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authorParesh Bhagat <p-bhagat@ti.com>2025-07-08 14:28:37 +0530
committerVignesh Raghavendra <vigneshr@ti.com>2025-07-10 09:49:13 +0530
commit6f4b2a487352fa775bea4393d2455d334ccc97d4 (patch)
treec709d8b92463191480c364715eb2f56ab19414a2 /scripts/gdb/linux/xarray.py
parent1704b0462220beabda1ddb4b386e1295defa39fd (diff)
dt-bindings: arm: ti: Add AM62D2 SoC and Boards
The AM62D2 SoC, part of the K3 architecture, is built for high-performance DSP tasks in automotive audio, pro audio, radar, sonar, and medical imaging. It features up to four Cortex-A53 cores (1.4GHz), two Cortex-R5F cores, and a C7x DSP with 2 TOPS MMA. Key interfaces include multi-channel McASP audio, TSN-capable Gigabit Ethernet, and a range of peripherals (UART, SPI, I2C, CAN, USB, eMMC/SD, OSPI, CSI). It supports LPDDR4/DDR4, secure boot with hardware security, and low-power modes with CAN/GPIO/UART wakeup. This SoC is of part K3 AM62x family, which includes the AM62A and AM62P variants. A key distinction is that the AM62D does not include multimedia components such as the video encoder/decoder, MJPEG encoder, Vision Processing Accelerator (VPAC) for image signal processing, or the display subsystem. Additionally, the AM62D has a different pin configuration compared to the AM62A, which impacts embedded software development. This adds dt bindings for TI's AM62D2 family of devices. More details about the SoCs can be found in the Technical Reference Manual: https://www.ti.com/lit/pdf/sprujd4 Signed-off-by: Paresh Bhagat <p-bhagat@ti.com> Acked-by: Conor Dooley <conor.dooley@microchip.com> Link: https://lore.kernel.org/r/20250708085839.1498505-3-p-bhagat@ti.com Signed-off-by: Vignesh Raghavendra <vigneshr@ti.com>
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