same family has just one sensor and hence some register offset/layout differences which need special handling in the driver. Based on the original code from Siddartha Mohanadoss, Stephen Boyd and Narendran Rajan. Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27thermal: qcom: tsens-8974: Add support for 8974 family of SoCsRajendra Nayak
Add .calibrate support for 8974 family as part of tsens_ops. Based on the original code by Siddartha Mohanadoss and Stephen Boyd. Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27thermal: qcom: tsens-8916: Add support for 8916 family of SoCsRajendra Nayak
Add support to calibrate sensors on 8916 family and also add common functions to read temperature from sensors (This can be reused on other SoCs having similar TSENS device) The calibration data is read from eeprom using the generic nvmem framework apis. Based on the original code by Siddartha Mohanadoss and Stephen Boyd. Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2016-09-27thermal: qcom: tsens: Add a skeletal TSENS driversRajendra Nayak
TSENS is Qualcomms' thermal temperature sensor device. It supports reading temperatures from multiple thermal sensors present on various QCOM SoCs. Calibration data is generally read from a non-volatile memory (eeprom) device. Add a skeleton driver with all the necessary abstractions so a variety of qcom device families which support TSENS can add driver extensions. Also add the required device tree bindings which can be used to describe the TSENS device in DT. Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org> Reviewed-by: Lina Iyer <lina.iyer@linaro.org> Signed-off-by: Eduardo Valentin <edubezval@gmail.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>