Age | Commit message (Collapse) | Author |
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Use `\t(\{ ?\},|\{\}|\{\s*/\*.*\*/\s*\},?)$` regex to find and replace
the array sentinel in all IIO drivers to the same style.
For some time, we've been trying to consistently use `{ }` (no trailing
comma, no comment, one space between braces) for array sentinels in the
IIO subsystem. Still nearly 50% of existing code uses a different style.
To save reviewers from having to request this trivial change as
frequently, let's normalize the style in all existing IIO drivers.
At least when code is copy/pasted to new drivers, the style will be
consistent.
Signed-off-by: David Lechner <dlechner@baylibre.com>
Reviewed-by: Andy Shevchenko <andy@kernel.org>
Link: https://patch.msgid.link/20250411-iio-sentinel-normalization-v1-1-d293de3e3d93@baylibre.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
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write_event_config callback use an int for state, but it is actually a
boolean. iio_ev_state_store is actually using kstrtobool to check user
input, then gives the converted boolean value to write_event_config.
Fix signature and update all iio drivers to use the new signature.
This patch has been partially written using coccinelle with the
following script:
$ cat iio-bool.cocci
// Options: --all-includes
virtual patch
@c1@
identifier iioinfo;
identifier wecfunc;
@@
static const struct iio_info iioinfo = {
...,
.write_event_config =
(
wecfunc
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&wecfunc
),
...,
};
@@
identifier c1.wecfunc;
identifier indio_dev, chan, type, dir, state;
@@
int wecfunc(struct iio_dev *indio_dev, const struct iio_chan_spec *chan, enum iio_event_type type, enum iio_event_direction dir,
-int
+bool
state) {
...
}
make coccicheck MODE=patch COCCI=iio-bool.cocci M=drivers/iio
Unfortunately, this script didn't match all files:
* all write_event_config callbacks using iio_device_claim_direct_scoped
were not detected and not patched.
* all files that do not assign and declare the write_event_config
callback in the same file.
iio.h was also manually updated.
The patch was build tested using allmodconfig config.
cc: Julia Lawall <julia.lawall@inria.fr>
Signed-off-by: Julien Stephan <jstephan@baylibre.com>
Link: https://patch.msgid.link/20241031-iio-fix-write-event-config-signature-v2-7-2bcacbb517a2@baylibre.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
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The device has four programmable temperature alert outputs which can be
used to monitor hot or cold-junction temperatures and detect falling and
rising temperatures. It supports up to 255 degree celsius programmable
hysteresis. Each alert can be individually configured by setting following
options in the associated alert configuration register:
- monitor hot or cold junction temperature
- monitor rising or falling temperature
- set comparator or interrupt mode
- set output polarity
- enable alert
This patch binds alert outputs to iio events:
- alert1: hot junction, rising temperature
- alert2: hot junction, falling temperature
- alert3: cold junction, rising temperature
- alert4: cold junction, falling temperature
All outputs are set in comparator mode and polarity depends on interrupt
configuration.
Signed-off-by: Dimitri Fedrau <dima.fedrau@gmail.com>
Link: https://lore.kernel.org/r/20240604133639.959682-1-dima.fedrau@gmail.com
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
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Temperature is stored as 16bit value in two's complement format. Current
implementation ignores the sign bit. Make it aware of the sign bit by
using sign_extend32.
Fixes: 3f6b9598b6df ("iio: temperature: Add MCP9600 thermocouple EMF converter")
Signed-off-by: Dimitri Fedrau <dima.fedrau@gmail.com>
Reviewed-by: Marcelo Schmitt <marcelo.schmitt1@gmail.com>
Tested-by: Andrew Hepp <andrew.hepp@ahepp.dev>
Link: https://lore.kernel.org/r/20240424185913.1177127-1-dima.fedrau@gmail.com
Cc: <Stable@vger.kernel.org>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
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Add support for the MCP9600 thermocouple electromotive force converter. The sensor has integrated cold junction compensation and a typical accuracy of 0.5 degrees Celsius. The driver supports a resolution of 0.0625 degrees Celsius.
Datasheet: https://ww1.microchip.com/downloads/en/DeviceDoc/MCP960X-Data-Sheet-20005426.pdf
Signed-off-by: Andrew Hepp <andrew.hepp@ahepp.dev>
Link: https://lore.kernel.org/r/20231025233153.5454-2-andrew.hepp@ahepp.dev
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
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