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path: root/drivers/thermal
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2013-08-29thermal: exynos: Clean up non-DT remnantsSachin Kamat
Commit 1cd1ecb6 ("thermal: exynos: Remove non DT based support") cleaned up some non-DT code. However, there were few more things needed for complete cleanup to make this driver DT only. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-29thermal: exynos: Fix potential NULL pointer dereferenceSachin Kamat
NULL pointer was being dereferenced in its own error message. Changed it to the correct device pointer. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-29thermal: exynos: Fix typos in KconfigSachin Kamat
Fixes some trivial typos. Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-29thermal: ti-soc-thermal: Ensure to compute thermal trendRanganath Krishnan
Workaround to compute thermal trend even when update interval is not set. This patch will ensure to compute the thermal trend when bandgap counter delay is not set. Signed-off-by: Ranganath Krishnan <ranganath@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-29thermal: ti-soc-thermal: Set the bandgap mask counter delay valueRanganath Krishnan
Set the bandgap mask counter_delay with the polling_delay value on registering the thermal zone. This patch will ensure to get the correct update interval for computing the thermal trend. Signed-off-by: Ranganath Krishnan <ranganath@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-29thermal: ti-soc-thermal: Initialize counter_delay field for TI DRA752 sensorsRanganath Krishnan
Initialize MPU, GPU, CORE, DSPEVE and IVA thermal sensors of DRA752 bandgap with the counter delay mask. Signed-off-by: Ranganath Krishnan <ranganath@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-15Merge branch 'fixes' of .git into nextZhang Rui
2013-08-15thermal: step_wise: return instance->target by defaultEduardo Valentin
In case the trend is not changing or when there is no request for throttling, it is expected that the instance would not change its requested target. This patch improves the code implementation to cover for this expected behavior. With current implementation, the instance will always reset to cdev.cur_state, even in not expected cases, like those mentioned above. This patch changes the step_wise governor implementation of get_target so that we accomplish: (a) - default value will be current instance->target, so we do not change the thermal instance target unnecessarily. (b) - the code now it is clear about what is the intention. There is a clear statement of what are the expected outcomes (c) - removal of hardcoded constants, now it is put in use the THERMAL_NO_TARGET macro. (d) - variable names are also improved so that reader can clearly understand the difference between instance cur target, next target and cdev cur_state. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Durgadoss R <durgadoss.r@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Reported-by: Ruslan Ruslichenko <ruslan.ruslichenko@ti.com> Signed-of-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-08-15thermal: step_wise: cdev only needs update on a new target stateShawn Guo
The cooling device only needs update on a new target state. Since we already check old target in thermal_zone_trip_update(), we can do one more check to see if it's a new target state. If not, we can reasonably save some uncecesary code execution. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-08-15Merge branches 'exynos', 'imx' and 'fixes' of .git into nextZhang Rui
2013-08-15Thermal/cpu_cooling: Return directly for the cpu out of allowed_cpus in the ↵Lan Tianyu
cpufreq_thermal_notifier() cpufreq_thermal_notifier() is to change the cpu's cpufreq in the allowed_cpus mask when associated thermal-cpufreq cdev's cooling state is changed. It's a cpufreq policy notifier handler and it will be triggered even if those cpus out of allowed_cpus has changed freq policy. cpufreq_thermal_notifier() checks the policy->cpu. If it belongs to allowed_cpus, change max_freq(default to 0) to the desire cpufreq value and pass 0 and max_freq to cpufreq_verify_within_limits() as cpufreq scope. But if not, do nothing and max_freq will remain 0. This will cause the cpufreq scope to become 0~0. This is not right. This patch is to return directly after finding cpu not belonging to allowed_cpus. Signed-off-by: Lan Tianyu <tianyu.lan@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-08-15thermal: exynos_tmu: fix wrong error check for mapped memoryNaveen Krishna Chatradhi
The error check is checking for a "base" mapped memory base instead of "base_common". Fixing the same. Signed-off-by: Naveen Krishna Chatradhi <ch.naveen@samsung.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-08-15thermal: imx: implement thermal alarm interrupt handlingPhilipp Zabel
Enable automatic measurements at 10 Hz and use the alarm interrupt to react more quickly to sudden temperature changes above the passive or critical temperature trip points. Signed-off-by: Philipp Zabel <p.zabel@pengutronix.de> Acked-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-08-15thermal: imx: dynamic passive and SoC specific critical trip pointsPhilipp Zabel
Set passive and critical trip point values depending on the maximum die temperature stored in the OCOTP fuses. This allows higher trip points for industrial and automotive rated i.MX6 SoCs. Also allow to configure the passive trip point from userspace. Signed-off-by: Philipp Zabel <p.zabel@pengutronix.de> Acked-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-08-13thermal: exynos: Support for TMU regulator defined at device treeAmit Daniel Kachhap
TMU probe function now checks for a device tree defined regulator. For compatibility reasons it is allowed to probe driver even without this regulator defined. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Lukasz Majewski <l.majewski@samsung.com> Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Add hardware mode thermal calibration supportAmit Daniel Kachhap
This patch adds support for h/w mode calibration in the TMU controller. Soc's like 5440 support this features. The h/w bits needed for calibration setting are same as that of enum calibration_type. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Fix to set the second point correction valueAmit Daniel Kachhap
This patch sets the second point trimming value according to the platform data if the register value is 0. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Add thermal configuration data for exynos5440 TMU sensorAmit Daniel Kachhap
This patch adds configuration data for exynos5440 soc. Also register definations for the controller are added. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Add driver support for exynos5440 TMU sensorAmit Daniel Kachhap
This patch modifies TMU controller to add changes needed to work with exynos5440 platform. This sensor registers 3 instance of the tmu controller with the thermal zone and hence reports 3 temperature output. This controller supports upto five trip points. For critical threshold the driver uses the core driver thermal framework for shutdown. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Signed-off-by: Jungseok Lee <jays.lee@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Add support to access common register for multistanceAmit Daniel Kachhap
This patch adds support to parse one more common set of TMU register. First set of register belongs to each instance of TMU and second set belongs to common TMU registers. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: use device resource management infrastructureAmit Daniel Kachhap
This patch uses the device pointer stored in the configuration structure and converts to dev_* prints and devm API's. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Add TMU features to check instead of using SOC typeAmit Daniel Kachhap
This patch adds several features supported by TMU as bitfields. This features varies across different SOC type and comparing the features present in the TMU is more logical than comparing the soc itself. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Add support to handle many instances of TMUAmit Daniel Kachhap
This patch adds support to handle multiple instances of the TMU controllers. This is done by removing the static structure to register with the core thermal and creating it dynamically for each instance of the TMU controller. The interrupt is made shared type to handle shared interrupts. Now since the ISR needs the core thermal framework to be registered so request_irq is moved after the core registration is done. Also the identifier of the TMU controller is extracted from device tree alias. This will be used for TMU specific initialisation. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Remove non DT based supportAmit Daniel Kachhap
Recently non DT support from Exynos platform is removed and hence removing non DT support from the driver also. This will help in easy maintainence. Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Make the zone handling use trip informationAmit Daniel Kachhap
This code simplifies the zone handling to use the trip information passed by the TMU driver and not the hardcoded macros. This also helps in adding more zone support. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Return success even if no cooling data suppliedAmit Daniel Kachhap
This patch removes the error return in the bind/unbind routine as the platform may not register any cpufreq cooling data. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Modify private_data to appropriate name driver_dataAmit Daniel Kachhap
This patch renames member private_data to driver_data of the thermal zone registration structure as this item stores the driver related data and uses it to call the driver related callbacks. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Add support for instance based register/unregisterAmit Daniel Kachhap
This code modifies the thermal driver to have multiple thermal zone support by replacing the global thermal zone variable with device data member of thermal_zone_device. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Fix to clear only the generated interruptsAmit Daniel Kachhap
This patch uses the TMU status register to know the generated interrupts and only clear them in the interrupt handler. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Support thermal trippingAmit Daniel Kachhap
TMU urgently sends active-high signal (thermal trip) to PMU, and thermal tripping by hardware logic. Thermal tripping means that PMU cuts off the whole power of SoC by controlling external voltage regulator. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Jonghwan Choi <jhbird.choi@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Move register definitions from driver to data fileAmit Daniel Kachhap
This patch migrates the TMU register definition/bitfields to data file. This is needed to support SoC's which use the same TMU controller but register validity, offsets or bitfield may slightly vary across SOC's. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Add extra entries in the tmu platform dataAmit Daniel Kachhap
This patch adds entries min_efuse_value, max_efuse_value, default_temp_offset, trigger_type, cal_type, trim_first_point, trim_second_point, max_trigger_level trigger_enable in the TMU platform data structure. Also the driver is modified to use the data passed by these new platform memebers instead of the constant macros. All these changes helps in separating the SOC specific data part from the TMU driver. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Add missing definations and code cleanupAmit Daniel Kachhap
This patch adds some extra register bitfield definations and cleans up the code to prepare for moving register macros and definations inside the TMU data section. In this code cleanup the TMU enable bit is correctly used as bit0 and bit1 is taken care which is reserve bit. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Bifurcate exynos tmu driver and configuration dataAmit Daniel Kachhap
This code splits the exynos tmu driver code into SOC specific data parts. This will simplify adding new SOC specific data to the same TMU controller. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Move exynos_thermal.h from include/* to driver/* folderAmit Daniel Kachhap
This patch renames and moves include/linux/platform_data/exynos_thermal.h to drivers/thermal/samsung/exynos_tmu.h. This file movement is needed as exynos SOC's are not supporting non-DT based platforms and this file now just contains exynos tmu driver related definations. Also struct freq_clip_table is now moved to exynos_thermal_common.c as it fixes the compilation issue occuring because now this new tmu header file is included in tmu driver c file and not in the common thermal header file. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Rename exynos_thermal.c to exynos_tmu.cAmit Daniel Kachhap
This patch renames exynos_thermal.c to exynos_tmu.c. This change is needed as this file now just contains exynos tmu driver related codes and thermal zone or cpufreq cooling registration related changes are not there anymore. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Bifurcate exynos thermal common and tmu controller codeAmit Daniel Kachhap
This code bifurcates exynos thermal implementation into common and sensor specific parts. The common thermal code interacts with core thermal layer and core cpufreq cooling parts and is independent of SOC specific driver. This change is needed to cleanly add support for new TMU sensors. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Remove un-necessary CPU_THERMAL dependencyAmit Daniel Kachhap
This patch removes the dependency on CPU_THERMAL for compiling TMU driver. This is useful for cases when only TMU controller needs to be initialised without cpu cooling action. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Use ARCH_HAS_BANDGAP config to know the supported soc'sAmit Daniel Kachhap
This patch uses the recently added config sybmol ARCH_HAS_BANDGAP to enable the TMU driver. This will allow adding support for new soc easily as now it is the platform responsibility to enable this config symbol for a particular soc. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: exynos: Moving exynos thermal files into samsung directoryAmit Daniel Kachhap
This movement of files is done for easy maintenance and adding more new sensor's support for exynos platform easily . This will also help in bifurcating exynos common, sensor driver and sensor data related parts. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13thermal: add imx thermal driver supportShawn Guo
This is based on the initial imx thermal work done by Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still valid). Since he is no longer interested in the work and I have rewritten a significant amount of the code, I just took the authorship over from him. It adds the imx thermal support using Temperature Monitor (TEMPMON) block found on some Freescale i.MX SoCs. The driver uses syscon regmap interface to access TEMPMON control registers and calibration data, and supports cpufreq as the cooling device. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-07-22Thermal: Fix lockup of cpu_down()Steven Rostedt
Commit f1a18a105 "Thermal: CPU Package temperature thermal" had code that did a get_online_cpus(), run a loop and then do a put_online_cpus(). The problem is that the loop had an error exit that would skip the put_online_cpus() part. In the error exit part of the function, it also did a get_online_cpus(), run a loop and then put_online_cpus(). The only way to get to the error exit part is with get_online_cpus() already performed. If this error condition is hit, the system will be prevented from taking CPUs offline. The process taking the CPU offline will lock up hard. Removing the get_online_cpus() removes the lockup as the hotplug CPU refcount is back to zero. This was bisected with ktest. Signed-off-by: Steven Rostedt <rostedt@goodmis.org> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-07-16Thermal: x86_pkg_temp: Limit number of pkg temp zonesSrinivas Pandruvada
Although it is unlikley that physical package id is set to some arbitary number, it is better to prevent in anycase. Since package temp zones use this in thermal zone type and for allocation, added a limit. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-07-15Thermal: x86_pkg_temp: fix krealloc() misuse in in pkg_temp_thermal_device_add()Wei Yongjun
If krealloc() returns NULL, it doesn't free the original. So any code of the form 'foo = krealloc(foo, ...);' is almost certainly a bug. Signed-off-by: Wei Yongjun <yongjun_wei@trendmicro.com.cn> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-07-15Thermal: x86 package temp thermal crashSrinivas Pandruvada
On systems with no package MSR support this caused crash as there is a bug in the logic to check presence of DTHERM and PTS feature together. Added a change so that when there is no PTS support, module doesn't get loaded. Even if some CPU comes online with the PTS feature disabled, and other CPUs has this support, this patch will still prevent such MSR accesses. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Reported-by: Daniel Walker <dwalker@fifo99.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-07-11Merge branch 'next' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux Pull thermal management updates from Zhang Rui: "There are not too many changes this time, except two new platform thermal drivers, ti-soc-thermal driver and x86_pkg_temp_thermal driver, and a couple of small fixes. Highlights: - move the ti-soc-thermal driver out of the staging tree to the thermal tree. - introduce the x86_pkg_temp_thermal driver. This driver registers CPU digital temperature package level sensor as a thermal zone. - small fixes/cleanups including removing redundant use of platform_set_drvdata() and of_match_ptr for all platform thermal drivers" * 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits) thermal: cpu_cooling: fix stub function thermal: ti-soc-thermal: use standard GPIO DT bindings thermal: MAINTAINERS: Add git tree path for SoC specific updates thermal: fix x86_pkg_temp_thermal.c build and Kconfig Thermal: Documentation for x86 package temperature thermal driver Thermal: CPU Package temperature thermal thermal: consider emul_temperature while computing trend thermal: ti-soc-thermal: add DT example for DRA752 chip thermal: ti-soc-thermal: add dra752 chip to device table thermal: ti-soc-thermal: add thermal data for DRA752 chips thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL thermal: ti-soc-thermal: freeze FSM while computing trend thermal: ti-soc-thermal: remove external heat while extrapolating hotspot thermal: ti-soc-thermal: update DT reference for OMAP5430 x86, mcheck, therm_throt: Process package thresholds thermal: cpu_cooling: fix 'descend' check in get_property() Thermal: spear: Remove redundant use of of_match_ptr Thermal: kirkwood: Remove redundant use of of_match_ptr Thermal: dove: Remove redundant use of of_match_ptr Thermal: armada: Remove redundant use of of_match_ptr ...
2013-07-08thermal: ti-soc-thermal: use standard GPIO DT bindingsEduardo Valentin
This change updates the ti-soc-thermal driver to use standard GPIO DT bindings to read the GPIO number associated to thermal shutdown IRQ, in case the device features it. Previously, the code was using a specific DT bindings. As now OMAP supports the standard way to model GPIOs, there is no point in having a ti specific binding. Cc: Zhang Rui <rui.zhang@intel.com> Cc: Grant Likely <grant.likely@linaro.org> Cc: Rob Herring <rob.herring@calxeda.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Cc: devicetree-discuss@lists.ozlabs.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-19thermal: exynos: Support both EXYNOS4X12 SoCsTomasz Figa
EXYNOS4212 and EXYNOS4412 have the same thermal block, so there is no reason to include support only for EXYNOS4412 in this driver. Cc: linux-pm@vger.kernel.org Cc: Zhang Rui <rui.zhang@intel.com> Cc: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Tomasz Figa <t.figa@samsung.com> Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com> Signed-off-by: Kukjin Kim <kgene.kim@samsung.com>
2013-06-18Merge branch 'cpu-package-thermal' of .git into nextZhang Rui
2013-06-18thermal: fix x86_pkg_temp_thermal.c build and KconfigRandy Dunlap
Fix build error in x86_pkg_temp_thermal.c. It requires that X86_MCE & X86_THERMAL_VECTOR be enabled, so depend on the latter symbol, since it depends on X86_MCE (indirectly). Also, X86_PKG_TEMP_THERMAL is already inside an "if THERMAL" block, so remove that duplicated dependency. ERROR: "platform_thermal_package_rate_control" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined! ERROR: "platform_thermal_package_notify" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined! Signed-off-by: Randy Dunlap <rdunlap@infradead.org> Acked-by: Borislav Petkov <bp@suse.de> Signed-off-by: Zhang Rui <rui.zhang@intel.com>