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2021-04-02Merge branch 'icc-sm8350' into icc-nextGeorgi Djakov
This adds interconnect support for SM8350 SoC. * icc-sm8350 dt-bindings: interconnect: Add Qualcomm SM8350 DT bindings interconnect: qcom: Add SM8350 interconnect provider driver interconnect: qcom: sm8350: Use the correct ids interconnect: qcom: sm8350: Add missing link between nodes Link: https://lore.kernel.org/r/20210318094617.951212-1-vkoul@kernel.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-03-27dt-bindings: interconnect: Add Qualcomm SM8350 DT bindingsVinod Koul
The Qualcomm SM8350 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Vinod Koul <vkoul@kernel.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20210318094617.951212-2-vkoul@kernel.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-03-08dt-bindings: interconnect: Add bindings for Qualcomm SDM660 NoCAngeloGioacchino Del Regno
Add the bindings for the Qualcomm SDM660-class NoC, valid for SDM630, SDM636, SDM660 and SDA variants. Signed-off-by: AngeloGioacchino Del Regno <kholk11@gmail.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20201017133718.31327-2-kholk11@gmail.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-02-01Merge branch 'icc-sdx55' into icc-nextGeorgi Djakov
Add interconnect driver support for SDX55 platform for scaling the bandwidth requirements over RPMh. * icc-sdx55 dt-bindings: interconnect: Add Qualcomm SDX55 DT bindings interconnect: qcom: Add SDX55 interconnect provider driver Link: https://lore.kernel.org/r/20210121053254.8355-1-manivannan.sadhasivam@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-01-27dt-bindings: interconnect: Add Qualcomm SDX55 DT bindingsManivannan Sadhasivam
The Qualcomm SDX55 platform has several bus fabrics that could be controlled and tuned dynamically over RPMh according to the bandwidth demand. Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org> Link: https://lore.kernel.org/r/20210121053254.8355-2-manivannan.sadhasivam@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-01-05dt-bindings: interconnect: Add Qualcomm MSM8939 DT bindingsJun Nie
The Qualcomm MSM8939 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Jun Nie <jun.nie@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20201204075345.5161-5-jun.nie@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-11-30dt-bindings: interconnect: sdm845: Add IDs for the QUP portsGeorgi Djakov
The QUP ports exist in the topology, but are not exposed as an endpoints in DT. Fix this by creating IDs and attach them to their NoCs, so that the various QUP drivers (i2c/spi/uart etc.) are able to request their interconnect paths and scale their bandwidth. Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> Link: https://lore.kernel.org/r/20201105135211.7160-1-georgi.djakov@linaro.org Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
2020-09-08dt-bindings: interconnect: Add EPSS L3 DT binding on SM8250Sibi Sankar
Add Epoch Subsystem (EPSS) L3 interconnect provider binding on SM8250 SoCs. Signed-off-by: Sibi Sankar <sibis@codeaurora.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20200801123049.32398-5-sibis@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08dt-bindings: interconnect: Add generic qcom bindingsMike Tipton
Add generic qcom interconnect bindings that are common across platforms. In particular, these include QCOM_ICC_TAG_* macros that clients can use when calling icc_set_tag(). Signed-off-by: Mike Tipton <mdtipton@codeaurora.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20200903192149.30385-3-mdtipton@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08dt-bindings: interconnect: Add Qualcomm SM8250 DT bindingsJonathan Marek
The Qualcomm SM8250 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Jonathan Marek <jonathan@marek.ca> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Sibi Sankar <sibis@codeaurora.org> Link: https://lore.kernel.org/r/20200728023811.5607-4-jonathan@marek.ca Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08dt-bindings: interconnect: Add Qualcomm SM8150 DT bindingsJonathan Marek
The Qualcomm SM8150 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Jonathan Marek <jonathan@marek.ca> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Sibi Sankar <sibis@codeaurora.org> Link: https://lore.kernel.org/r/20200728023811.5607-3-jonathan@marek.ca Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-04-28interconnect: imx: Add platform driver for imx8mnLeonard Crestez
Add a platform driver for the i.MX8MN SoC describing bus topology, based on internal documentation. Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com> Link: https://lore.kernel.org/r/338a5409ce88811ba6c940ba06441db3faa8c187.1586174566.git.leonard.crestez@nxp.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-04-28interconnect: imx: Add platform driver for imx8mqLeonard Crestez
Add a platform driver for the i.MX8MQ SoC describing bus topology, based on internal documentation. Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com> Tested-by: Martin Kepplinger <martin.kepplinger@puri.sm> Link: https://lore.kernel.org/r/864310d1f2599c3bd621e70b77028a6e89f6410e.1586174566.git.leonard.crestez@nxp.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-04-28interconnect: imx: Add platform driver for imx8mmLeonard Crestez
Add a platform driver for the i.MX8MM SoC describing bus topology. Bandwidth adjustments is currently only supported on the DDRC and main NOC. Scaling for the vpu/gpu/display NICs could be added in the future. Signed-off-by: Alexandre Bailon <abailon@baylibre.com> Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com> Link: https://lore.kernel.org/r/b14eef179dbd837a486619724b8033490f49db72.1586174566.git.leonard.crestez@nxp.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-03-03dt-bindings: interconnect: Add OSM L3 DT bindingsSibi Sankar
Add bindings for Operating State Manager (OSM) L3 interconnect provider on SDM845 SoCs. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Sibi Sankar <sibis@codeaurora.org> Link: https://lore.kernel.org/r/20200227105632.15041-3-sibis@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-03-03dt-bindings: interconnect: Add Qualcomm SC7180 DT bindingsOdelu Kukatla
The Qualcomm SC7180 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/1583241493-21212-2-git-send-email-okukatla@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-02-28interconnect: qcom: sdm845: Split qnodes into their respective NoCsDavid Dai
In order to better represent the hardware and its different Network-On-Chip devices, split the sdm845 provider driver into NoC specific providers. Remove duplicate functionality already provided by the icc rpmh and bcm voter drivers to calculate and commit bandwidth requests to hardware. Signed-off-by: David Dai <daidavid1@codeaurora.org> Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org> Signed-off-by: Sibi Sankar <sibis@codeaurora.org> Reviewed-by: Evan Green <evgreen@chromium.org> Link: https://lore.kernel.org/r/20200209183411.17195-6-sibis@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-01-07dt-bindings: interconnect: Add Qualcomm MSM8916 DT bindingsGeorgi Djakov
The Qualcomm MSM8916 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2019-11-08dt-bindings: interconnect: qcom: add msm8974 bindingsBrian Masney
Add device tree bindings for the Qualcomm MSM8974 interconnect providers that support setting system bandwidth requirements between various network-on-chip fabrics. Signed-off-by: Brian Masney <masneyb@onstation.org> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20191024103054.9770-2-masneyb@onstation.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> Link: https://lore.kernel.org/r/20191108125349.24191-2-georgi.djakov@linaro.org Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2019-08-13dt-bindings: interconnect: Add Qualcomm QCS404 DT bindingsGeorgi Djakov
The Qualcomm QCS404 platform has several buses that could be controlled and tuned according to the bandwidth demand. Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2019-01-22interconnect: qcom: Add sdm845 interconnect provider driverDavid Dai
Introduce Qualcomm SDM845 specific provider driver using the interconnect framework. Signed-off-by: David Dai <daidavid1@codeaurora.org> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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