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authorArnd Bergmann <arnd@arndb.de>2019-09-04 17:20:41 +0200
committerArnd Bergmann <arnd@arndb.de>2019-09-04 17:20:41 +0200
commit30d8bb9003f0f88f18b9b75edee0cb41505d292d (patch)
treed07b1fe82d8e4afc2d5cd4d084976cdecd5c3382 /arch/arm/boot/dts/am33xx-l4.dtsi
parentbf3176b350147f277245a4692795c33afe265782 (diff)
parent7edd00f71f4b91ca31dbfa08926495fe5e77aab4 (diff)
Merge tag 'omap-for-v5.4/ti-sysc-part2-signed' of git://git.kernel.org/pub/scm/linux/kernel/git/tmlind/linux-omap into arm/late
more ti-sysc driver changes for omap variants for v5.4 Few changes mostly to deal with sgx SoC glue quirk for omap36xx that is needed for the related sgx SoC glue dts branch. The other changes are to simplify sysc_check_one_child() sysc_check_children() to be void functions, and detect d2d module when debugging is enabled. * tag 'omap-for-v5.4/ti-sysc-part2-signed' of git://git.kernel.org/pub/scm/linux/kernel/git/tmlind/linux-omap: bus: ti-sysc: Detect d2d when debug is enabled bus: ti-sysc: Add module enable quirk for SGX on omap36xx bus: ti-sysc: Change return types of functions Link: https://lore.kernel.org/r/pull-1567016893-318461@atomide.com-2 Signed-off-by: Arnd Bergmann <arnd@arndb.de>
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