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authorRaviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com>2025-07-11 10:25:38 +0000
committerGeorgi Djakov <djakov@kernel.org>2025-07-18 17:54:58 +0300
commita95571d8ffe2fa92bcc2af22a853170340ae1e9c (patch)
tree9c37ffdb3aead8227148476c7d0cccfbf4ee1174 /tools/perf/scripts/python
parenta8d7161d1dba668d814e66b28aef235341d7b1ed (diff)
dt-bindings: interconnect: Add EPSS L3 compatible for QCS8300 SoC
Add Epoch Subsystem (EPSS) L3 interconnect provider binding for QCS8300 SoC. As the EPSS hardware in QCS8300 and SA8775P are same, added a family-level compatible for SA877P SoC. This shared fallback compatible allows grouping of SoCs with similar hardware, reducing the need to explicitly list each variant in the driver match table. Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Link: https://lore.kernel.org/r/20250711102540.143-2-raviteja.laggyshetty@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
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