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2023-12-16Merge branch 'icc-sm6115' of ↵Bjorn Andersson
https://git.kernel.org/pub/scm/linux/kernel/git/djakov/icc into HEAD Merge the SM6115 interconnect binding to allow referecing the interconnect header files and the ports defined in these.
2023-12-07Merge branch 'icc-x1e80100' of ↵Bjorn Andersson
https://git.kernel.org/pub/scm/linux/kernel/git/djakov/icc into arm64-for-6.8 Merge the X1E80100 interconnect binding to get access to the interconnect port constants.
2023-12-06dt-bindings: interconnect: Add Qualcomm SM6115 NoCKonrad Dybcio
Add bindings for Qualcomm SM6115 Network-On-Chip interconnect. Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20231125-topic-6115icc-v3-1-bd8907b8cfd7@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-11-24dt-bindings: interconnect: Add Qualcomm X1E80100 SoCRajendra Nayak
The Qualcomm X1E80100 SoC has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Co-developed-by: Abel Vesa <abel.vesa@linaro.org> Signed-off-by: Abel Vesa <abel.vesa@linaro.org> Signed-off-by: Rajendra Nayak <quic_rjendra@quicinc.com> Co-developed-by: Sibi Sankar <quic_sibis@quicinc.com> Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20231123135028.29433-2-quic_sibis@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-11-24dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in ↵Neil Armstrong
Qualcomm SM8650 SoC Document the RPMh Network-On-Chip Interconnect of the SM8650 platform. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org> Link: https://lore.kernel.org/r/20231123-topic-sm8650-upstream-interconnect-v2-1-7e050874f59b@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-10-10dt-bindings: interconnect: Add compatibles for SDX75Rohit Agarwal
Add dt-bindings compatibles and interconnect IDs for Qualcomm SDX75 platform. Signed-off-by: Rohit Agarwal <quic_rohiagar@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/1694614256-24109-2-git-send-email-quic_rohiagar@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-07-18Merge branch 'icc-sm8250-qup' into icc-nextGeorgi Djakov
SM8250 (like SM8150 but unlike all other QUP-equipped SoCs) doesn't provide a qup-core path. Adjust the bindings and drivers as necessary, and then describe the icc paths in the device tree. This makes it possible for interconnect sync_state succeed so long as you don't use UFS. * icc-sm8250-qup dt-bindings: interconnect: qcom,rpmh: Add SM8250 QUP virt dt-bindings: interconnect: qcom,sm8250: Add QUP virt interconnect: qcom: sm8250: Fix QUP0 nodes Link: https://lore.kernel.org/r/20230703-topic-8250_qup_icc-v2-0-9ba0a9460be2@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-07-16dt-bindings: interconnect: qcom,sm8250: Add QUP virtKonrad Dybcio
Add the required defines for QUP_virt nodes. Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20230703-topic-8250_qup_icc-v2-2-9ba0a9460be2@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-07-15dt-bindings: interconnect: Add Qcom RPM ICC bindingsKonrad Dybcio
The SMD RPM interconnect driver requires different icc tags to the RPMh driver. Add bindings to reflect that. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org> Acked-by: Georgi Djakov <djakov@kernel.org> Link: https://lore.kernel.org/r/20230526-topic-smd_icc-v7-1-09c78c175546@linaro.org Signed-off-by: Bjorn Andersson <andersson@kernel.org>
2023-05-18dt-bindings: interconnect/msm8996-cbf: add defines to be used by CBFDmitry Baryshkov
On msm8996 CBF interconnects power and performance CPU clusters. Add corresponding interconnect defines to be used in device trees. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Tested-by: Yassine Oudjana <y.oudjana@protonmail.com> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20230512001334.2983048-2-dmitry.baryshkov@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-02-06Merge branch 'icc-sa8775p' into icc-nextGeorgi Djakov
* icc-sa8775p dt-bindings: interconnect: qcom: document the interconnects for sa8775p interconnect: qcom: add a driver for sa8775p dt-bindings: interconnect: qcom,sa8775p-rpmh: fix a typo Link: https://lore.kernel.org/r/20230118140825.242544-2-brgl@bgdev.pl Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-02-06Merge branch 'icc-sdm670' into icc-nextGeorgi Djakov
* icc-sdm670 dt-bindings: interconnect: add sdm670 interconnects interconnect: qcom: add sdm670 interconnects Link: https://lore.kernel.org/r/20230111005155.50452-1-mailingradian@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-02-06Merge branch 'icc-ip0-migration' into icc-nextGeorgi Djakov
Commits 2f3724930eb4 ("interconnect: qcom: sc7180: Drop IP0 interconnects") and 2fb251c26560 ("interconnect: qcom: sdx55: Drop IP0 interconnects") removed IP0 interconnects (and ipa-virt devices support) in favour of the RPMH clocks. Follow this example for other platforms defining IP0 RPMH resource. While we are at it, remove several leftover from the mentioned patches. * icc-ip0-migration: interconnect: qcom: sdx55: drop IP0 remnants interconnect: qcom: sc7180: drop IP0 remnants interconnect: move ignore_list out of of_count_icc_providers() interconnect: qcom: sm8150: Drop IP0 interconnects interconnect: qcom: sm8250: Drop IP0 interconnects interconnect: qcom: sc8180x: Drop IP0 interconnects interconnect: qcom: sc8280xp: Drop IP0 interconnects dt-bindings: interconnect: qcom: Remove ipa-virt compatibles dt-bindings: interconnect: qcom: drop IPA_CORE related defines Link: https://lore.kernel.org/r/20230109002935.244320-1-dmitry.baryshkov@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-01-19dt-bindings: interconnect: qcom: document the interconnects for sa8775pBartosz Golaszewski
Add a DT binding document for the RPMh interconnects on Qualcomm sa8775p platforms. Signed-off-by: Bartosz Golaszewski <bartosz.golaszewski@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20230118140825.242544-2-brgl@bgdev.pl Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-01-19dt-bindings: interconnect: add sdm670 interconnectsRichard Acayan
There are controllable interconnects on Snapdragon 670. Add the compatible strings to the documentation and interconnect ID definitions. The device tree header was generated by linux-interconnect-driver-generator and the copyright year was changed. Signed-off-by: Richard Acayan <mailingradian@gmail.com> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20230111005155.50452-2-mailingradian@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-01-18dt-bindings: interconnect: qcom: drop IPA_CORE related definesDmitry Baryshkov
These interconnects are modeled as clks, not interconnects, therefore remove corresponding defines from the binding as they're unused. Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20230109002935.244320-10-dmitry.baryshkov@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-01-05Merge branch 'icc-qdu1000' into icc-nextGeorgi Djakov
Add dt bindings and driver support for the Qualcomm QDU1000 and QRU1000 SoCs. The Qualcomm Technologies, Inc. Distributed Unit 1000 and Radio Unit 1000 are new SoCs meant for enabling Open RAN solutions. See more at https://www.qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/qualcomm_5g_ran_platforms_product_brief.pdf Link: https://lore.kernel.org/r/20221216230914.21771-1-quic_molvera@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-01-05dt-bindings: interconnect: Add QDU1000/QRU1000 devicesMelody Olvera
Add separate schema for QDU1000 and QRU1000 interconnect devices to document the different NoCs on these platforms. Signed-off-by: Melody Olvera <quic_molvera@quicinc.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20221216230914.21771-2-quic_molvera@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-12-29dt-bindings: interconnect: Add Qualcomm SM8550Abel Vesa
The Qualcomm SM8550 SoC has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Abel Vesa <abel.vesa@linaro.org> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20221202232054.2666830-2-abel.vesa@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-07-15Merge branch 'icc-imx8mp' into icc-nextGeorgi Djakov
This patchset is to support i.MX8MP NoC settings, i.MX8MP NoC initial value after power up is invalid, need set a valid value after related power domain up. This patchset also includes two patch[1,2] during my development to enable the ICC feature for i.MX8MP. I not include ddrc DVFS in this patchset, ths patchset is only to support NoC value mode/priority/ext_control being set to a valid value that suggested by i.MX Chip Design Team. The value is same as NXP downstream one inside Arm Trusted Firmware: https://source.codeaurora.org/external/imx/imx-atf/tree/plat/imx/imx8m/i/gpc.c?h=lf_v2.4#n97 Link: https://lore.kernel.org/r/20220703091132.1412063-1-peng.fan@oss.nxp.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-07-04dt-bindings: interconnect: add fsl,imx8mp.hPeng Fan
Add fsl,imx8mp.h for i.MX8MP Signed-off-by: Peng Fan <peng.fan@nxp.com> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20220703091132.1412063-3-peng.fan@oss.nxp.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-06-20dt-bindings: interconnect: Add Qualcomm SM6350 NoC supportLuca Weiss
Add bindings for Qualcomm SM6350 Network-On-Chip interconnect devices. As SM6350 has two pairs of NoCs sharing the same reg, allow this in the binding documentation, as was done for qcm2290. Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20220525144404.200390-4-luca.weiss@fairphone.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-05-18Merge branch 'icc-sc8180x' into icc-nextGeorgi Djakov
This contains a few fixes for the sc8180x interconnect provider driver to make it functional. * icc-sc8180x dt-bindings: interconnect: Add SC8180X QUP0 virt provider interconnect: qcom: sc8180x: Modernize sc8180x probe interconnect: qcom: sc8180x: Fix QUP0 nodes interconnect: qcom: sc8180x: Mark some BCMs keepalive Link: https://lore.kernel.org/r/20220503211925.1022169-1-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-05-18interconnect: qcom: sc8180x: Fix QUP0 nodesBjorn Andersson
The QUP0 BCM relates to some internal property of the QUPs, and should be configured independently of the path to the QUP. In line with other platforms expose QUP_CORE endpoints in order allow this configuration. Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220503211925.1022169-4-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-05-18Merge branch 'icc-sdx65' into icc-nextGeorgi Djakov
This adds interconnect driver support for SDX65 platform for scaling the bandwidth requirements over RPMh. Link: https://lore.kernel.org/r/1649854415-11174-1-git-send-email-quic_rohiagar@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-04-26dt-bindings: interconnect: Add Qualcomm SDX65 DT bindingsRohit Agarwal
Add interconnect IDs for Qualcomm SDX65 platform. Signed-off-by: Rohit Agarwal <quic_rohiagar@quicinc.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/1649854415-11174-2-git-send-email-quic_rohiagar@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-04-22dt-bindings: interconnect: qcom: Add sc8280xp bindingBjorn Andersson
The Qualcomm SC8280XP platform has the usual set of busses, add a binding for these interconnect providers and port definitions to allow interconnect paths to be expressed in the sc8280xp DeviceTree. Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@canonical.com> Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Link: https://lore.kernel.org/r/20220408214835.624494-1-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-15Merge branch 'icc-qcm2290' into icc-nextGeorgi Djakov
Add support for QCM2290 including a few prep changes. * icc-qcm2290 interconnect: icc-rpm: Define ICC device type interconnect: icc-rpm: Add QNOC type QoS support interconnect: icc-rpm: Support child NoC device probe dt-bindings: interconnect: Add Qualcomm QCM2290 NoC support interconnect: qcom: Add QCM2290 driver support Link: https://lore.kernel.org/r/20211215002324.1727-1-shawn.guo@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-15dt-bindings: interconnect: Add Qualcomm QCM2290 NoC supportShawn Guo
Add bindings for Qualcomm QCM2290 Network-On-Chip interconnect devices. Signed-off-by: Shawn Guo <shawn.guo@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20211215002324.1727-5-shawn.guo@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-14Merge branch 'icc-sm8450' into icc-nextGeorgi Djakov
This add device tree binding and driver for interconnect providers found in SM8450 SoC. * icc-sm8450 dt-bindings: interconnect: Add Qualcomm SM8450 DT bindings interconnect: qcom: Add SM8450 interconnect provider driver Link: https://lore.kernel.org/r/20211209084842.189627-1-vkoul@kernel.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-12-14dt-bindings: interconnect: Add Qualcomm SM8450 DT bindingsVinod Koul
The Qualcomm SM8450 SoC has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand Signed-off-by: Vinod Koul <vkoul@kernel.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20211209084842.189627-2-vkoul@kernel.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-11-22dt-bindings: interconnect: Add Qualcomm MSM8996 DT bindingsYassine Oudjana
Add bindings for interconnects on Qualcomm MSM8996. Signed-off-by: Yassine Oudjana <y.oudjana@protonmail.com> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Tested-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> #db820c Link: https://lore.kernel.org/r/20211021132329.234942-4-y.oudjana@protonmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-08-09dt-bindings: interconnect: Add Qualcomm SC8180x DT bindingsGeorgi Djakov
Add compatibles and port definitions for the SC8180x RPMH interconnect providers. Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> [bjorn: Split defines from driver patch and added binding update] Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20210723194243.3675795-1-bjorn.andersson@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-05-11dt-bindings: interconnect: Add Qualcomm SC7280 DT bindingsOdelu Kukatla
The Qualcomm SC7280 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/1619517059-12109-2-git-send-email-okukatla@codeaurora.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2021-04-02Merge branch 'icc-sm8350' into icc-nextGeorgi Djakov
This adds interconnect support for SM8350 SoC. * icc-sm8350 dt-bindings: interconnect: Add Qualcomm SM8350 DT bindings interconnect: qcom: Add SM8350 interconnect provider driver interconnect: qcom: sm8350: Use the correct ids interconnect: qcom: sm8350: Add missing link between nodes Link: https://lore.kernel.org/r/20210318094617.951212-1-vkoul@kernel.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-03-27dt-bindings: interconnect: Add Qualcomm SM8350 DT bindingsVinod Koul
The Qualcomm SM8350 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Vinod Koul <vkoul@kernel.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20210318094617.951212-2-vkoul@kernel.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-03-08dt-bindings: interconnect: Add bindings for Qualcomm SDM660 NoCAngeloGioacchino Del Regno
Add the bindings for the Qualcomm SDM660-class NoC, valid for SDM630, SDM636, SDM660 and SDA variants. Signed-off-by: AngeloGioacchino Del Regno <kholk11@gmail.com> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20201017133718.31327-2-kholk11@gmail.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-02-01Merge branch 'icc-sdx55' into icc-nextGeorgi Djakov
Add interconnect driver support for SDX55 platform for scaling the bandwidth requirements over RPMh. * icc-sdx55 dt-bindings: interconnect: Add Qualcomm SDX55 DT bindings interconnect: qcom: Add SDX55 interconnect provider driver Link: https://lore.kernel.org/r/20210121053254.8355-1-manivannan.sadhasivam@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-01-27dt-bindings: interconnect: Add Qualcomm SDX55 DT bindingsManivannan Sadhasivam
The Qualcomm SDX55 platform has several bus fabrics that could be controlled and tuned dynamically over RPMh according to the bandwidth demand. Signed-off-by: Manivannan Sadhasivam <manivannan.sadhasivam@linaro.org> Link: https://lore.kernel.org/r/20210121053254.8355-2-manivannan.sadhasivam@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2021-01-05dt-bindings: interconnect: Add Qualcomm MSM8939 DT bindingsJun Nie
The Qualcomm MSM8939 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Jun Nie <jun.nie@linaro.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20201204075345.5161-5-jun.nie@linaro.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-11-30dt-bindings: interconnect: sdm845: Add IDs for the QUP portsGeorgi Djakov
The QUP ports exist in the topology, but are not exposed as an endpoints in DT. Fix this by creating IDs and attach them to their NoCs, so that the various QUP drivers (i2c/spi/uart etc.) are able to request their interconnect paths and scale their bandwidth. Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org> Acked-by: Rob Herring <robh@kernel.org> Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org> Link: https://lore.kernel.org/r/20201105135211.7160-1-georgi.djakov@linaro.org Signed-off-by: Bjorn Andersson <bjorn.andersson@linaro.org>
2020-09-08dt-bindings: interconnect: Add EPSS L3 DT binding on SM8250Sibi Sankar
Add Epoch Subsystem (EPSS) L3 interconnect provider binding on SM8250 SoCs. Signed-off-by: Sibi Sankar <sibis@codeaurora.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20200801123049.32398-5-sibis@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08dt-bindings: interconnect: Add generic qcom bindingsMike Tipton
Add generic qcom interconnect bindings that are common across platforms. In particular, these include QCOM_ICC_TAG_* macros that clients can use when calling icc_set_tag(). Signed-off-by: Mike Tipton <mdtipton@codeaurora.org> Acked-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/20200903192149.30385-3-mdtipton@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08dt-bindings: interconnect: Add Qualcomm SM8250 DT bindingsJonathan Marek
The Qualcomm SM8250 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Jonathan Marek <jonathan@marek.ca> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Sibi Sankar <sibis@codeaurora.org> Link: https://lore.kernel.org/r/20200728023811.5607-4-jonathan@marek.ca Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-09-08dt-bindings: interconnect: Add Qualcomm SM8150 DT bindingsJonathan Marek
The Qualcomm SM8150 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Jonathan Marek <jonathan@marek.ca> Reviewed-by: Rob Herring <robh@kernel.org> Reviewed-by: Sibi Sankar <sibis@codeaurora.org> Link: https://lore.kernel.org/r/20200728023811.5607-3-jonathan@marek.ca Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-04-28interconnect: imx: Add platform driver for imx8mnLeonard Crestez
Add a platform driver for the i.MX8MN SoC describing bus topology, based on internal documentation. Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com> Link: https://lore.kernel.org/r/338a5409ce88811ba6c940ba06441db3faa8c187.1586174566.git.leonard.crestez@nxp.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-04-28interconnect: imx: Add platform driver for imx8mqLeonard Crestez
Add a platform driver for the i.MX8MQ SoC describing bus topology, based on internal documentation. Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com> Tested-by: Martin Kepplinger <martin.kepplinger@puri.sm> Link: https://lore.kernel.org/r/864310d1f2599c3bd621e70b77028a6e89f6410e.1586174566.git.leonard.crestez@nxp.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-04-28interconnect: imx: Add platform driver for imx8mmLeonard Crestez
Add a platform driver for the i.MX8MM SoC describing bus topology. Bandwidth adjustments is currently only supported on the DDRC and main NOC. Scaling for the vpu/gpu/display NICs could be added in the future. Signed-off-by: Alexandre Bailon <abailon@baylibre.com> Signed-off-by: Leonard Crestez <leonard.crestez@nxp.com> Link: https://lore.kernel.org/r/b14eef179dbd837a486619724b8033490f49db72.1586174566.git.leonard.crestez@nxp.com Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-03-03dt-bindings: interconnect: Add OSM L3 DT bindingsSibi Sankar
Add bindings for Operating State Manager (OSM) L3 interconnect provider on SDM845 SoCs. Reviewed-by: Rob Herring <robh@kernel.org> Signed-off-by: Sibi Sankar <sibis@codeaurora.org> Link: https://lore.kernel.org/r/20200227105632.15041-3-sibis@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
2020-03-03dt-bindings: interconnect: Add Qualcomm SC7180 DT bindingsOdelu Kukatla
The Qualcomm SC7180 platform has several bus fabrics that could be controlled and tuned dynamically according to the bandwidth demand. Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org> Reviewed-by: Rob Herring <robh@kernel.org> Link: https://lore.kernel.org/r/1583241493-21212-2-git-send-email-okukatla@codeaurora.org Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
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