| Age | Commit message (Collapse) | Author |
|---|
|
The functions thermal_of_zone_register() and
thermal_of_zone_unregister() are no longer needed from the drivers as
the devm_ variant is always used.
Make them static in the C file and remove their declaration from thermal.h
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230404075138.2914680-2-daniel.lezcano@linaro.org
|
|
Remove struct thermal_bind_params because no one is using it for thermal
binding now.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230330104526.3196-1-rui.zhang@intel.com
|
|
|
|
Introduce a core thermal API function, thermal_cooling_device_update(),
for updating the max_state value for a cooling device and rearranging
its statistics in sysfs after a possible change of its ->get_max_state()
callback return value.
That callback is now invoked only once, during cooling device
registration, to populate the max_state field in the cooling device
object, so if its return value changes, it needs to be invoked again
and the new return value needs to be stored as max_state. Moreover,
the statistics presented in sysfs need to be rearranged in general,
because there may not be enough room in them to store data for all
of the possible states (in the case when max_state grows).
The new function takes care of that (and some other minor things
related to it), but some extra locking and lockdep annotations are
added in several places too to protect against crashes in the cases
when the statistics are not present or when a stale max_state value
might be used by sysfs attributes.
Note that the actual user of the new function will be added separately.
Link: https://lore.kernel.org/linux-pm/53ec1f06f61c984100868926f282647e57ecfb2d.camel@intel.com/
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Tested-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
|
|
In order to get the thermal zone id but without directly accessing the
thermal zone device structure, add an accessor.
Use the accessor in the hwmon_scmi and acpi_thermal.
No functional change intented.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
The thermal zone device structure is exposed via the exported
thermal.h header. This structure should stay private the thermal core
code. In order to encapsulate the structure, let's add an accessor to
get the 'type' of the thermal zone.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
The thermal zone device structure is exposed to the different drivers
and obviously they access the internals while that should be
restricted to the core thermal code.
In order to self-encapsulate the thermal core code, we need to prevent
the drivers accessing directly the thermal zone structure and provide
accessor functions to deal with.
Provide an accessor to the 'devdata' structure and make use of it in
the different drivers.
No functional changes intended.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Mark Brown <broonie@kernel.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
It is slightly better to make the ACPI thermal helper functions retrieve
the trip point temperature only instead of doing the full trip point
initialization, because they are also used for updating some already
registered trip points, in which case initializing a new trip just
in order to update the temperature of an existing one is somewhat
wasteful.
Modify the ACPI thermal helpers accordingly and update their users.
No intentional functional impact.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
|
|
Add library routines to populate a generic thermal trip point
structure with data obtained by evaluating a specific object in the
ACPI Namespace.
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Co-developed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Tested-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
|
|
The set_trip_temp() callback is used when changing the trip temperature
through sysfs. As it is called with the thermal-zone-device lock held
it must not use thermal_zone_get_trip() directly or it will deadlock.
Fixes: 78c3e2429be8 ("thermal/drivers/qcom: Use generic thermal_zone_get_trip() function")
Signed-off-by: Johan Hovold <johan+linaro@kernel.org>
Link: https://lore.kernel.org/r/20221214131617.2447-2-johan+linaro@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
|
|
The thermal zone ops defines a set_trip callback where we can invoke
the backend driver to set an interrupt for the next trip point
temperature being crossed the way up or down, or setting the low level
with the hysteresis.
The ops is only called from the thermal sysfs code where the userspace
has the ability to modify a trip point characteristic.
With the effort of encapsulating the thermal framework core code,
let's create a thermal_zone_set_trip() which is the writable side of
the thermal_zone_get_trip() and put there all the ops encapsulation.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-4-daniel.lezcano@linaro.org
|
|
The thermal_zone_device_ops structure defines a set of ops family,
get_trip_temp(), get_trip_hyst(), get_trip_type(). Each of them is
returning a property of a trip point.
The result is the code is calling the ops everywhere to get a trip
point which is supposed to be defined in the backend driver. It is a
non-sense as a thermal trip can be generic and used by the backend
driver to declare its trip points.
Part of the thermal framework has been changed and all the OF thermal
drivers are using the same definition for the trip point and use a
thermal zone registration variant to pass those trip points which are
part of the thermal zone device structure.
Consequently, we can use a generic function to get the trip points
when they are stored in the thermal zone device structure.
This approach can be generalized to all the drivers and we can get rid
of the ops->get_trip_*. That will result to a much more simpler code
and make possible to rework how the thermal trip are handled in the
thermal core framework as discussed previously.
This change adds a function thermal_zone_get_trip() where we get the
thermal trip point structure which contains all the properties (type,
temp, hyst) instead of doing multiple calls to ops->get_trip_*.
That opens the door for trip point extension with more attributes. For
instance, replacing the trip points disabled bitmask with a 'disabled'
field in the structure.
Here we replace all the calls to ops->get_trip_* in the thermal core
code with a call to the thermal_zone_get_trip() function.
The thermal zone ops defines a callback to retrieve the critical
temperature. As the trip handling is being reworked, all the trip
points will be the same whatever the driver and consequently finding
the critical trip temperature will be just a loop to search for a
critical trip point type.
Provide such a generic function, so we encapsulate the ops
get_crit_temp() which can be removed when all the backend drivers are
using the generic trip points handling.
While at it, add the thermal_zone_get_num_trips() to encapsulate the
code more and reduce the grip with the thermal framework internals.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20221003092602.1323944-2-daniel.lezcano@linaro.org
|
|
In cur_state_store(), the new state of the cooling device is received
from user-space and is not validated by the thermal core but the same is
left for the individual drivers to take care of. Apart from duplicating
the code it leaves possibility for introducing bugs where a driver may
not do it right.
Lets make the thermal core check the new state itself and store the max
value in the cooling device structure.
Link: https://lore.kernel.org/all/Y0ltRJRjO7AkawvE@kili/
Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
The function thermal_zone_of_get_sensor_id() is no longer used
anywhere, remove it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20220818082316.2717095-2-daniel.lezcano@linaro.org
|
|
On one of the Chrome system, if we define more than 12 trip points,
probe for thermal sensor fails with
"int3403 thermal: probe of INTC1046:03 failed with error -22"
and throws an error as
"thermal_sys: Error: Incorrect number of thermal trips".
The thermal_zone_device_register() interface needs maximum
number of trip points supported in a zone as an argument.
This number can't exceed THERMAL_MAX_TRIPS, which is currently
set to 12. To address this issue, THERMAL_MAX_TRIPS value
has to be increased.
This interface also has an argument to specify a mask of trips
which are writable. This mask is defined as an int.
This mask sets the ceiling for increasing maximum number of
supported trips. With the current implementation, maximum number
of trips can be supported is 31.
Also, THERMAL_MAX_TRIPS macro is used in one place only.
So, remove THERMAL_MAX_TRIPS macro and compare num_trips
directly with using a macro BITS_PER_TYPE(int)-1.
Signed-off-by: Sumeet Pawnikar <sumeet.r.pawnikar@intel.com>
Reviewed-by: Andy Shevchenko <andriy.shevchenko@linux.intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
|
|
All the drivers are converted to the new OF API, remove the old OF code.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-34-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
|
|
The following changes are reworking entirely the thermal device tree
initialization. The old version is kept until the different drivers
using it are converted to the new API.
The old approach creates the different actors independently. This
approach is the source of the code duplication in the thermal OF
because a thermal zone is created but a sensor is registered
after. The thermal zones are created unconditionnaly with a fake
sensor at init time, thus forcing to provide fake ops and store all
the thermal zone related information in duplicated structures. Then
the sensor is initialized and the code looks up the thermal zone name
using the device tree. Then the sensor is associated to the thermal
zone, and the sensor specific ops are called with a second level of
indirection from the thermal zone ops.
When a sensor is removed (with a module unload), the thermal zone
stays there with the fake sensor.
The cooling device associated with a thermal zone and a trip point is
stored in a list, again duplicating information, using the node name
of the device tree to match afterwards the cooling devices.
The new approach is simpler, it creates a thermal zone when the sensor
is registered and destroys it when the sensor is removed. All the
matching between the cooling device, trip points and thermal zones are
done using the device tree, as well as bindings. The ops are no longer
specific but uses the generic ones provided by the thermal framework.
When the old code won't have any users, it can be removed and the
remaining thermal OF code will be much simpler.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220804224349.1926752-2-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
|
|
The thermal trip points are properties of a thermal zone and the
different sub systems should be able to save them in the thermal zone
structure instead of having their own definition.
Give the opportunity to the drivers to create a thermal zone with
thermal trips which will be accessible directly from the thermal core
framework.
As we added the thermal trip points structure in the thermal zone,
let's extend the thermal zone register function to have the thermal
trip structures as a parameter and store it in the 'trips' field of
the thermal zone structure.
The thermal zone contains the trip point, we can store them directly
when registering the thermal zone. That will allow another step
forward to remove the duplicate thermal zone structure we find in the
thermal_of code.
Cc: Alexandre Bailon <abailon@baylibre.com>
Cc: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220722200007.1839356-9-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
|
|
In order to use thermal trips defined in the thermal structure, rename
the 'trips' field to 'num_trips' to have the 'trips' field containing the
thermal trip points.
Cc: Alexandre Bailon <abailon@baylibre.com>
Cc: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Link: https://lore.kernel.org/r/20220722200007.1839356-8-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
|
|
The structure thermal_trip is now generic and will be usable by the
different sensor drivers in place of their own structure.
Move its definition to thermal.h to make it accessible.
Cc: Alexandre Bailon <abailon@baylibre.com>
Cc: Kevin Hilman <khilman@baylibre.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linexp.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20220722200007.1839356-5-daniel.lezcano@linexp.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
|
|
The trends DROP_FULL and RAISE_FULL are not used and were never used
in the past AFAICT. Remove these conditions as they seems to not be
handled anywhere.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20220629151012.3115773-2-daniel.lezcano@linaro.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
|
|
The sensor driver which register through thermal_of interface doesn't
have an option to get thermal zone mode change notification from
thermal core.
Add support for change_mode ops in thermal_of interface so that sensor
driver can use this ops for mode change notification.
Signed-off-by: Manaf Meethalavalappu Pallikunhi <quic_manafm@quicinc.com>
Link: https://lore.kernel.org/r/1646767586-31908-1-git-send-email-quic_manafm@quicinc.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
|
|
Fix a misspelling of the word "callbacks".
Signed-off-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/ae38372996a23bb67769e2d62ca170ae9457c4df.1626261946.git.geert+renesas@glider.be
|
|
There are two pairs of declarations for thermal_cooling_device_register()
and thermal_of_cooling_device_register(), and only one set was changed
in a recent patch, so the other one now causes a compile-time warning:
drivers/net/wireless/mediatek/mt76/mt7915/init.c: In function 'mt7915_thermal_init':
drivers/net/wireless/mediatek/mt76/mt7915/init.c:134:48: error: passing argument 1 of 'thermal_cooling_device_register' discards 'const' qualifier from pointer target type [-Werror=discarded-qualifiers]
134 | cdev = thermal_cooling_device_register(wiphy_name(wiphy), phy,
| ^~~~~~~~~~~~~~~~~
In file included from drivers/net/wireless/mediatek/mt76/mt7915/init.c:7:
include/linux/thermal.h:407:39: note: expected 'char *' but argument is of type 'const char *'
407 | thermal_cooling_device_register(char *type, void *devdata,
| ~~~~~~^~~~
Change the dummy helper functions to have the same arguments as the
normal version.
Fixes: f991de53a8ab ("thermal: make device_register's type argument const")
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Reviewed-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210722090717.1116748-1-arnd@kernel.org
|
|
thermal_notify_framework just updates for a single trip point where as
thermal_zone_device_update does other bookkeeping like updating the
temperature of the thermal zone and setting the next trip point. The only
driver that was using thermal_notify_framework was updated in the previous
patch to use thermal_zone_device_update instead. Since there are no users
for thermal_notify_framework remove it.
Signed-off-by: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20210122023406.3500424-3-thara.gopinath@linaro.org
|
|
We want to have any kind of name for the cooling devices as we do no
longer want to rely on auto-numbering. Let's replace the cooling
device's fixed array by a char pointer to be allocated dynamically
when registering the cooling device, so we don't limit the length of
the name.
Rework the error path at the same time as we have to rollback the
allocations in case of error.
Tested with a dummy device having the name:
"Llanfairpwllgwyngyllgogerychwyrndrobwllllantysiliogogogoch"
A village on the island of Anglesey (Wales), known to have the longest
name in Europe.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Tested-by: Ido Schimmel <idosch@nvidia.com>
Link: https://lore.kernel.org/r/20210314111333.16551-1-daniel.lezcano@linaro.org
|
|
The change of the cooling device state should be used by the governor
or at least by the core code, not by the drivers themselves.
Remove the API usage and move the function declaration to the internal
headers.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20210118173824.9970-1-daniel.lezcano@linaro.org
|
|
The code does no longer use the ms unit based fields to set the
delays as they are replaced by the jiffies.
Remove them and replace their user to use the jiffies version instead.
Cc: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Peter Kästle <peter@piie.net>
Acked-by: Hans de Goede <hdegoede@redhat.com>
Link: https://lore.kernel.org/r/20201216220337.839878-3-daniel.lezcano@linaro.org
|
|
The delays are stored in ms units and when the polling function is
called this delay is converted into jiffies at each call.
Instead of doing the conversion again and again, compute the jiffies
at init time and use the value directly when setting the polling.
Cc: Thara Gopinath <thara.gopinath@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Link: https://lore.kernel.org/r/20201216220337.839878-1-daniel.lezcano@linaro.org
|
|
The macro THERMAL_TRIPS_NONE is no longer used, remove it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Link: https://lore.kernel.org/r/20201214233811.485669-6-daniel.lezcano@linaro.org
|
|
The code was reorganized in 2012 with the commit 0c01ebbfd3caf1.
The main change is a loop on the trip points array and a unconditional
call to the throttle() ops of the governors for each of them even if
the trip temperature is not reached yet.
With this change, the 'forced_passive' is no longer checked in the
thermal_zone_device_update() function but in the step wise governor's
throttle() callback.
As the force_passive does no belong to the trip point array, the
thermal_zone_device_update() can not compare with the specified
passive temperature, thus does not detect the passive limit has been
crossed. Consequently, throttle() is never called and the
'forced_passive' branch is unreached.
In addition, the default processor cooling device is not automatically
bound to the thermal zone if there is not passive trip point, thus the
'forced_passive' can not operate.
If there is an active trip point, then the throttle function will be
called to mitigate at this temperature and the 'forced_passive' will
override the mitigation of the active trip point in this case but with
the default cooling device bound to the thermal zone, so usually a
fan, and that is not a passive cooling effect.
Given the regression exists since more than 8 years, nobody complained
and at the best of my knowledge there is no bug open in
https://bugzilla.kernel.org, it is reasonable to say it is unused.
Remove the 'forced_passive' related code.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Thara Gopinath <thara.gopinath@linaro.org>
Link: https://lore.kernel.org/r/20201214233811.485669-1-daniel.lezcano@linaro.org
|
|
With the removal of the notifys user in a previous patches, the ops is no
longer needed, remove it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20201210121514.25760-5-daniel.lezcano@linaro.org
|
|
Currently there is no way to the sensors to directly call an ops in
interrupt mode without calling thermal_zone_device_update assuming all
the trip points are defined.
A sensor may want to do something special if a trip point is hot or
critical.
This patch adds the critical and hot ops to the thermal zone device,
so a sensor can directly invoke them or let the thermal framework to
call the sensor specific ones.
Tested-by: Kai-Heng Feng <kai.heng.feng@canonical.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Link: https://lore.kernel.org/r/20201210121514.25760-2-daniel.lezcano@linaro.org
|
|
1. devfreq_cooling.c: The variable *tz is not used in
devfreq_cooling_get_requested_power(), devfreq_cooling_state2power()
and devfreq_cooling_power2state().
2. cpufreq_cooling.c: After 84fe2cab48590, the variable *tz is not used
anymore in cpufreq_get_requested_power(), cpufreq_state2power() and
cpufreq_power2state().
Remove the variable *tz.
Signed-off-by: zhuguangqing <zhuguangqing@xiaomi.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200914071101.13575-1-zhuguangqing83@gmail.com
|
|
This event is sent by the platform firmware to confirm that
user space thermal solution is alive. The response to this event
from the user space thermal solution is platform specific.
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200915223650.406046-3-srinivas.pandruvada@linux.intel.com
|
|
Initially the thermal framework had a very simple notification
mechanism to send generic netlink messages to the userspace.
The notification function was never called from anywhere and the
corresponding dead code was removed. It was probably a first attempt
to introduce the netlink notification.
At LPC2018, the presentation "Linux thermal: User kernel interface",
proposed to create the notifications to the userspace via a kfifo.
The advantage of the kfifo is the performance. It is usually used from
a 1:1 communication channel where a driver captures data and sends it
as fast as possible to a userspace process.
The drawback is that only one process uses the notification channel
exclusively, thus no other process is allowed to use the channel to
get temperature or notifications.
This patch defines a generic netlink API to discover the current
thermal setup and adds event notifications as well as temperature
sampling. As any genetlink protocol, it can evolve and the versioning
allows to keep the backward compatibility.
In order to prevent the user from getting flooded with data on a
single channel, there are two multicast channels, one for the
temperature sampling when the thermal zone is updated and another one
for the events, so the user can get the events only without the
thermal zone temperature sampling.
Also, a list of commands to discover the thermal setup is added and
can be extended when needed.
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200706105538.2159-3-daniel.lezcano@linaro.org
|
|
This function is not needed by drivers.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200703104354.19657-4-andrzej.p@collabora.com
|
|
set_mode() is only called when tzd's mode is about to change. Actual
setting is performed in thermal_core, in thermal_zone_device_set_mode().
The meaning of set_mode() callback is actually to notify the driver about
the mode being changed and giving the driver a chance to oppose such
change.
To better reflect the purpose of the method rename it to change_mode()
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
[for acerhdf]
Acked-by: Peter Kaestle <peter@piie.net>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-12-andrzej.p@collabora.com
|
|
Prepare for making the drivers not access tzd's private members.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
[staticize thermal_zone_device_set_mode()]
Signed-off-by: kernel test robot <lkp@intel.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-7-andrzej.p@collabora.com
|
|
get_mode() is now redundant, as the state is stored in struct
thermal_zone_device.
Consequently the "mode" attribute in sysfs can always be visible, because
it is always possible to get the mode from struct tzd.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
[for acerhdf]
Acked-by: Peter Kaestle <peter@piie.net>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-6-andrzej.p@collabora.com
|
|
Prepare for changing the place where the mode is stored: now it is in
drivers, which might or might not implement get_mode()/set_mode() methods.
A lot of cleanup can be done thanks to storing it in struct tzd. The
get_mode() methods will become redundant.
Signed-off-by: Andrzej Pietrasiewicz <andrzej.p@collabora.com>
Reviewed-by: Guenter Roeck <linux@roeck-us.net>
Reviewed-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20200629122925.21729-4-andrzej.p@collabora.com
|
|
All users of the function depends on THERMAL, no stub is
needed. Remove it.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-9-daniel.lezcano@linaro.org
|
|
All callers of the functions depends on THERMAL, it is pointless to
define stubs. Remove them.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-8-daniel.lezcano@linaro.org
|
|
The thermal framework can not be compiled as a module. The IS_ENABLED
macro is useless here and can be replaced by an ifdef.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-7-daniel.lezcano@linaro.org
|
|
The function is not used any place other than the thermal
directory. It does not make sense to export its definition in the
global header as there is no use of it.
Move the definition to the internal header and allow better
self-encapsulation.
Take the opportunity to add the parameter names to make checkpatch
happy and remove the pointless stubs.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-6-daniel.lezcano@linaro.org
|
|
The function is not used any place other than the thermal
directory. It does not make sense to export its definition in the
global header as there is no use of it.
Move the definition to the internal header and allow better
self-encapsulation.
Take the opportunity to add the parameter names to make checkpatch
happy and remove the pointless stubs.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-5-daniel.lezcano@linaro.org
|
|
The struct thermal_trip is only used by the thermal internals, it is
pointless to export the definition in the global header.
Move the structure to the thermal_core.h internal header.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-4-daniel.lezcano@linaro.org
|
|
The exported IPA functions are used by the IPA. It is pointless to
declare the functions in the thermal.h file.
For better self-encapsulation and less impact for the compilation if a
change is made on it. Move the code in the thermal core internal
header file.
As the users depends on THERMAL then it is pointless to have the stub,
remove them.
Take also the opportunity to fix checkpatch warnings/errors when
moving the code around.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-3-daniel.lezcano@linaro.org
|
|
The structure belongs to the thermal core internals but it is exported
in the include/linux/thermal.h
For better self-encapsulation and less impact for the compilation if a
change is made on it. Move the structure in the thermal core internal
header file.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-2-daniel.lezcano@linaro.org
|
|
The default governor set at compilation time is a thermal internal
business, no need to export to the global thermal header.
Move the config options to the internal header.
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Link: https://lore.kernel.org/r/20200402142747.8307-1-daniel.lezcano@linaro.org
|
