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authorNicolas Frattaroli <nicolas.frattaroli@collabora.com>2025-06-10 14:32:40 +0200
committerDaniel Lezcano <daniel.lezcano@linaro.org>2025-07-16 22:11:27 +0200
commit75b98a2c35319d0e8827576030e110a9c046460f (patch)
tree0e2058149607f6ac61dbdb9e48d118a7315fb9ec /scripts/lib
parentfeb69bccf5d3eb31918df86638abc82594390ba5 (diff)
dt-bindings: thermal: rockchip: document otp thermal trim
Several Rockchip SoCs, such as the RK3576, can store calibration trim data for thermal sensors in OTP cells. This capability should be documented. Such a rockchip thermal sensor may reference cell handles that store both a chip-wide trim for all the sensors, as well as cell handles for each individual sensor channel pointing to that specific sensor's trim value. Additionally, the thermal sensor may optionally reference cells which store the base in terms of degrees celsius and decicelsius that the trim is relative to. Each SoC that implements this appears to have a slightly different combination of chip-wide trim, base, base fractional part and per-channel trim, so which ones do which is documented in the bindings. Reviewed-by: Rob Herring (Arm) <robh@kernel.org> Signed-off-by: Nicolas Frattaroli <nicolas.frattaroli@collabora.com> Acked-by: Heiko Stuebner <heiko@sntech.de> Link: https://lore.kernel.org/r/20250610-rk3576-tsadc-upstream-v6-4-b6e9efbf1015@collabora.com Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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