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2023-08-01powercap: intel_rapl: Fix a sparse warning in TPMI interfaceZhang Rui
Depends on the interface used, the RAPL registers can be either MSR indexes or memory mapped IO addresses. Current RAPL common code uses u64 to save both MSR and memory mapped IO registers. With this, when handling register address with an __iomem annotation, it triggers a sparse warning like below: sparse warnings: (new ones prefixed by >>) >> drivers/powercap/intel_rapl_tpmi.c:141:41: sparse: sparse: incorrect type in initializer (different address spaces) @@ expected unsigned long long [usertype] *tpmi_rapl_regs @@ got void [noderef] __iomem * @@ drivers/powercap/intel_rapl_tpmi.c:141:41: sparse: expected unsigned long long [usertype] *tpmi_rapl_regs drivers/powercap/intel_rapl_tpmi.c:141:41: sparse: got void [noderef] __iomem * Fix the problem by using a union to save the registers instead. Suggested-by: David Laight <David.Laight@ACULAB.COM> Reported-by: kernel test robot <lkp@intel.com> Closes: https://lore.kernel.org/oe-kbuild-all/202307031405.dy3druuy-lkp@intel.com/ Tested-by: Wang Wendy <wendy.wang@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com> [ rjw: Subject and changelog edits ] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-07-24thermal: of: fix double-free on unregistrationAhmad Fatoum
Since commit 3d439b1a2ad3 ("thermal/core: Alloc-copy-free the thermal zone parameters structure"), thermal_zone_device_register() allocates a copy of the tzp argument and frees it when unregistering, so thermal_of_zone_register() now ends up leaking its original tzp and double-freeing the tzp copy. Fix this by locating tzp on stack instead. Fixes: 3d439b1a2ad3 ("thermal/core: Alloc-copy-free the thermal zone parameters structure") Signed-off-by: Ahmad Fatoum <a.fatoum@pengutronix.de> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Cc: 6.4+ <stable@vger.kernel.org> # 6.4+: 8bcbb18c61d6: thermal: core: constify params in thermal_zone_device_register Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-07-24thermal: core: constify params in thermal_zone_device_registerAhmad Fatoum
Since commit 3d439b1a2ad3 ("thermal/core: Alloc-copy-free the thermal zone parameters structure"), thermal_zone_device_register() allocates a copy of the tzp argument and callers need not explicitly manage its lifetime. This means the function no longer cares about the parameter being mutable, so constify it. No functional change. Signed-off-by: Ahmad Fatoum <a.fatoum@pengutronix.de> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-06-26Merge tag 'thermal-6.5-rc1' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm Pull thermal control updates from Rafael Wysocki: "These extend the int340x thermal driver, add thermal DT bindings for some Qcom platforms, add DT bindings and support for Armada AP807 and MSM8909, allow selecting the bang-bang thermal governor as the default one, address issues in several thermal drivers for ARM platforms and clean up code. Specifics: - Add new IOCTLs to the int340x thermal driver to allow user space to retrieve the Passive v2 thermal table (Srinivas Pandruvada) - Add DT bindings for SM6375, MSM8226 and QCM2290 Qcom platforms (Konrad Dybcio) - Add DT bindings and support for QCom MSM8226 (Matti Lehtimäki) - Add DT bindings for QCom ipq9574 (Praveenkumar I) - Convert bcm2835 DT bindings to the yaml schema (Stefan Wahren) - Allow selecting the bang-bang governor as default (Thierry Reding) - Refactor and prepare the code to set the scene for RCar Gen4 (Wolfram Sang) - Clean up and fix the QCom tsens drivers. Add DT bindings and calibration for the MSM8909 platform (Stephan Gerhold) - Revert a patch introducing a wrong usage of devm_of_iomap() on the Mediatek platform (Ricardo Cañuelo) - Fix the clock vs reset ordering in order to conform to the documentation on the sun8i (Christophe JAILLET) - Prevent setting up undocumented registers, enable the only described sensors and add the version 2.1 on the Qoriq sensor (Peng Fan) - Add DT bindings and support for the Armada AP807 (Alex Leibovich) - Update the mlx5 driver with the recent thermal changes (Daniel Lezcano) - Convert to platform remove callback returning void on STM32 (Uwe Kleine-König) - Add an error information printing for devm_thermal_add_hwmon_sysfs() and remove the error from the Sun8i, Amlogic, i.MX, TI, K3, Tegra, Qoriq, Mediateka and QCom (Yangtao Li) - Register as hwmon sensor for the Generic ADC (Chen-Yu Tsai) - Use the dev_err_probe() function in the QCom tsens alarm driver (Luca Weiss)" * tag 'thermal-6.5-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (39 commits) thermal/drivers/qcom/temp-alarm: Use dev_err_probe thermal/drivers/generic-adc: Register thermal zones as hwmon sensors thermal/drivers/mediatek/lvts_thermal: Remove redundant msg in lvts_ctrl_start() thermal/drivers/qcom: Remove redundant msg at probe time thermal/drivers/ti-soc: Remove redundant msg in ti_thermal_expose_sensor() thermal/drivers/qoriq: Remove redundant msg in qoriq_tmu_register_tmu_zone() thermal/drivers/tegra: Remove redundant msg in tegra_tsensor_register_channel() drivers/thermal/k3: Remove redundant msg in k3_bandgap_probe() thermal/drivers/imx: Remove redundant msg in imx8mm_tmu_probe() and imx_sc_thermal_probe() thermal/drivers/amlogic: Remove redundant msg in amlogic_thermal_probe() thermal/drivers/sun8i: Remove redundant msg in sun8i_ths_register() thermal/hwmon: Add error information printing for devm_thermal_add_hwmon_sysfs() thermal/drivers/stm32: Convert to platform remove callback returning void net/mlx5: Update the driver with the recent thermal changes thermal/drivers/armada: Add support for AP807 thermal data dt-bindings: armada-thermal: Add armada-ap807-thermal compatible thermal/drivers/qoriq: Support version 2.1 thermal/drivers/qoriq: Only enable supported sensors thermal/drivers/qoriq: No need to program site adjustment register thermal/drivers/mediatek/lvts_thermal: Register thermal zones as hwmon sensors ...
2023-06-26Merge tag 'pm-6.5-rc1' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm Pull power management updates from Rafael Wysocki: "These add Intel TPMI (Topology Aware Register and PM Capsule Interface) support to the power capping subsystem, extend the intel_idle driver to work in VM guests where MWAIT is not available, extend the system-wide power management diagnostics, fix bugs and clean up code. Specifics: - Introduce power capping core support for Intel TPMI (Topology Aware Register and PM Capsule Interface) and a TPMI interface driver for Intel RAPL (Zhang Rui, Dan Carpenter) - Fix CONFIG_IOSF_MBI dependency in the Intel RAPL power capping driver (Zhang Rui) - Fix invalid initialization for pl4_supported field in the Intel RAPL power capping driver (Sumeet Pawnikar) - Clean up the intel_idle driver, make it work with VM guests that cannot use the MWAIT instruction and address the case in which the host may enter a deep idle state when the guest is idle (Arjan van de Ven) - Prevent cpufreq drivers that provide the ->adjust_perf() callback without a ->fast_switch() one which is used as a fallback from the former in some cases (Wyes Karny) - Fix some issues related to the AMD P-state cpufreq driver (Mario Limonciello, Wyes Karny) - Fix the energy_performance_preference attribute handling in the intel_pstate driver in passive mode (Tero Kristo) - Fix the handling of pm_suspend_target_state when CONFIG_PM is unset (Kai-Heng Feng) - Correct spelling mistake in a comment in the hibernation code (Wang Honghui) - Add arch_resume_nosmt() prototype to avoid a "missing prototypes" build warning (Arnd Bergmann) - Restrict pm_pr_dbg() to system-wide power transitions and use it in a few additional places (Mario Limonciello) - Drop verification of in-params from genpd_add_device() and ensure that all of its callers will do it (Ulf Hansson) - Prevent possible integer overflows from occurring in genpd_parse_state() (Nikita Zhandarovich) - Reorder fieldls in 'struct devfreq_dev_status' to reduce its size somewhat (Christophe JAILLET) - Ensure that the Exynos PPMU driver is already loaded before the Exynos Bus driver starts probing so as to avoid a possible freeze loading of the kernel modules (Marek Szyprowski) - Fix variable deferencing before NULL check in the mtk-cci devfreq driver (Sukrut Bellary)" * tag 'pm-6.5-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (42 commits) intel_idle: Add a "Long HLT" C1 state for the VM guest mode cpufreq: intel_pstate: Fix energy_performance_preference for passive cpufreq: amd-pstate: Add a kernel config option to set default mode cpufreq: amd-pstate: Set a fallback policy based on preferred_profile ACPI: CPPC: Add definition for undefined FADT preferred PM profile value cpufreq: amd-pstate: Set default governor to schedutil PM: domains: Move the verification of in-params from genpd_add_device() cpufreq: amd-pstate: Make amd-pstate EPP driver name hyphenated cpufreq: amd-pstate: Write CPPC enable bit per-socket intel_idle: Add support for using intel_idle in a VM guest using just hlt cpufreq: Fail driver register if it has adjust_perf without fast_switch intel_idle: clean up the (new) state_update_enter_method function intel_idle: refactor state->enter manipulation into its own function platform/x86/amd: pmc: Use pm_pr_dbg() for suspend related messages pinctrl: amd: Use pm_pr_dbg to show debugging messages ACPI: x86: Add pm_debug_messages for LPS0 _DSM state tracking include/linux/suspend.h: Only show pm_pr_dbg messages at suspend/resume powercap: RAPL: Fix a NULL vs IS_ERR() bug powercap: RAPL: Fix CONFIG_IOSF_MBI dependency powercap: RAPL: fix invalid initialization for pl4_supported field ...
2023-06-26Merge tag 'thermal-v6.5-rc1' of ↵Rafael J. Wysocki
ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux into thermal Pull thermal control updates for 6.5-rc1 from Daniel Lezcano: "- Add DT bindings for SM6375, MSM8226 and QCM2290 Qcom platforms (Konrad Dybcio) - Add DT bindings and support for QCom MSM8226 (Matti Lehtimäki) - Add DT bindings for QCom ipq9574 (Praveenkumar I) - Convert bcm2835 DT bindings to the yaml schema (Stefan Wahren) - Allow selecting the bang-bang governor as default (Thierry Reding) - Refactor and prepare the code to set the scene for RCar Gen4 (Wolfram Sang) - Cleanup and fixes for the QCom tsens drivers. Add DT bindings and calibration for the MSM8909 platform (Stephan Gerhold) - Revert a patch introducing a wrong usage of devm_of_iomap() on the Mediatek platform (Ricardo Cañuelo) - Fix the clock vs reset ordering in order to conform to the documentation on the sun8i (Christophe JAILLET) - Prevent setting up undocumented registers, enable the only described sensors and add the version 2.1 on the Qoriq sensor (Peng Fan) - Add DT bindings and support for the Armada AP807 (Alex Leibovich) - Update the mlx5 driver with the recent thermal changes (Daniel Lezcano) - Convert to platform remove callback returning void on STM32 (Uwe Kleine-König) - Add an error information printing for devm_thermal_add_hwmon_sysfs() and remove the error from the Sun8i, Amlogic, i.MX, TI, K3, Tegra, Qoriq, Mediateka and QCom (Yangtao Li) - Register as hwmon sensor for the Generic ADC (Chen-Yu Tsai) - Use the dev_err_probe() function in the QCom tsens alarm driver (Luca Weiss)" * tag 'thermal-v6.5-rc1' of ssh://gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (38 commits) thermal/drivers/qcom/temp-alarm: Use dev_err_probe thermal/drivers/generic-adc: Register thermal zones as hwmon sensors thermal/drivers/mediatek/lvts_thermal: Remove redundant msg in lvts_ctrl_start() thermal/drivers/qcom: Remove redundant msg at probe time thermal/drivers/ti-soc: Remove redundant msg in ti_thermal_expose_sensor() thermal/drivers/qoriq: Remove redundant msg in qoriq_tmu_register_tmu_zone() thermal/drivers/tegra: Remove redundant msg in tegra_tsensor_register_channel() drivers/thermal/k3: Remove redundant msg in k3_bandgap_probe() thermal/drivers/imx: Remove redundant msg in imx8mm_tmu_probe() and imx_sc_thermal_probe() thermal/drivers/amlogic: Remove redundant msg in amlogic_thermal_probe() thermal/drivers/sun8i: Remove redundant msg in sun8i_ths_register() thermal/hwmon: Add error information printing for devm_thermal_add_hwmon_sysfs() thermal/drivers/stm32: Convert to platform remove callback returning void net/mlx5: Update the driver with the recent thermal changes thermal/drivers/armada: Add support for AP807 thermal data dt-bindings: armada-thermal: Add armada-ap807-thermal compatible thermal/drivers/qoriq: Support version 2.1 thermal/drivers/qoriq: Only enable supported sensors thermal/drivers/qoriq: No need to program site adjustment register thermal/drivers/mediatek/lvts_thermal: Register thermal zones as hwmon sensors ...
2023-06-26Merge back earlier Intel thermal control material for 6.5.Rafael J. Wysocki
2023-06-26Merge branch 'powercap'Rafael J. Wysocki
Merge power capping updates for 6.5-rc1: - Introduce power capping core support for Intel TPMI (Topology Aware Register and PM Capsule Interface) and a TPMI interface driver for Intel RAPL (Zhang Rui, Dan Carpenter). - Fix CONFIG_IOSF_MBI dependency in the Intel RAPL power capping driver (Zhang Rui). - Fix invalid initialization for pl4_supported field in the Intel RAPL power capping driver (Sumeet Pawnikar). * powercap: powercap: RAPL: Fix a NULL vs IS_ERR() bug powercap: RAPL: Fix CONFIG_IOSF_MBI dependency powercap: RAPL: fix invalid initialization for pl4_supported field powercap: intel_rapl: Introduce RAPL TPMI interface driver powercap: intel_rapl: Introduce core support for TPMI interface powercap: intel_rapl: Introduce RAPL I/F type powercap: intel_rapl: Make cpu optional for rapl_package powercap: intel_rapl: Remove redundant cpu parameter powercap: intel_rapl: Add support for lock bit per Power Limit powercap: intel_rapl: Cleanup Power Limits support powercap: intel_rapl: Use bitmap for Power Limits powercap: intel_rapl: Change primitive order powercap: intel_rapl: Use index to initialize primitive information powercap: intel_rapl: Support per domain energy/power/time unit powercap: intel_rapl: Support per Interface primitive information powercap: intel_rapl: Support per Interface rapl_defaults powercap: intel_rapl: Allow probing without CPUID match powercap: intel_rapl: Remove unused field in struct rapl_if_priv
2023-06-26thermal/drivers/qcom/temp-alarm: Use dev_err_probeLuca Weiss
Use the dev_err_probe function instead of dev_err in the probe function so that the printed message includes the return value and also handles -EPROBE_DEFER nicely. Signed-off-by: Luca Weiss <luca@z3ntu.xyz> Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230625-spmi-temp-alarm-defer-v1-1-2d57acf36855@z3ntu.xyz
2023-06-26thermal/drivers/generic-adc: Register thermal zones as hwmon sensorsChen-Yu Tsai
Register thermal zones as hwmon sensors to let userspace read temperatures using standard hwmon interface. Signed-off-by: Chen-Yu Tsai <wenst@chromium.org> [Yangtao: only keep devm_thermal_add_hwmon_sysfs] Signed-off-by: Yangtao Li <frank.li@vivo.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-11-frank.li@vivo.com
2023-06-26thermal/drivers/mediatek/lvts_thermal: Remove redundant msg in lvts_ctrl_start()Yangtao Li
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by: Yangtao Li <frank.li@vivo.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-10-frank.li@vivo.com
2023-06-26thermal/drivers/qcom: Remove redundant msg at probe timeYangtao Li
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by: Yangtao Li <frank.li@vivo.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-9-frank.li@vivo.com
2023-06-26thermal/drivers/ti-soc: Remove redundant msg in ti_thermal_expose_sensor()Yangtao Li
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by: Yangtao Li <frank.li@vivo.com> Acked-by: Keerthy <j-keerthy@ti.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-8-frank.li@vivo.com
2023-06-26thermal/drivers/qoriq: Remove redundant msg in qoriq_tmu_register_tmu_zone()Yangtao Li
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by: Yangtao Li <frank.li@vivo.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-7-frank.li@vivo.com
2023-06-26thermal/drivers/tegra: Remove redundant msg in tegra_tsensor_register_channel()Yangtao Li
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by: Yangtao Li <frank.li@vivo.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-6-frank.li@vivo.com
2023-06-26drivers/thermal/k3: Remove redundant msg in k3_bandgap_probe()Yangtao Li
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by: Yangtao Li <frank.li@vivo.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-5-frank.li@vivo.com
2023-06-26thermal/drivers/imx: Remove redundant msg in imx8mm_tmu_probe() and ↵Yangtao Li
imx_sc_thermal_probe() The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by: Yangtao Li <frank.li@vivo.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-4-frank.li@vivo.com
2023-06-26thermal/drivers/amlogic: Remove redundant msg in amlogic_thermal_probe()Yangtao Li
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by: Yangtao Li <frank.li@vivo.com> Reviewed-by: Martin Blumenstingl <martin.blumenstingl@googlemail.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-3-frank.li@vivo.com
2023-06-26thermal/drivers/sun8i: Remove redundant msg in sun8i_ths_register()Yangtao Li
The upper-layer devm_thermal_add_hwmon_sysfs() function can directly print error information. Signed-off-by: Yangtao Li <frank.li@vivo.com> Acked-by: Jernej Skrabec <jernej.skrabec@gmail.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-2-frank.li@vivo.com
2023-06-26thermal/hwmon: Add error information printing for devm_thermal_add_hwmon_sysfs()Yangtao Li
Ensure that all error handling branches print error information. In this way, when this function fails, the upper-layer functions can directly return an error code without missing debugging information. Otherwise, the error message will be printed redundantly or missing. Signed-off-by: Yangtao Li <frank.li@vivo.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230620090732.50025-1-frank.li@vivo.com
2023-06-26thermal/drivers/stm32: Convert to platform remove callback returning voidUwe Kleine-König
The .remove() callback for a platform driver returns an int which makes many driver authors wrongly assume it's possible to do error handling by returning an error code. However the value returned is (mostly) ignored and this typically results in resource leaks. To improve here there is a quest to make the remove callback return void. In the first step of this quest all drivers are converted to .remove_new() which already returns void. st_thermal_unregister() always returned zero, so convert it to return void without any loss and then just drop the return from st_mmap_remove(). Signed-off-by: Uwe Kleine-König <u.kleine-koenig@pengutronix.de> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230616165641.1055854-1-u.kleine-koenig@pengutronix.de
2023-06-26thermal/drivers/armada: Add support for AP807 thermal dataAlex Leibovich
Add support for the AP807 die thermal data. This is the same as AP806, except for the coefficients. ap807 values taken from TSENSE_ADC_16FFC spec, which says: T(in Celsius) = T(code)*TSENE_GAIN+TSENE_OFFSET where in default: TSENE_OFFSET = 128.9 TSENE_GAIN = 0.394 Signed-off-by: Alex Leibovich <alexl@marvell.com> Tested-by: sa_ip-sw-jenkins <sa_ip-sw-jenkins@marvell.com> Reviewed-by: Stefan Chulski <stefanc@marvell.com> Signed-off-by: Russell King (Oracle) <rmk+kernel@armlinux.org.uk> Reviewed-by: Miquel Raynal <miquel.raynal@bootlin.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/E1qA7yU-00Ea4u-Je@rmk-PC.armlinux.org.uk
2023-06-26thermal/drivers/qoriq: Support version 2.1Peng Fan
i.MX93 use TMU version 2.1, which supports: - TRITSR_TP5(When this field is 1, you must add 0.5 K to the temperature that TEMP reports. For example, if TEMP is 300 K and TP5=1, then the final temperature is 300.5 K.) - Has 16 TTRCR register: Temperature Range Control (TTRCR0 - TTRCR15) This patch is to add this support. Signed-off-by: Peng Fan <peng.fan@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230516083746.63436-4-peng.fan@oss.nxp.com
2023-06-26thermal/drivers/qoriq: Only enable supported sensorsPeng Fan
There are MAX 16 sensors, but not all of them supported. Such as i.MX8MQ, there are only 3 sensors. Enabling all 16 sensors will touch reserved bits from i.MX8MQ reference mannual, and TMU will stuck, temperature will not update anymore. Fixes: 45038e03d633 ("thermal: qoriq: Enable all sensors before registering them") Signed-off-by: Peng Fan <peng.fan@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230516083746.63436-3-peng.fan@oss.nxp.com
2023-06-26thermal/drivers/qoriq: No need to program site adjustment registerPankit Garg
No need to program site adjustment register, as programming these registers do not give accurate value and also these registers are not mentioned in Reference Manual. Signed-off-by: Pankit Garg <pankit.garg@nxp.com> Signed-off-by: Peng Fan <peng.fan@nxp.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230516083746.63436-2-peng.fan@oss.nxp.com
2023-06-26thermal/drivers/mediatek/lvts_thermal: Register thermal zones as hwmon sensorsChen-Yu Tsai
Register thermal zones as hwmon sensors to let userspace read temperatures using standard hwmon interface. Signed-off-by: Chen-Yu Tsai <wenst@chromium.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230613091317.1691247-1-wenst@chromium.org
2023-06-26thermal/drivers/sun8i: Fix some error handling paths in sun8i_ths_probe()Christophe JAILLET
Should an error occur after calling sun8i_ths_resource_init() in the probe function, some resources need to be released, as already done in the .remove() function. Switch to the devm_clk_get_enabled() helper and add a new devm_action to turn sun8i_ths_resource_init() into a fully managed function. Move the place where reset_control_deassert() is called so that the recommended order of reset release/clock enable steps is kept. A64 manual states that: 3.3.6.4. Gating and reset Make sure that the reset signal has been released before the release of module clock gating; This fixes the issue and removes some LoC at the same time. Fixes: dccc5c3b6f30 ("thermal/drivers/sun8i: Add thermal driver for H6/H5/H3/A64/A83T/R40") Signed-off-by: Christophe JAILLET <christophe.jaillet@wanadoo.fr> Acked-by: Maxime Ripard <maxime@cerno.tech> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/a8ae84bd2dc4b55fe428f8e20f31438bf8bb6762.1684089931.git.christophe.jaillet@wanadoo.fr
2023-06-26Revert "thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak ↵Ricardo Cañuelo
in mtk_thermal_probe" This reverts commit f05c7b7d9ea9477fcc388476c6f4ade8c66d2d26. That change was causing a regression in the generic-adc-thermal-probed bootrr test as reported in the kernelci-results list [1]. A proper rework will take longer, so revert it for now. [1] https://groups.io/g/kernelci-results/message/42660 Fixes: f05c7b7d9ea9 ("thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe") Signed-off-by: Ricardo Cañuelo <ricardo.canuelo@collabora.com> Suggested-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230525121811.3360268-1-ricardo.canuelo@collabora.com
2023-06-26thermal/drivers/qcom/tsens-v0_1: Add MSM8909 dataStephan Gerhold
The MSM8909 SoC has 5 thermal sensors in a TSENS v0.1 block. Like MDM9607 it uses a non-standard default slope value of 3000 [1] and needs per-sensor "correction factors" to workaround issues with the factory calibration [2]. [1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LA.UM.7.7.c26-09100-8x09.0/arch/arm/boot/dts/qcom/msm8909.dtsi#L476 [2]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/6df022c6d0c2c1b4a5a6c2124dba4d57910c0911 Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-6-5eb632235ba7@kernkonzept.com
2023-06-26thermal/drivers/qcom/tsens-v0_1: Add mdm9607 correction offsetsStephan Gerhold
According to the msm-3.18 vendor kernel from Qualcomm, mdm9607 needs "correction factors" to adjust for additional offsets observed after the factory calibration values in the fuses [1, 2]. The fixed offsets should be applied unless there is a special calibration mode value that indicates that no offsets are needed [3]. Note that the new calibration mode values are called differently in this patch compared to the vendor kernel: - TSENS_TWO_POINT_CALIB_N_WA -> ONE_PT_CALIB2_NO_OFFSET - TSENS_TWO_POINT_CALIB_N_OFFSET_WA -> TWO_PT_CALIB_NO_OFFSET This is because close inspection of the calibration function [3] reveals that TSENS_TWO_POINT_CALIB_N_WA is actually a "one point" calibration because the if statements skip all "point2" related code for it. [1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d9d2db1b82bf3f72f5de0803d55e6849eb5b671e [2]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/commit/d75aef53a760e8ff7bac54049d00c8b2ee1b193e [3]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/drivers/thermal/msm-tsens.c#L2987-3136 Fixes: a2149ab815fc ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607") Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-3-5eb632235ba7@kernkonzept.com
2023-06-26thermal/drivers/qcom/tsens-v0_1: Fix mdm9607 slope valuesStephan Gerhold
According to the msm-3.18 vendor kernel from Qualcomm [1], mdm9607 uses a non-standard slope value of 3000 (instead of 3200) for all sensors. Fill it properly similar to the 8939 code added recently. [1]: https://git.codelinaro.org/clo/la/kernel/msm-3.18/-/blob/LE.UM.4.3.2.r1-04200-9x07/arch/arm/boot/dts/qcom/mdm9607.dtsi#L875 Fixes: a2149ab815fc ("thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607") Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-2-5eb632235ba7@kernkonzept.com
2023-06-26thermal/drivers/qcom/tsens: Drop unused legacy structsStephan Gerhold
The old single-cell parsing code was removed for MSM8939, MDM9607 and MSM8976 but for some reason the structs defining the bit positions etc were kept around (unused). Drop them now. Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Fixes: 51d78b8b1beb ("thermal/drivers/tsens: Drop single-cell code for mdm9607") Fixes: dfadb4599ab0 ("thermal/drivers/tsens: Drop single-cell code for msm8939") Fixes: 3a908971f7cb ("thermal/drivers/tsens: Drop single-cell code for msm8976/msm8956") Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230508-msm8909-tsens-v5-1-5eb632235ba7@kernkonzept.com
2023-06-26thermal: Allow selecting the bang-bang governor as defaultThierry Reding
For many setups the bang-bang governor is exactly what we want. Many ARM SoC-based devices use fans to cool down the entire SoC and that works well only with the bang-bang governor because it uses the hysteresis in order to let the fan run for a while to cool the SoC down below the trip point before switching it off again. The step-wise governor will behave strangely in these situations. It doesn't use the hysteresis, so it can lead to situations where the fan is turned on for only a very brief period and then is switched back off, only to get switched back on again very quickly because the SoC hasn't cooled down very much. Signed-off-by: Thierry Reding <treding@nvidia.com> Link: https://lore.kernel.org/r/20230609124408.3788680-1-thierry.reding@gmail.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-06-26thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226Matti Lehtimäki
The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block. The thermal sensors use non-standard slope values. Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Reviewed-by: Luca Weiss <luca@z3ntu.xyz> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230507201225.89694-4-matti.lehtimaki@gmail.com
2023-06-26drivers/thermal/rcar_gen3_thermal: add reading fuses for Gen4Wolfram Sang
The registers are differently named and at different offsets, but their functionality is the same as for Gen3. Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230511192220.7523-4-wsa+renesas@sang-engineering.com
2023-06-26drivers/thermal/rcar_gen3_thermal: refactor reading fuses into seprarate ↵Wolfram Sang
function Gen4 will be very different, so refactor Gen3 access into separate call first. Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230511192220.7523-3-wsa+renesas@sang-engineering.com
2023-06-26drivers/thermal/rcar_gen3_thermal: introduce 'info' structureWolfram Sang
More items to describe the TSCs are needed soon, so encapsulate the current 'ths_tj_1' item into a struct. Signed-off-by: Wolfram Sang <wsa+renesas@sang-engineering.com> Reviewed-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se> Reviewed-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Tested-by: Yoshihiro Shimoda <yoshihiro.shimoda.uh@renesas.com> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Link: https://lore.kernel.org/r/20230511192220.7523-2-wsa+renesas@sang-engineering.com
2023-06-15thermal/intel/intel_soc_dts_iosf: Fix reporting wrong temperaturesHans de Goede
Since commit 955fb8719efb ("thermal/intel/intel_soc_dts_iosf: Use Intel TCC library") intel_soc_dts_iosf is reporting the wrong temperature. The driver expects tj_max to be in milli-degrees-celcius but after the switch to the TCC library this is now in degrees celcius so instead of e.g. 90000 it is set to 90 causing a temperature 45 degrees below tj_max to be reported as -44910 milli-degrees instead of as 45000 milli-degrees. Fix this by adding back the lost factor of 1000. Fixes: 955fb8719efb ("thermal/intel/intel_soc_dts_iosf: Use Intel TCC library") Reported-by: Bernhard Krug <b.krug@elektronenpumpe.de> Signed-off-by: Hans de Goede <hdegoede@redhat.com> Acked-by: Zhang Rui <rui.zhang@intel.com> Cc: 6.3+ <stable@vger.kernel.org> # 6.3+ Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-06-13thermal: intel: int340x_thermal: New IOCTLs for Passive v2 tableSrinivas Pandruvada
Export Passive version 2 table similar to the way _TRT and _ART tables via IOCTLs. This removes need for binary utility to read ACPI Passive 2 table by providing open source support. This table already has open source implementation in the user space thermald, when the table is part of data vault exported by the int3400 sysfs. This table is supported in some older platforms before Ice Lake generation. Passive 2 tables contain multiple entries. Each entry has following fields: * Source: Named Reference (String). This is the source device for temperature. * Target: Named Reference (String). This is the target device to control. * Priority: Priority of this device compared to others. * SamplingPeriod: Time Period in 1/10 of seconds unit. * PassiveTemp: Passive Temperature in 1/10 of Kelvin. * SourceDomain: Domain for the source (00:Processor, others reserved). * ControlKnob: Type of control knob (00:Power Limit 1, others: reserved) * Limit: The target state to set on reaching passive temperature. This can be a string "max", "min" or a power limit value. * LimitStepSize: Step size during activation. * UnLimitStepSize: Step size during deactivation. * Reserved1: Reserved Three IOCTLs are added similar to IOCTLs for reading TRT: ACPI_THERMAL_GET_PSVT_COUNT: Number of passive 2 entries. ACPI_THERMAL_GET_PSVT_LEN: Total return data size (count x each passive 2 entry size). ACPI_THERMAL_GET_PSVT: Get the data as an array of objects with passive 2 entries. This change is based on original development done by: Todd Brandt <todd.e.brandt@linux.intel.com> Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> [ rjw: Changelog and subject edits ] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-05-24thermal: intel: int340x: Add new line for UUID displaySrinivas Pandruvada
Prior to the commit "763bd29fd3d1 ("thermal: int340x_thermal: Use sysfs_emit_at() instead of scnprintf()", there was a new line after each UUID string. With the newline removed, existing user space like "thermald" fails to compare each supported UUID as it is using getline() to read UUID and apply correct thermal table. To avoid breaking existing user space, add newline after each UUID string. Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Fixes: 763bd29fd3d1 ("thermal: int340x_thermal: Use sysfs_emit_at() instead of scnprintf()") Cc: 6.3+ <stable@vger.kernel.org> # 6.3+ Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-05-24powercap: intel_rapl: Introduce RAPL I/F typeZhang Rui
Different RAPL Interfaces may have different primitive information and rapl_defaults calls. To better distinguish this difference in the RAPL framework code, introduce a new enum to represent different types of RAPL Interfaces. No functional change. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Tested-by: Wang Wendy <wendy.wang@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-05-24powercap: intel_rapl: Make cpu optional for rapl_packageZhang Rui
MSR RAPL Interface always removes a rapl_package when all the CPUs in that rapl_package are offlined. This is because it relies on an online CPU to access the MSR. But for RAPL Interface using MMIO registers, when all the cpus within the rapl_package are offlined, 1. the register can still be accessed 2. monitoring and setting the Power Pimits for the rapl_package is still meaningful because of uncore power. This means that, a valid rapl_package doesn't rely on one or more cpus being onlined. For this sense, make cpu optional for rapl_package. A rapl_package can be registered either using a CPU id to represent the physical package/die, or using the physical package id directly. Note that, the thermal throttling interrupt is not disabled via MSR_IA32_PACKAGE_THERM_INTERRUPT for such rapl_package at the moment. If it is still needed in the future, this can be achieved by selecting an onlined CPU using the physical package id. Note that, processor_thermal_rapl, the current MMIO RAPL Interface driver, can also be converted to register using a package id instead. But this is not done right now because processor_thermal_rapl driver works on single-package systems only, and offlining the only package will not happen. So keep the previous logic. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Tested-by: Wang Wendy <wendy.wang@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-05-24powercap: intel_rapl: Use bitmap for Power LimitsZhang Rui
Currently, a RAPL package is registered with the number of Power Limits supported in each RAPL domain. But this doesn't tell which Power Limits are available. Using the number of Power Limits supported to guess the availability of each Power Limit is fragile. Use bitmap to represent the availability of each Power Limit. Note that PL1 is mandatory thus it does not need to be set explicitly by the RAPL Interface drivers. No functional change intended. Signed-off-by: Zhang Rui <rui.zhang@intel.com> Tested-by: Wang Wendy <wendy.wang@intel.com> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-05-04thermal: intel: powerclamp: Fix NULL pointer access issueSrinivas Pandruvada
If cur_state for the powerclamp cooling device is set to the default minimum state of 0, without setting first to cur_state > 0, this results in NULL pointer access. This NULL pointer access happens in the powercap core idle-inject function idle_inject_set_duration() as there is no NULL check for idle_inject_device pointer. This pointer must be allocated by calling idle_inject_register() or idle_inject_register_full(). In the function powerclamp_set_cur_state(), idle_inject_device pointer is allocated only when the cur_state > 0. But setting 0 without changing to any other state, idle_inject_set_duration() will be called with a NULL idle_inject_device pointer. To address this, just return from powerclamp_set_cur_state() if the current cooling device state is the same as the last one. Since the power-up default cooling device state is 0, changing the state to 0 again here will return without calling idle_inject_set_duration(). Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com> Fixes: 8526eb7fc75a ("thermal: intel: powerclamp: Use powercap idle-inject feature") Bugzilla: https://bugzilla.kernel.org/show_bug.cgi?id=217386 Tested-by: Risto A. Paju <teknohog@iki.fi> Cc: 6.3+ <stable@kernel.org> # 6.3+ Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-05-03Merge tag 'thermal-6.4-rc1-2' of ↵Linus Torvalds
git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm Pull more thermal control updates from Rafael Wysocki: "These are mostly cleanups on top of the previously merged thermal control changes plus some driver fixes and the removal of the Intel Menlow thermal driver. Specifics: - Add compatible DT bindings for imx6sll and imx6ul to fix a dtbs check warning (Stefan Wahren) - Update the example in the DT bindings to reflect changes with the ADC node name for QCom TM and TM5 (Marijn Suijten) - Fix comments for the cpuidle_cooling_register() function to match the function prototype (Chenggang Wang) - Fix inconsistent temperature read and some Mediatek variant board reboot by reverting a change and handling the temperature differently (AngeloGioacchino Del Regno) - Fix a memory leak in the initialization error path for the Mediatek driver (Kang Chen) - Use of_address_to_resource() in the Mediatek driver (Rob Herring) - Fix unit address in the QCom tsens driver DT bindings (Krzysztof Kozlowski) - Clean up the step-wise thermal governor (Zhang Rui) - Introduce thermal_zone_device() for accessing the device field of struct thermal_zone_device and two drivers use it (Daniel Lezcano) - Clean up the ACPI thermal driver a bit (Daniel Lezcano) - Delete the thermal driver for Intel Menlow platforms that is not expected to have any users (Rafael Wysocki)" * tag 'thermal-6.4-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: thermal: intel: menlow: Get rid of this driver ACPI: thermal: Move to dedicated function sysfs extra attr creation ACPI: thermal: Use thermal_zone_device() thermal: intel: pch_thermal: Use thermal driver device to write a trace thermal: core: Encapsulate tz->device field thermal: gov_step_wise: Adjust code logic to match comment thermal: gov_step_wise: Delete obsolete comment dt-bindings: thermal: qcom-tsens: Correct unit address thermal/drivers/mediatek: Use of_address_to_resource() thermal/drivers/mediatek: Change clk_prepare_enable to devm_clk_get_enabled in mtk_thermal_probe thermal/drivers/mediatek: Use devm_of_iomap to avoid resource leak in mtk_thermal_probe thermal/drivers/mediatek: Add temperature constraints to validate read Revert "thermal/drivers/mediatek: Add delay after thermal banks initialization" thermal/drivers/cpuidle_cooling: Delete unmatched comments dt-bindings: thermal: Use generic ADC node name in examples dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible
2023-05-03Merge branch 'thermal-core'Rafael J. Wysocki
Merge additional thermal core and ACPI thermal changes for 6.4-rc1: - Clean up the step-wise thermal governor (Zhang Rui). - Introduce thermal_zone_device() for accessing the device field of struct thermal_zone_device and two drivers use it (Daniel Lezcano). - Clean up the ACPI thermal driver a bit (Daniel Lezcano). - Delete the thermal driver for Intel Menlow platforms that is not expected to have any users (Rafael Wysocki). * thermal-core: thermal: intel: menlow: Get rid of this driver ACPI: thermal: Move to dedicated function sysfs extra attr creation ACPI: thermal: Use thermal_zone_device() thermal: intel: pch_thermal: Use thermal driver device to write a trace thermal: core: Encapsulate tz->device field thermal: gov_step_wise: Adjust code logic to match comment thermal: gov_step_wise: Delete obsolete comment
2023-04-27thermal: intel: menlow: Get rid of this driverRafael J. Wysocki
According to my information, there are no active users of this driver in the field. Moreover, it does some really questionable things and gets in the way of thermal core improvements, so drop it. Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com> Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
2023-04-27thermal: intel: pch_thermal: Use thermal driver device to write a traceDaniel Lezcano
The pch_critical() callback accesses the thermal zone device structure internals, it dereferences the thermal zone struct device and the 'type'. Use the available accessors instead of accessing the structure directly. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-04-27thermal: core: Encapsulate tz->device fieldDaniel Lezcano
There are still some drivers needing to play with the thermal zone device internals. That is not the best but until we can figure out if the information is really needed, let's encapsulate the field used in the thermal zone device structure, so we can move forward relocating the thermal zone device structure definition in the thermal framework private headers. Some drivers are accessing tz->device, that implies they need to have the knowledge of the thermal_zone_device structure but we want to self-encapsulate this structure and reduce the scope of the structure to the thermal core only. By adding this wrapper, these drivers won't need the thermal zone device structure definition and are no longer an obstacle to its relocation to the private thermal core headers. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2023-04-27thermal: gov_step_wise: Adjust code logic to match commentZhang Rui
For the algorithm of choosing the next target state in step_wise governor, the code does the right thing but is implemented in a way different from what the comment describes. And this hurts the code readability. As the logic in the comment is simpler, adjust the code logic to align with the comment. No functional change. Signed-off-by: Zhang Rui <rui.zhang@intel.com> [ rjw: Subject edit ] Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
generated by cgit (git 2.34.1) at 2024-07-12 10:46:36 +0000