thermal: core: Drop unused bind/unbind functions and callbacks

There are no more callers of thermal_zone_bind_cooling_device() and
thermal_zone_unbind_cooling_device(), so drop them along with all of
the corresponding headers, code and documentation.

Moreover, because the .bind() and .unbind() thermal zone callbacks would
only be used when the above functions, respectively, were called, drop
them as well along with all of the code related to them.

Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Reviewed-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Huisong Li <lihuisong@huawei.com>
Reviewed-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://patch.msgid.link/4251116.1IzOArtZ34@rjwysocki.net

1 files changed, 3 insertions, 56 deletions

diff --git a/Documentation/driver-api/thermal/sysfs-api.rst b/Documentation/driver-api/thermal/sysfs-api.rst
index 15fb59a9365d..c803b89b7248 100644
--- a/Documentation/driver-api/thermal/sysfs-api.rst
+++ b/Documentation/driver-api/thermal/sysfs-api.rst
@@ -58,10 +58,9 @@ temperature) and throttle appropriate devices.
     ops:
 	thermal zone device call-backs.
 
-	.bind:
-		bind the thermal zone device with a thermal cooling device.
-	.unbind:
-		unbind the thermal zone device with a thermal cooling device.
+	.should_bind:
+		check whether or not a given cooling device should be bound to
+		a given trip point in this thermal zone.
 	.get_temp:
 		get the current temperature of the thermal zone.
 	.set_trips:
@@ -246,56 +245,6 @@ temperature) and throttle appropriate devices.
     It deletes the corresponding entry from /sys/class/thermal folder and
     unbinds itself from all the thermal zone devices using it.
 
-1.3 interface for binding a thermal zone device with a thermal cooling device
------------------------------------------------------------------------------
-
-    ::
-
-	int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
-		int trip, struct thermal_cooling_device *cdev,
-		unsigned long upper, unsigned long lower, unsigned int weight);
-
-    This interface function binds a thermal cooling device to a particular trip
-    point of a thermal zone device.
-
-    This function is usually called in the thermal zone device .bind callback.
-
-    tz:
-	  the thermal zone device
-    cdev:
-	  thermal cooling device
-    trip:
-	  indicates which trip point in this thermal zone the cooling device
-	  is associated with.
-    upper:
-	  the Maximum cooling state for this trip point.
-	  THERMAL_NO_LIMIT means no upper limit,
-	  and the cooling device can be in max_state.
-    lower:
-	  the Minimum cooling state can be used for this trip point.
-	  THERMAL_NO_LIMIT means no lower limit,
-	  and the cooling device can be in cooling state 0.
-    weight:
-	  the influence of this cooling device in this thermal
-	  zone.  See 1.4.1 below for more information.
-
-    ::
-
-	int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
-				int trip, struct thermal_cooling_device *cdev);
-
-    This interface function unbinds a thermal cooling device from a particular
-    trip point of a thermal zone device. This function is usually called in
-    the thermal zone device .unbind callback.
-
-    tz:
-	the thermal zone device
-    cdev:
-	thermal cooling device
-    trip:
-	indicates which trip point in this thermal zone the cooling device
-	is associated with.
-
 1.4 Thermal Zone Parameters
 ---------------------------
 
@@ -366,8 +315,6 @@ Thermal cooling device sys I/F, created once it's registered::
 
 Then next two dynamic attributes are created/removed in pairs. They represent
 the relationship between a thermal zone and its associated cooling device.
-They are created/removed for each successful execution of
-thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device.
 
 ::