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authorKrishna Kurapati <krishna.kurapati@oss.qualcomm.com>2025-09-07 23:44:11 +0530
committerGreg Kroah-Hartman <gregkh@linuxfoundation.org>2025-09-12 14:04:20 +0200
commit643df901f7ead35a71552a61927ad665a15aa87f (patch)
tree266cd661a703a5c99cf0ebca1e2cf64fb25c6d67 /scripts/gdb/linux/tasks.py
parent5df186e2ef11dca3fb6f0f332dc09c4ac0bed870 (diff)
usb: dwc3: core: Introduce glue callbacks for flattened implementations
In certain situations like role switching, the glue layers need to be informed of these events, so that they can take any necessary action. But in non-flattened implementations, the glue drivers have no data on when the core driver probe was successful post invoking of_platform_ populate. Now that the core driver supports flattened implementations as well, introduce vendor callbacks that can be passed on from glue to core before invoking dwc3_core_probe. Introduce callbacks to notify glue layer of role_switch and run_stop changes. These can be used by flattened implementation of Qualcomm glue layer to generate connect/disconnect events in controller during cable connect and run stop modifications by udc in device mode. Acked-by: Thinh Nguyen <Thinh.Nguyen@synopsys.com> Signed-off-by: Krishna Kurapati <krishna.kurapati@oss.qualcomm.com> Link: https://lore.kernel.org/r/20250907181412.2174616-2-krishna.kurapati@oss.qualcomm.com Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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